120426 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Coating with metals; Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Sub-classes:METHOD FOR PROVIDING A CONDUCTIVE SURFACE ON A NON-CONDUCTIVE POLYMERIC SURFACE
#2USE OF AN AQUEOUS ALKALINE COMPOSITION FOR THE ELECTROLESS DEPOSITION OF A METAL OR METAL ALLOY ON A METAL SURFACE OF A SUBSTRATE
#3Yeast (S. cerevisiae) sheathing through electrochemical discharge of Cobalt air battery
#4PLATING METHOD AND PLATING APPARATUS
#5A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIBRES CONTAINING SUBSTRATE FOR METALLIZATION
#6ELECTROLESS NICKEL OR COBALT PLATING SOLUTION
#7ELECTROLESS PLATING METHODS AND RELATED ARTICLES
#8Composite PTFE plating
#9NICKEL-BORON COATINGS FOR HOUSINGS AND ENCLOSURES
#10Plating stack
#11PINION SHAFT, WATCH MECHANISM, WATCH OR MEASUREMENT DEVICE WITHOUT A MAGNETIC SIGNATURE
#12Electroless Plating Process and Two-Layer Plating Film
#13METALLIC COATED SUBSTRATES
#14METHOD FOR FABRICATING ELECTRONIC COMPONENT
#15Electroless Co—W plating film
#16PLATING BATH FOR THE ELECTROLESS PLATING OF A SUBSTRATE
#17Laminate
#18METHOD FOR ADHERING NOBLE METAL TO CARBON STEEL MEMBER OF NUCLEAR POWER PLANT AND METHOD FOR PREVENTING ADHESION OF RADIONUCLIDES TO CARBON STEEL MEMBER OF NUCLEAR POWER PLANT
#19Method for electroless nickel deposition onto copper without activation with palladium
#20Method for forming nickel plated graphene hollow sphere
#21Methods for forming metal electrodes concurrently on silicon regions of opposite polarity
#22Method for forming metal plating film
#23Magnetic particles, methods of making, and uses thereof
#24Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
#25PROCESS FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID-PHASE DEPOSITION
#26COMPOSITION FOR PRETREATMENT FOR ELECTROLESS PLATING, PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD
#27NICKEL ALLOY PLATING
#28Electroless plating of objects with carbon-based material
#29Plating method and recording medium
#30Device for electroless metallization of a target surface of at least one workpiece
#31HEAT-RESISTANT POWER MODULE SUBSTRATE, HEAT-RESISTANT PLATING FILM AND PLATING SOLUTION
#32ELECTROLESS NICKEL STRIKE PLATING SOLUTION AND METHOD FOR FORMING NICKEL FILM
#33Chromium-free plating-on-plastic etch
#34Electroless plating process
#35METHOD OF FORMING MATERIAL FOR A CIRCUIT USING NICKEL AND PHOSPHOROUS
#36PLATED OBJECT AND METHOD OF FORMING THE SAME
#37POLYMER BLEND FOR METAL PLATING
#38Manufacturing a package using plateable encapsulant
#39ELECTRICALLY-CONDUCTIVE PROPPANT AND METHODS FOR MAKING AND USING SAME
#40Composition for catalyst-free electroless plating and method for electroless plating using the same
#41Plating method, plating apparatus and recording medium
#42Transistor manufacturing method
#43Thermal spraying of ceramic materials comprising metal or metal alloy coating
#44Electrode for battery and fabrication method thereof
#45HEAT-RESISTANT POWER MODULE SUBSTRATE, HEAT-RESISTANT PLATING FILM AND PLATING SOLUTION
#46Method for metallising a porous structure made of carbon material
#47Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrate
#48MULTILAYER COMPOSITIONS
#49Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
#50PINION SHAFT, WATCH MECHANISM, WATCH OR MEASUREMENT DEVICE WITHOUT A MAGNETIC SIGNATURE
#51Means for carrying out electroless metal deposition with atomic sub-monolayer precision
#52Semiconductor devices comprising nickel— and copper—containing interconnects
#53METHOD OF FORMING METAL PATTERN
#54Plating bath solutions
#55Process for pretreatment of plastic surfaces for metallization
#56PROCESS FOR METALLIZING PLASTIC SURFACES
#57Pretreatment of iron-based substrates for electroless plating
#58Corrosion resistant metal substrate
#59Additively manufactured high temperature objects
#60Plating apparatus, plating method, and recording medium
#61Semiconductor devices comprising nickel- and copper-containing interconnects
#62Semiconductor package with plateable encapsulant and a method for manufacturing the same
#63Electrically conductive proppant and methods for energizing and detecting same in a single wellbore
#64Aluminum plate and method for manufacturing aluminum plate
#65SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
#66Method for manufacturing laminate containing patterned layers to be plated, method for manufacturing metal layer-containing laminate, touch panel sensor, touch panel, laminate containing patterned layers to be plated, and metal layer-containing laminate
