AQUEOUS SURFACE TREATMENT AGENT AND SURFACE-TREATED METAL

PREPARATION METHOD AND USE OF SURFACE-ENHANCED RAMAN SPECTROSCOPY (SERS) SUBSTRATE WITH SELF-CONFINED NANOSILVER GAPS

SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY

Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate

LAMINATE, METAL PLATING SOLUTION, AND MANUFACTURING PROCESS OF LAMINATE

Metal surface treatment liquid and liquid concentrate thereof, metal surface treatment liquid set, metal surface treatment method, and method for manufacturing printed wiring board

Home appliance metal materials chemically resistant to peroxide degradation

Fastener member

COPPER OR COPPER ALLOY ARTICLE COMPRISING SURFACE-MODIFIED POLYESTER-BASED RESIN AND MANUFACTURING METHOD

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

Patinated or patina-ready metal transaction cards and manufacturing processes

Composite copper foil

Method for Producing Film Formation Substrate, Film Formation Substrate, and Surface Treatment Agent

Microetching agent for copper, copper surface roughening method and wiring board production method

BONDING SUBSTRATE AND METHOD FOR PROTECTING SURFACES INTENDED FOR WIRE BONDING

Acid zinc sulfate metal pretreatment

Copper or copper alloy article comprising surface-modified polyester-based resin and manufacturing method

SURFACE TREATMENT AGENT FOR COPPER AND COPPER ALLOY SURFACES AND METHOD FOR TREATING COPPER OR COPPER ALLOY SURFACES

Patinated or patina-ready metal transaction cards and manufacturing process

Conducting member for fuel cells, fuel cell, fuel cell stack, and method of producing conducting member for fuel cells

Production method for copper-clad laminate plate

Electromagnetic shielding material

Treated article and method of making the same

Composition for blackening copper-based or silver-based metals

Surface treating composition for copper and copper alloy and utilization thereof

Method of treating wiring substrate and wiring substrate manufactured by the same

Organic solderability preservative and method

Surface treating composition for copper and copper alloy and utilization thereof

Surface treating composition for copper and copper alloy and utilization thereof

Adhesion promotion in printed circuit boards

Adhesion promotion in printed circuit boards

Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid

Coating-forming liquid composition and coating-forming method therewith

CORROSION CONTROL METHOD OF METAL

Phenylnaphthylimidazole compound and usage of the same

PROCESS FOR INHIBITING OXIDE FORMATION ON COPPER SURFACES

Non-etching non-resist adhesion composition and method of preparing a work piece

Process for improving adhesion of polymeric materials to metal surfaces

Organic polymer coating for protection against creep corrosion

Method for manufacturing a printed circuit board and a printed circuit board obtained by the manufacturing method

Preflux Composition

Metal surface treatment composition

Organic solderability preservative comprising high boiling temperature alcohol

Process for increasing the adhesion of a metal surface to a polymer

Phenylnaphthylimidazole compound and usage of the same

Adhesion promotion in printed circuit boards

Adhesion promotion in printed circuit boards

Imidazole compound and use thereof

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

Method for roughening copper surfaces for bonding to substrates

Aqueous coating solutions and method for the treatment of a metal surface

Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

Adhesion method

Surface treatment agent for copper and copper alloy

Adhesion promotion in printed circuit boards