ClassID:

120708

C23G1/103 - CPC Classification

Classification description:

Cleaning or pickling metallic material with solutions or molten salts with acid solutions; Other heavy metals copper or alloys of copper

Recent Application in this class:
#1
20260054287
2026-02-26

PASSIVATION COATING ON COPPER METAL SURFACE FOR COPPER WIRE BONDING APPLICATION

#2
20240218554
2024-07-04

METHOD FOR SMOOTHING SURFACE OF COPPER FOIL AND COPPER FOIL OBTAINED

#3
20230140900
2023-05-11

Methods for wet atomic layer etching of copper

#4
20230093655
2023-03-23

Silver-plated product and method for producing same

#5
20210251085
2021-08-12

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

#6
20210002550
2021-01-07

WATER-SOLUBLE FLUX AND COPPER MATERIAL PICKLING METHOD

#7
20200362461
2020-11-19

Metallic material surface treatment agent, metallic material having surface treatment coating, and manufacturing method therefor

#8
20200236783
2020-07-23

Method for manufacturing circuit board

#9
20190381539
2019-12-19

Method and system for cleaning copper-exposed substrate

#10
20190116676
2019-04-18

Method for manufacturing circuit board

#11
20190062928
2019-02-28

Methods, systems and apparatuses for copper removal from aluminum desmutting solutions

#12
20180074408
2018-03-15

Compositions and methods that promote charge complexing copper protection during low pKa driven polymer stripping

#13
20170275767
2017-09-28

COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

#14
20170271567
2017-09-21

COPPER ALLOY PLATE STRIP FOR USE IN LED LEAD FRAME

#15
20170152603
2017-06-01

Method for surface treatment of metals using bacteria

#16
20160368070
2016-12-22

High-precision zinc-based alloy electrode wire and manufacture method thereof

#17
20160059273
2016-03-03

Method and system for cleaning copper-exposed substrate

#18
20150000697
2015-01-01

Oxidizing aqueous cleaner for the removal of post-etch residues

#19
20140315044
2014-10-23

Method for manufacturing brass-plated steel wire and brass-plated steel wire

#20
20140311778
2014-10-23

Method of treating wiring substrate and wiring substrate manufactured by the same

#21
20130186764
2013-07-25

Low Etch Process for Direct Metallization

#22
20130072411
2013-03-21

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

#23
20130048598
2013-02-28

Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid

#24
20120160266
2012-06-28

Process for inhibiting oxide formation on copper surfaces

#25
20110214688
2011-09-08

CLEANING SOLUTION FOR SIDEWALL POLYMER OF DAMASCENE PROCESSES

#26
20110186086
2011-08-04

Oxidizing aqueous cleaner for the removal of post-etch residues

#27
20110056516
2011-03-10

PROCESS FOR SURFACE TREATMENT OF METALS

#28
20110023907
2011-02-03

Method for manufacturing semiconductor device

#29
20100294307
2010-11-25

Acidic cleaner for metal surfaces

#30
20100215841
2010-08-26

PROCESS FOR INHIBITING OXIDE FORMATION ON COPPER SURFACES

#31
20100213173
2010-08-26

Bevel plasma treatment to enhance wet edge clean

#32
20100197136
2010-08-05

Composition for cleaning and rust prevention and process for producing semiconductor element or display element

#33
20100089761
2010-04-15

Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method

#34
20100035785
2010-02-11

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

#35
20100035435
2010-02-11

Composition and method for improved adhesion of polymeric materials to copper alloy surfaces

#36
20090286382
2009-11-19

Low-temperature wafer bonding of semiconductors to metals

#37
20090215658
2009-08-27

Oxidizing aqueous cleaner for the removal of post-etch residues

#38
20090184287
2009-07-23

Sarcosine compound used as corrosion inhibitor

#39
20090148335
2009-06-11

PROCESS FOR SURFACE TREATMENT OF METALS

#40
20090068846
2009-03-12

COMPOSITIONS AND METHOD FOR TREATING A COPPER SURFACE

#41
20090008361
2009-01-08

Oxidant and passivant composition and method for use in treating a microelectronic structure

#42
20080236619
2008-10-02

COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE

#43
20080221003
2008-09-11

CONSUMER PRODUCTS HAVING VARYING ODOR PATTERNS

#44
20080202554
2008-08-28

PROCESS FOR SURFACE TREATMENT OF METALS

#45
20080185020
2008-08-07

Surface treatment process for metal articles

#46
20080167209
2008-07-10

Process for removing contaminant from a surface and composition useful therefor description

#47
20080125341
2008-05-29

IMPROVED ACIDIC CHEMISTRY FOR POST-CMP CLEANING

#48
20080115810
2008-05-22

METHOD OF REACTIVATING ELECTRODE FOR ELECTROLYSIS

#49
20080044990
2008-02-21

Method for Fabricating A Semiconductor Device Comprising Surface Cleaning

#50
20080004197
2008-01-03

Cleaning formulation for removing residues on surfaces

#51
20080004193
2008-01-03

Semiconductor process residue removal composition and process

#52
20070240734
2007-10-18

METHOD OF CLEANING POST-CMP WAFER

#53
20070207938
2007-09-06

Cleaning compositions and methods of use thereof

#54
20070161529
2007-07-12

CLEANING COMPOSITION FOR SEMICONDUCTOR DEVICE-MANUFACTURING APPARATUS AND CLEANING METHOD

#55
20060255315
2006-11-16

Selective removal chemistries for semiconductor applications, methods of production and uses thereof

#56
20060234888
2006-10-19

Acidic chemistry for Post-CMP cleaning using a composition comprising mercaptopropionic acid

#57
20060219259
2006-10-05

Method of cleaning a semiconductor wafer

#58
20060183056
2006-08-17

Method for isotropic etching of copper

#59
20060180795
2006-08-17

Stable acid inhibitor formulations with improved performance, lower toxicity and minimal environmental issues

#60
20060174912
2006-08-10

Wafer cleaning solution for cobalt electroless application

#61
20060086620
2006-04-27

Textured decorative plating on plastic components

#62
20050261152
2005-11-24

Cleaning composition

#63
20050215446
2005-09-29

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

#64
20050208774
2005-09-22

Wet processing method and processing apparatus of substrate

#65
20050206005
2005-09-22

Composition and a method for defect reduction

#66
20050197266
2005-09-08

Acidic chemistry for post-CMP cleaning

#67
20050126588
2005-06-16

Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitor

#68
20050098538
2005-05-12

Methods of cleaning copper surfaces in the manufacture of printed circuit boards

#69
20050056616
2005-03-17

Method for isotropic etching of copper

#70
20050028838
2005-02-10

Cleaning tantalum-containing deposits from process chamber components

#71
14803150
2016-07-19

System and method for cleaning stator cooling coils