#67ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRAZINE DERIVATIVE CONTAINING CATALYSTS
#68Metal nanowire thin-films
#69Method of electroless plating using a solution with at least two borane containing reducing agents
#70METHOD FOR NO-SILANE ELECTROLESS METAL DEPOSITION USING HIGH ADHESIVE CATALYST AND PRODUCT THEREFROM
#71POLYMER BLEND FOR METAL PLATING
#72Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts
#73Process for the synthesis of nanostructured metallic hollow particles and nanostructured metallic hollow particles
#74Metallic coating and a method for producing the same
#75Plating method and recording medium
#76Stable catalysts for electroless metallization
#77ELECTROLESS PLATING METHOD AND ELECTROLESS PLATING FILM
#78Gold plate coated material
#79Wiring pattern manufacturing method and transistor manufacturing method
#80Adhesion promoting process for metallisation of substrate surfaces
#81Electroless nickel plating solution, electroless nickel plating method using same, and flexible nickel plated layer formed by using same
#82Electrically-conductive proppant and methods for making and using same
#83Forming catalytic sites from reducible silver complexes
#84FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS
#85Method for copper plating through silicon vias using wet wafer back contact
#86METHOD FOR FABRICATING METAL AND OXIDE HYBRID-COATED NANOCARBON
#87Composite Electroless Nickel Plating
#88Method for forming a metal silicide using a solution containing gold ions and fluorine ions
#89Electroless plating solution with at least two borane containing reducing agents
#90MANUFACTURING METHOD OF TEST STRIP
#91ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
#92PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
#93Stable tin free catalysts for electroless metallization
#94Hydriding of metallic substrates
#95Use of titania precursor composition pattern
#96Beta-amino acid comprising plating formulation
#97Preparation of Modified Organic Core Materials and Metallic Shell Composite Microspheres
#98Alkaline pretreatment for electroplating
#99Plating bath for electroless deposition of nickel layers
#100Process of making non-metallic nano/micro particles coated with metal, and applications thereof
#101Manufacturing of high resolution conductive patterns using organometallic ink and banded anilox rolls
#102Polishing and electroless nickel compositions, kits, and methods
#103Electroless nickel plating solution and method
#104SPINDLE MOTOR AND HARD DISK DRIVE
#105Method and composition for electroless nickel and cobalt deposition
#106Stable catalysts for electroless metallization
#107Composite PTFE plating
#108Methods of forming interconnects and semiconductor structures
#109METHOD OF FORMING METAL THIN FILM USING ELECTROLESS DEPOSITION AND THIN FILM DEVICE FABRICATED USING THE METHOD
#110Method for direct metallization of non-conductive substrates
#111Method for depositing a nickel-metal layer
#112High temperature resistant silver coated substrates
#113Aluminum article
#114Coating and electronic component
#115METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE
#116Production method of base plate for disk drive, base plate for disk drive, and drive therewith
#117Composite PTFE plating
#118Electroless plating bath composition and method of plating particulate matter
#119DISPLACEMENT GOLD PLATING SOLUTION AND METHOD FOR FORMING CONNECTING PORTION
#120FILM FORMATION METHOD AND STORAGE MEDIUM
#121Method for the deposition of a metal layer comprising a beta-amino acid
#122METHOD OF PROVIDING SOLAR CELL ELECTROLESS PLATTING AND AN ACTIVATOR USED THEREIN
#123Method for Treating Metal Surfaces
#124Method for Treating Metal Surfaces
#125Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
#126Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
#127Method of reducing magnetite formation
#128ELECTROLESS PLATING PRODUCTION OF NICKEL AND COBALT STRUCTURES
#129COATED SURGICAL AND DENTAL IMPLEMENTS AND IMPLANTS WITH SUPERIOR HEAT DISSIPATION AND TOUGHNESS
#130METHOD OF PROVIDING SOLAR CELL ELECTRODE BY ELECTROLESS PLATING AND AN ACTIVATOR USED THEREIN
#131Metal plating additive, and method for plating substrates and products therefrom
#132ELECTROLESS PLATING SOLUTION FOR PROVIDING SOLAR CELL ELECTRODE
#133Metal nanowire thin-films
#134Electroless deposition solutions and process control
#135Methods of selectively growing nickel-containing materials
#136Electroless deposition of cobalt alloys
