120430 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Coating with metals; Coating with copper using reducing agents Formaldehyde
PLATING SOLUTION FOR HIGH RATE ELECTROLESS DEPOSITION OF COPPER
#2DUAL CHANNEL FLOW PLATE FOR WET PROCESSING
#3METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMICONDUCTORS
#4Additive Solution-Processed Structural Colors
#5CORE-SHELL NANOWIRE ELECTRODES AND METHODS OF MAKING THE SAME
#6Additive Solution-Processed Structural Colors
#7Method for Manufacturing Conductive Pattern-Provided Structure
#8METHODS FOR TREATING METAL NANOCRYSTALS AND FOR FORMING BULK NANOSTRUCTURED METAL ALLOYS
#9NOVEL METHODOLOGY FOR COATING NON-CONDUCTING ARTICLES WITH BROAD-SPECTRUM ANTIMICROBIAL ELECTROLESS PLATING LAYERS
#10High Elongation Electroless Copper Process
#11Reduced visibility conductive micro mesh touch sensor
#12ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION
#13Device for manufacturing hybrid metal foams
#14Metal-plated carbon material and manufacturing method thereof
#15Method for monitoring the total amount of sulphur containing compounds in a metal plating bath
#16Shielded cables
#17ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
#18ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
#19Method for formation of electro-conductive traces on polymeric article surface
#20Selectively Plated Rolls Of Materials And Related Methods
#21Electrode for battery and fabrication method thereof
#22ELECTRIC CIRCUIT INCLUDING A FLEXIBLE CONDUCTOR
#23Polymer hollow particle, a method of preparing the same, and composite comprising the polymer hollow particle
#24Method of manufacturing hybrid metal foams
#25Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling
#26Silver-containing precursor and product articles containing cellulosic polymers
#27Conductive member
#28Selectively plated rolls of materials and related methods
#29Electroless copper plating compositions
#30Composition for Preparation of Plating Base and Plating Base Thereof
#31Electrode-forming composition
#32Method for electromagnetic shielding and thermal management of active components
#33Plating bath compositions for electroless plating of metals and metal alloys
#34Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
#35Composition for forming conductive pattern by irradiation of electromagnetic waves, method for forming conductive pattern using same, and resin structure having conductive pattern
#36Composition for forming conductive pattern and resin structure having conductive pattern
#37ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS
#38Composition for forming conductive pattern and resin structure having conductive pattern
#39ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS
#40ELECTROLESS PLATING METHOD AND ELECTROLESS PLATING FILM
#41Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#42Electrochemical process for the preparation of lead foam
#43ELECTROLESS COPPER PLATING SOLUTION
#44NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
#45Patterning continuous webs with protected electrically-conductive grids
#46Composition for forming conductive pattern, method for forming conductive pattern using the same, and resin components having conductive pattern thereon
#47Polymer articles, ink compositions, and methods for selectively metalizing polymer articles
#48Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
#49Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#50Non-aqueous metal catalytic composition with oxyazinium photoreducing agent
#51Forming catalytic sites from reducible silver complexes
#52Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#53Electroless copper plating solution
#54Method for manufacturing multilayer wiring substrate
#55Use of titania precursor composition pattern
#56Method for manufacture of fine line circuitry
#57METHOD OF FORMING A CONDUCTIVE IMAGE USING HIGH SPEED ELECTROLESS PLATING
#58Copper plating solution and method for preparing the same
#59Three-dimensional copper nanostructure and fabrication method thereof
#60Method of manufacturing porous metal foam
#61Method for producing a resin substrate having a metal film pattern formed thereon
#62Plating catalyst and method
#63Plating catalyst and method
#64Monolithic electronic component and method for manufacturing monolithic electronic component
#65Process for the surface-modification of flyash and industrial applications thereof
#66Formation of solid layers on substrates
#67Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface
