120433 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating Coating with alloys
Sub-classes:ELECTROLESS PLATING SOLUTION
#2FLEXIBLE COPPER CLAD LAMINATE
#3FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLUDING PLATING PATTERN LAYER FORMED THEREBY
#4COSMETIC FINISH FOR ALUMINUM ALLOYS
#5APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS
#6Electroless Plating Process and Two-Layer Plating Film
#7METALLIC COATED SUBSTRATES
#8Electroless Co—W plating film
#9TIN PLATING BATH AND A METHOD FOR DEPOSITING TIN OR TIN ALLOY ONTO A SURFACE OF A SUBSTRATE
#10Electroless copper or copper alloy plating bath and method for plating
#11Cladded metal interconnects
#12A METHOD OF ELECTROLESS DEPOSITION OF PLATINUM GROUP METALS AND THEIR ALLOYS AND A PLATING BATH USED THEREIN
#13Fuel distribution pipe
#14Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
#15Controlled method for applying coating materials to complex heat transfer surfaces
#16Method of enhancing corrosion resistance of oxidizable materials and components made therefrom
#17Method for making composite structure with porous metal
#18Low-alloy and corrosion-resistant steel for vehicle, having improved corrosion resistance under corrosive environment, and preparation method thereof
#19Coated optical fibres having improved features
#20CHEMICAL CONVERSION-TREATED STEEL PIPE
#21Method for producing metal-plated stainless material
#22PZT amorphous alloy plating solution and method for plating a PZT amorphous alloy using the same
#23Method of producing hot-dip Zn alloy-plated steel sheet
#24Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device
#25ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES
#26ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES
#27ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES
#28PRE-COATED SHIELD USING IN VHF-RF PVD CHAMBERS
#29Metal nanowire thin-films
#30Arc ablation-resistant tungsten alloy switch contact and preparation method thereof
#31Arc-ablation resistant switch contact and preparation method thereof
#32Chemical conversion-treated steel sheet and method for producing same, and chemical conversion treatment solution
#33Plated terminations
#34Magnet electroplating
#35Metallic coating and a method for producing the same
#36Blister packages
#37Metal plate coated stainless material and method of producing metal plate coated stainless material
#38Stable catalysts for electroless metallization
#39HOT-DIP ZN-ALLOY-PLATED STEEL SHEET AND METHOD FOR PRODUCING SAME
#40Gold plate coated material
#41Method of manufacturing an electrode for an energy storage device
#42Plated terminations
#43Palladium plate coated material and method of producing palladium plate coated material
#44Method for manufacturing main body of faucet
#45Methods of coating substrates with composite coatings of diamond nanoparticles and metal
#46Tin-based solder composition with low void characteristic
#47Joining method and joining system
#48RESIN ARTICLE HAVING PLATING LAYER AND METHOD OF MANUFACTURING THE SAME
#49Phosphate solution for zinc or zinc-based alloy plated steel sheet, and zinc or zinc-based alloy plated steel sheet using the same
#50Making thin-film multi-layer micro-wire structure
#51Cage for rolling bearing and rolling bearing
#52Method for forming metal particle layer and light emitting device fabricated using metal particle layer formed by the method
#53Method for manufacturing product with bright surface
#54ELECTROLESS PLATING METHOD, ELECTROLESS PLATING APPARATUS AND STORAGE MEDIUM
#55CORROSION-RESISTANT ALLOY COATING FILM FOR METAL MATERIALS AND METHOD FOR FORMING SAME
#56Liquid deposition composition and process for forming metal therefrom
#57Beta-amino acid comprising plating formulation
#58Pre-treatment method for plating and storage medium
#59Wiring board and method of manufacturing wiring board
#60Method for processing resin product and resin product
#61Electromagnetic wave penetrative metal film, manufacturing method of electromagnetic wave penetrative metal film, and radome for vehicle-mounted radar devices
#62Stable catalysts for electroless metallization
#63Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
#64Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
#65Plating bath and method
#66ELECTROLESS COPPER ALLOY CAPPING
#67Plated terminations
#68High temperature resistant silver coated substrates
#69Method of preparing a palladium-silver alloy gas separation membrane system
#70Method for the deposition of a metal layer comprising a beta-amino acid
#71Electroless deposition from non-aqueous solutions
#72Solutions and methods for metal deposition
#73Plating solution for forming tin alloy and method of forming tin alloy film using the same
#74Particle-Beam Induced Processing Using Liquid Reactants
#75Erosion and corrosion resistant coating system for compressor
#76Metal nanowire thin-films
#77Immersion tin silver plating in electronics manufacture
#78METALLIZATION OF DIELECTRICS
#79COMPOSITE MATERIAL AND METHOD OF MANUFACTURING THE SAME
#80Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
#81Direct growth of metal nanoplates on semiconductor substrates
#82Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell
#83Electroless deposition from non-aqueous solutions
#84METHOD FOR COATING SUBSTRATES CONTAINING ANTIMONY COMPOUNDS WITH TIN AND TIN ALLOYS
#85Reagent activator for electroless plating
#86Copper-tin-oxygen alloy plating
#87Semiconductor constructions comprising a layer of metal over a substrate
#88Tin-Based Plating Film and Method for Forming the Same
#89PLATING SUBSTRATE, ELECTROLESS PLATING METHOD, AND CIRCUIT FORMING METHOD USING THE SAME
#90Semiconductor device, method for manufacturing the same, and plating solution
#91Plating solution for electroless deposition of copper
#92Whiskerless plated structure and plating method
#93Methods of forming metal-containing films over surfaces of semiconductor substrates
#94TECHNIQUE FOR DEPOSITING METALLIC FILMS USING ION IMPLANTATION SURFACE MODIFICATION FOR CATALYSIS OF ELECTROLESS DEPOSITION
#95Electroless coating methods for depositing silver-tungsten coatings, kits and products
#96Modification of an anode material and a preperation method thereof
#97Metallization of dielectrics
#98Electroless deposition processes and compositions for forming interconnects
#99In-situ silicidation metallization process
#100Contact metallization scheme using a barrier layer over a silicide layer
#101Semiconductor constructions
#102Reagent activator for electroless plating
#103Method for copper-plating or bronze-plating an object and liquid mixtures therefor
#104Plating substrate, electroless plating method, and circuit forming method using the same
#105Semiconductor device, method for manufacturing the same, and plating solution
#106Tin-coated printed circuit boards with low tendency to whisker formation
#107Multinary bulk and thin film alloys and methods of making
#108Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby
#109Copper molybdenum electroless deposition process and materials
#110Method for forming supported palladium membrane used for hydrogen purification
#111Method for plating and plating solution therefor
#112Method of making multi-layer electronic components with plated terminations
#113Electroless displacement gold plating solution and additive for use in preparing plating solution