#137ELECTROLESS PROCESS FOR DEPOSITING A METAL ON A NON-CATALYTIC SUBSTRATE
#138WEAR RESISTANCE REINFORCING METHOD AND SLIDING STRUCTURE
#139Resin composition containing catalyst precursor for electroless plating in forming electro-magnetic shielding layer, method of forming metallic pattern using the same, and metallic pattern formed by the same method
#140Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof
#141Electroless plating bath composition and method of use
#142Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure
#143Electroless deposition process on a silicon contact
#144Non-electrolytic method for metallizing a substrate by the reduction of metallic salt(s) and the spraying of aerosol(s)
#145Non-Metallic Nano/Micro Particles Coated with Metal, Process and Applications Thereof
#146Metallization process for making fuser members
#147Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
#148Methods of forming interconnects in a semiconductor structure
#149Printed wiring board and its manufacturing method
#150Method for Preparing Electroconductive Particles with Improved Dispersion and Adherence
#151Catalysts for Fuel Cell Applications Using Electroless Deposition
#152Electroless nickel plating liquid
#153Surface-Treated Steel Sheet for Battery Cases, a Battery Case and a Battery Using It
#154Electroless plating production of nickel and cobalt structures
#155SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPOSITION FOR THIN CO-BASED AND NI-BASED ALLOYS
#156Stabilization and Performance of Autocatalytic Electroless Processes
#157HYBRID ELECTRO-DEPOSITION OF SOFT MAGNETIC COBALT ALLOY FILMS
#158METHOD OF FORMING METAL PATTERN, AND METAL SALT MIXTURE
#159Electroless deposition of cobalt alloys
#160Methods of forming conductive interconnects
#161Nickel Coating
#162Nickel-Coated Copper Powder and Method for Producing the Nickel-Coated Copper Powder
#163Nodular nickel boron coating
#164Printed wiring board and its manufacturing method
#165Method of forming an atomic layer thin film out of the liquid phase
#166Method of manufacturing interconnect substrate
#167Method of electrolytically depositing materials in a pattern directed by surfactant distribution
#168Cobalt-based alloy electroless plating solution and electroless plating method using the same
#169Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
#170Process for making a metal seed layer
#171Process for low resistance metal cap
#172Defectivity and process control of electroless deposition in microelectronics applications
#173Defectivity and process control of electroless deposition in microelectronics applications
#174Defectivity and process control of electroless deposition in microelectronics applications
#175Defectivity and process control of electroless deposition in microelectronics applications
#176Selective activation of aluminum, copper, and tungsten structures
#177Electroless plating bath composition and method of use
#178Cobalt electroless plating in microelectronic devices
#179Electroless deposition process on a silicon contact
#180Electroless deposition processes and compositions for forming interconnects
#181In-situ silicidation metallization process
#182Contact metallization scheme using a barrier layer over a silicide layer
#183Electroless deposition process on a silicide contact
#184Method for manufacturing metallic microstructure
#185Nickel coating
#186Cobalt self-initiated electroless via fill for stacked memory cells
#187Method of fabricating a magnetic tag
#188Metal plating structure and method for production thereof
#189Cobalt and nickel electroless plating in microelectronic devices
#190Methods to deposit metal alloy barrier layers
#191Selective nickel plating of aluminum, copper, and tungsten structures
#192Electroless plating with nanometer particles
#193Electroless plating with nanometer particles
#194Methods of forming conductive interconnects, and methods of depositing nickel
#195Multiple stage electroless deposition of a metal layer
#196Multiple stage electroless deposition of a metal layer
#197Self-activated electroless metal deposition
#198Electroless cobalt alloy deposition process
#199Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board
#200Method to fabricate amorphous electroless metal layers
#201Multiple stage electroless deposition of a metal layer
#202Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
#203Method of electrolytically depositing materials in a pattern directed by surfactant distribution