120428 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Coating with metals Coating with copper
Stable catalysts for electroless metallization
#302Stable catalyst for electroless metallization
#303Stable tin free catalysts for electroless metallization
#304Plating catalyst and method
#305Seeding method for deposit of thin selective membrane layers
#306Electroless copper deposition
#307Net-shape structure with micro-truss core
#308Method for improving plating on non-conductive substrates
#309Production method of base plate for disk drive, base plate for disk drive, and drive therewith
#310Method for the deposition of a metal layer comprising a beta-amino acid
#311METHODS FOR METAL PLATING AND RELATED DEVICES
#312Method for electroless plating of tin and tin alloys
#313Device package and methods for the fabrication thereof
#314Process for coating a surface of a substrate made of nonmetallic material with a metal layer
#315Method for improving plating on non-conductive substrates
#316ELECTROLESS COPPER PLATING METHOD, PRINTED WIRING BOARD, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE
#317Adhesiveless copper clad laminates and method for manufacturing thereof
#318Methods for multi-step copper plating on a continuous ruthenium film in recessed features
#319Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle
#320Apparatus for Applying a Plating Solution for Electroless Deposition
#321CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME
#322Preparation of a polymer article for selective metallization
#323PROCESS FOR PRODUCING METAL CLAD LAMINATE
#324Metallization on a surface and in through-holes of a substrate and a catalyst used therein
#325Cap metal forming method
#326Material for contact components or battery components, and battery using the same
#327Electroless deposition chemical system limiting strongly adsorbed species
#328Material for planting and use thereof
#329PLASTIC HOUSING AND METHOD FOR MAKING THE SAME
#330Unsupported palladium alloy membranes and methods of making same
#331Metal pattern forming method
#332Solution, component for plating, insulating sheet, laminate, and printed circuit board
#333Method for Metallizing Liquid Crystal and Polymer
#334Nanoporous thin films and multi-functional layers via spatially organized polymers
#335Spontaneous copper seed deposition process for metal interconnects
#336METHODS FOR ELECTROLESS PLATING OF METAL TRACES ON A SUBSTRATE AND DEVICES AND SYSTEMS THEREOF
#337Methods of patterning a deposit metal on a substrate
#338Heat Spreading Member And Manufacturing Method Thereof
#339Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof
#340Integration of a variable thickness copper seed layer in copper metallization
#341METHOD OF MANUFACTURING METAL FILM PATTERN FORMING BODY
#342Method for barrier interface preparation of copper interconnect
#343Electroless plating method for resin surfaces
#344Formaldehyde free electroless copper compositions
#345Plating process
#346Method of forming a conducting layer on a conducting and non-conducting substrate
#347Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate
#348Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them
#349Method of manufacturing polymer member and polymer member
#350Apparatus for applying a plating solution for electroless deposition
#351Plating solution for electroless deposition of copper
#352TECHNIQUE FOR DEPOSITING METALLIC FILMS USING ION IMPLANTATION SURFACE MODIFICATION FOR CATALYSIS OF ELECTROLESS DEPOSITION
#353Method for fabricating conductive blind via of circuit substrate
#354Apparatus for reduction of defects in wet processed layers
#355Method for manufacturing copper wires on substrate of flat panel display device
#356Method for forming plated coating, electromagnetic shielding member, and housing
#357SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING
#358Method of forming metal on a substrate using a Ruthenium-based catalyst
#359Process for electroless copper deposition
#360Electroless deposition processes and compositions for forming interconnects
#361Composite electroless plating
#362In-situ silicidation metallization process
#363Contact metallization scheme using a barrier layer over a silicide layer
#364Substrate plating method and apparatus
#365Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
#366Method for copper-plating or bronze-plating an object and liquid mixtures therefor
#367Method for the surface activation on the metalization of electronic devices
#368Process for fabricating a carbon nanofiber/Cu composite powder by electroless Cu plating
#369Method of making multi-layer electronic components with plated terminations
#370Catalyst ink for three-dimensional conductive constructs
#371Printing an electrical device using flexographic plate with protective features
#372Shielding coating for selective metallization
#373Shielding coating for selective metallization