#68METHOD FOR PREPARING A METALLIZED POLYMER SUBSTRATE
#69Oil gallery piston with improved thermal conductivity
#70Plating catalyst and method
#71Plating catalyst and method
#72Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
#73BACK ELECTRODE-TYPE SOLAR CELL AND METHOD OF MANUFACTURING THE SAME
#74High permeance sulfur tolerant Pd/Cu alloy membranes
#75Resin Plating Method Using Graphene Thin Layer
#76SURFACE METALLIZING METHOD, METHOD FOR PREPARING PLASTIC ARTICLE AND PLASTIC ARTICLE MADE THEREFROM
#77PLATING CATALYST LIQUID, PLATING METHOD, AND METHOD FOR PRODUCING LAMINATE HAVING METAL FILM
#78Method of preparing low resistance metal line, patterned metal line structure, and display device using the same
#79METHODS FOR PREPARING METAL FILM-CARRYING SUBSTRATES, METAL FILM-CARRYING SUBSTRATES, METHODS FOR PREPARING METAL PATTERN MATERIALS, AND METAL PATTERN MATERIALS
#80Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle
#81Copper deposition for filling features in manufacture of microelectronic devices
#82PROCESS FOR PREPARING A MOULDED PRODUCT
#83METHOD FOR FORMING GRAFT POLYMER PATTERN AND METHOD FOR FORMING ELECTRICALLY CONDUCTIVE PATTERN
#84ELECTROLESS PROCESS FOR DEPOSITING A METAL ON A NON-CATALYTIC SUBSTRATE
#85PROCESS FOR THE PREPARATION OF LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL, LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL AND FINE PARTICLE HAVING EXTREMELY-THIN NOBLE METAL FILM
#86Monolithic electronic component and method for manufacturing monolithic electronic component
#87Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
#88METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE
#89Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
#90INK, METHOD OF FORMING ELECTRICAL TRACES USING THE SAME AND CIRCUIT BOARD
#91INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME
#92INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME
#93Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate
#94Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement
#95Printed wiring board and its manufacturing method
#96Material for forming electroless plate and method for forming electroless plate using the same
#97Metallised parts made from plastic material
#98Method of electrolessly depositing metal on the walls of through-holes
#99Metal deposition
#100METHOD OF PREPARING LOW RESISTANCE METAL LINE, PATTERNED METAL LINE STRUCTURE, AND DISPLAY DEVICE USING THE SAME
#101Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same
#102Plastic Conductive Particles and Manufacturing Method Thereof
#103CATALYTIC TREATMENT METHOD, ELECTROLESS PLATING METHOD, AND METHOD FOR FORMING CIRCUIT USING ELECTROLESS PLATING
#104PLATING SUBSTRATE, ELECTROLESS PLATING METHOD, AND CIRCUIT FORMING METHOD USING THE SAME
#105Printed wiring board and its manufacturing method
#106RADIATION ABSORPTIVE COMPOSITES AND METHODS FOR PRODUCTION
#107Microfabrication using patterned topography and self-assembled monolayers
#108Electroless copper plating solution and electroless copper plating method
#109Methttod for producing metal conductors on a substrate
#110Preparation of solid oxide fuel cell electrodes by electrodeposition
#111Method for manufacturing metallic microstructure
#112Method for preparing copper interconnectors of an ULSI
#113Conductive metal plated polyimide substrate and process for manufacturing the same
#114Optical filter for image display devices and manufacturing method thereof
#115Microfabrication using patterned topography and self-assembled monolayers
#116Ink-jet printing of coupling agents for trace or circuit deposition templating
#117Plating substrate, electroless plating method, and circuit forming method using the same
#118Metallised parts made from plastic material
#119Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#120Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material
#121Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern
#122Complexing agent for treating metallic and plastic surfaces
#123Method of forming metal pattern having low resistivity
#124Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#125Electromagnetic-shielding transparent window member and method for producing the same
#126Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#127Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#128Formation of solid layers on substrates
#129Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same
#130Stabilizer for electroless copper plating solution
#131Electroless deposition methods and systems