ClassID:

120496

C23C22/63 - CPC Classification

Classification description:

Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8 Treatment of copper or alloys based thereon

Recent Application in this class:
#1
20250180997
2025-06-05

COPPER SURFACE PASSIVATION COMPOSITION, USE THEREOF, AND PHOTORESIST STRIPPER CONTAINING SAME

#2
20230338870
2023-10-26

PHOTOTHERMAL EVAPORATOR FOR A DESALINATION SYSTEM AND METHOD OF MANUFACTURE

#3
20210162700
2021-06-03

Patinated or patina-ready metal transaction cards and manufacturing processes

#4
20200157394
2020-05-21

Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite

#5
20190037841
2019-02-07

ANTI-BACTERIAL PATTERNED SURFACES AND METHODS OF MAKING THE SAME

#6
20180207903
2018-07-26

Patinated or patina-ready metal transaction cards and manufacturing process

#7
20180154608
2018-06-07

Method for producing metal containing composite and metal containing composite formed by adhesion

#8
20180139848
2018-05-17

Production method for copper-clad laminate plate

#9
20170338037
2017-11-23

Planar transformer components comprising electrophoretically deposited coating

#10
20170234628
2017-08-17

Supernucleating multiscale copper surfaces for high performance phase change heat transfer

#11
20160360623
2016-12-08

Methods of treating metal surfaces and devices formed thereby

#12
20150299628
2015-10-22

Composition for removing and preventing formation of oxide on the surface of metal wire

#13
20140261897
2014-09-18

Methods of treating metal surfaces and devices formed thereby

#14
20140030425
2014-01-30

Adhesion promotion in printed circuit boards

#15
20140000945
2014-01-02

Transparent components

#16
20130048598
2013-02-28

Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid

#17
20110186221
2011-08-04

Nano-oxide process for bonding copper/copper alloy and resin

#18
20100273015
2010-10-28

Copolymers, method for producing them and their use for treating surfaces

#19
20080187672
2008-08-07

Method and Composition for Improving Adhesion of Organic Polymer Coatings with Copper Surface

#20
20080096046
2008-04-24

Method of treating the surface of copper and copper

#21
20070163677
2007-07-19

Copper CMP slurry composition

#22
20070079906
2007-04-12

Method for covering copper with patina

#23
20060183056
2006-08-17

Method for isotropic etching of copper

#24
20060063687
2006-03-23

Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate

#25
20050173027
2005-08-11

Method for preparing patination materials and patination material

#26
20050064700
2005-03-24

Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions

#27
20050056616
2005-03-17

Method for isotropic etching of copper

#28
16898874
2024-09-10

Passivation of copper-nickel alloy conduits for marine use