120420 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of organic surfaces, e.g. resins; Roughening, e.g. by etching using organic liquids
ELECTRICALLY CONDUCTIVE METAL-COATED FIBERS, CONTINUOUS PROCESS FOR PREPARATION THEREOF, AND USE THEREOF
#2Methods of reducing the adhesion of a maskant
#3PRETREATING LIQUID FOR ELECTROLESS PLATING TO BE USED DURING REDUCTION TREATMENT, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD
#4Methods of reducing the adhesion of a maskant
#5NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF HIGH SPEED IO ROUTING IN PACKAGE SUBSTRATE
#6Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
#7Process for pretreatment of plastic surfaces for metallization
#8PROCESS FOR METALLIZING PLASTIC SURFACES
#9ELECTRICALLY CONDUCTIVE METAL-COATED FIBERS, CONTINUOUS PROCESS FOR PREPARATION THEREOF, AND USE THEREOF
#10Enhanced release compression shoe for use with concrete product forming machines
#11ELECTRICALLY CONDUCTIVE METAL-COATED FIBERS, CONTINUOUS PROCESS FOR PREPARATION THEREOF, AND USE THEREOF
#12Method for production of electroless plating material
#13MANUFACTURING PROCESS FOR WORKPIECE FOR ELECTROLESS PLATING
#14CHROME-FREE METHOD OF CONDITIONING AND ETCHING OF A THERMOPLASTIC SUBSTRATE FOR METAL PLATING
#15Conductive substance-adsorbing resin film, method for producing conductive substance-adsorbing resin film, metal layer-coated resin film using the same, and method for producing metal layer-coated resin film
#16Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same