C23G1/066 - CPC Classification Index

ClassID:

120699 ⎘

C23G1/066 - CPC Classification

Classification description:

Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors phosphorus-containing compounds

Recent Application in this class:

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2026-03-05

COMPOSITION, METHOD OF TREATING METAL-CONTAINING FILM BY USING THE COMPOSITION, AND METHOD OF PREPARING SEMICONDUCTOR DEVICE BY USING THE COMPOSITION

20250075338

2025-03-06

Metal Sulfide Scale Dissolver For Oilfield Application

20180195031

2018-07-12

Process for forming a descaling composition

20110180747

2011-07-28

Trioka acid semiconductor cleaning compositions and methods of use

20110094536

2011-04-28

Troika acid semiconductor cleaning compositions and methods of use

20060094637

2006-05-04

Deruster composition and method

20050245409

2005-11-03

Reducing oxide loss when using fluoride chemistries to remove post-etch residues in semiconductor processing