ClassID:

120621

C23F4/02 - CPC Classification

Classification description:

Processes for removing metallic material from surfaces, not provided for in group or by evaporation

Recent Application in this class:
#1
20250297370
2025-09-25

APPLICATIONS OF A MATTE COATING LAYER IN PRINTING PROCESSES TO CREATE VARYING VISUAL EFFECTS ON PRINTED ARTICLES

#2
20250297369
2025-09-25

APPLICATIONS OF A MATTE COATING LAYER IN PRINTING PROCESSES TO CREATE VARYING VISUAL EFFECTS ON PRINTED ARTICLES

#3
20250154662
2025-05-15

THERMAL ATOMIC LAYER ETCHING PROCESSES

#4
20250092529
2025-03-20

METHOD AND APPARATUS FOR STRIPPING AN OXIDE LAYER FROM A METAL PRODUCT

#5
20240026548
2024-01-25

Thermal atomic layer etching processes

#6
20230374671
2023-11-23

Thermal atomic layer etching processes

#7
20230366101
2023-11-16

METHOD FOR FORMING GROOVE ON METAL STRIP SURFACE AND METHOD FOR MANUFACTURING GRAIN-ORIENTED ELECTRICAL STEEL SHEET

#8
20230290646
2023-09-14

Vapor phase thermal etch solutions for metal oxo photoresists

#9
20230215736
2023-07-06

Vapor phase thermal etch solutions for metal oxo photoresists

#10
20220396732
2022-12-15

Etching of alkali metal compounds

#11
20220344172
2022-10-27

Selective removal of ruthenium-containing materials

#12
20220119962
2022-04-21

Thermal atomic layer etching processes

#13
20220119961
2022-04-21

Thermal atomic layer etching processes

#14
20220002882
2022-01-06

Vapor phase thermal etch solutions for metal oxo photoresists

#15
20200308710
2020-10-01

Thermal atomic layer etching processes

#16
20200308709
2020-10-01

Thermal atomic layer etching processes

#17
20200040463
2020-02-06

Metal contamination prevention method and apparatus, and substrate processing method using the same and apparatus therefor

#18
20190355590
2019-11-21

Dry etching method, semiconductor device manufacturing method, and chamber cleaning method

#19
20190348307
2019-11-14

Dry etching method and β-diketone-filled container

#20
20190249312
2019-08-15

Thermal atomic layer etching processes

#21
20190242019
2019-08-08

Thermal atomic layer etching processes

#22
20190206761
2019-07-04

Metal member, composite of metal member and resin member, and production method therefor

#23
20180166255
2018-06-14

Thermal atomic layer etching processes

#24
20180163312
2018-06-14

Thermal atomic layer etching processes

#25
20170081977
2017-03-23

Method for selective aluminide diffusion coating removal

#26
20160020068
2016-01-21

Electron beam-induced etching

#27
20150218710
2015-08-06

COMPOSITE AND METHOD FOR MAKING THE SAME

#28
20150114566
2015-04-30

LARGE AREA DEPOSITION IN HIGH VACUUM WITH HIGH THICKNESS UNIFORMITY

#29
20150083581
2015-03-26

Techniques for processing substrates using directional reactive ion etching

#30
20150014891
2015-01-15

Patterned thin films by thermally induced mass displacement

#31
20150014152
2015-01-15

Selective sputtering for pattern transfer

#32
20140363978
2014-12-11

Electron beam-induced etching

#33
20140332372
2014-11-13

Plasma etching method

#34
20130157038
2013-06-20

COMPOSITE AND METHOD FOR MAKING THE SAME

#35
20130112138
2013-05-09

Particle sources and methods for manufacturing the same

#36
20130105302
2013-05-02

Charged particle beam device and sample production method

#37
20130075248
2013-03-28

Etching method, etching apparatus, and storage medium

#38
20120164350
2012-06-28

Treatment of parts with metallized finish areas with a differentiated appearance

#39
20120037077
2012-02-16

Large area deposition in high vacuum with high thickness uniformity

#40
20100203431
2010-08-12

Beam-induced etching

#41
20090166340
2009-07-02

Method and apparatus for perforating printed circuit board

#42
20080124486
2008-05-29

Method for enhancing adhesion of thin film

#43
20070193519
2007-08-23

Large area deposition in high vacuum with high thickness uniformity

#44
20070000296
2007-01-04

Rolled product, method and device for the production thereof, and use of the same

#45
20060228634
2006-10-12

Beam-induced etching

#46
20060211158
2006-09-21

Method and apparatus for laser perforating printed circuit board

#47
20050205524
2005-09-22

Method of manufacturing tape wiring substrate

#48
20050166846
2005-08-04

Large area deposition in high vacuum with high thickness uniformity