Electrolytic process using cation permeable barrier

Planting process and manufacturing process for semiconductor device thereby, and plating apparatus

Contact ring with embedded flexible contacts

Electrochemical processing cell

Electroplating apparatus

Substrate processing apparatus and substrate processing method

Substrate processing apparatus, substrate processing method, and substrate holding apparatus

Substrate processing method and substrate processing apparatus

Die-level wafer contact for direct-on-barrier plating

Plating apparatus, plating method, and method for manufacturing semiconductor device

Microelectronic workpiece holders and contact assemblies for use therewith

Electrochemical processing of conductive surface

Method for fabricating metal layer

Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece

Electroplating apparatus and electroplating method using the same

Multi-menisci processing apparatus

Semiconductor manufacturing apparatus

Apparatus and method for improving uniformity in electroplating

System and method for increasing yield from semiconductor wafer electroplating

ELECTRO-CHEMICAL DEPOSITION APPARATUS AND METHOD OF PREVENTING CAVITIES IN AN ECD COPPER FILM

Methods and apparatuses for electrochemical deposition

Method and system for controlling a substrate position in an electrochemical process

Apparatus and method for electrochemically processing a microelectronic workpiece

Apparatus and method for electrochemically processing a microelectronic workpiece

Electroplating apparatus

Methods and systems for electroplating wafers

Method for applying metal features onto barrier layers using ion permeable barriers

Plating apparatus and method

Membrane-limited selective electroplating of a conductive surface

Method and apparatus for electrochemical plating semiconductor wafers

Electrolytic process using anion permeable barrier

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Electrolytic process using anion permeable barrier

Semiconductor wafer holder and electroplating system for plating a semiconductor wafer

Substrate plating method and apparatus

Electroplating apparatus including a real-time feedback system

Plating apparatus and plating method

Electrochemical plating apparatus and method

Wafer electroplating apparatus for improving process uniformity

Wafer electroplating apparatus

Means to eliminate bubble entrapment during electrochemical processing of workpiece surface

Contact plating apparatus

Wafer support apparatus for electroplating process and method for using the same

Method and system for electroprocessing conductive layers

Plating device and planting method

Plating apparatus

Balancing pressure to improve a fluid seal

Current collimation for thin seed and direct plating

Apparatus for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing

Method and apparatus for forming interconnects

Plating apparatus and plating method

Current-leveling electroplating/electropolishing electrode

Contact ring design for reducing bubble and electrolyte effects during electrochemical plating in manufacturing

Plating apparatus and plating method

Method and apparatus for establishing additive differential on surfaces for preferential plating

Process for controlling wettability of electrochemical plating component surfaces

Fixtureless vertical paddle electroplating cell

Methods for forming and patterning of metallic films

Method of forming a damascene structure with integrated planar dielectric layers

Dynamic profile anode

Noncontact localized electrochemical deposition of metal thin films

Method and apparatus for forming an electrical contact with a semiconductor substrate

Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces

Method and system for idle state operation

Apparatus configurations for affecting movement of fluids within a microelectric topography processing chamber

Barrier layer configurations and methods for processing microelectronic topographies having barrier layers

Methods for forming a barrier layer with periodic concentrations of elements and structures resulting therefrom

Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes

Substrate processing apparatus and substrate plating apparatus

Defect-free thin and planar film processing

Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions

Method and apparatus for processing a substrate with minimal edge exclusion

Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnects

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Noble metal contacts for plating applications

Solution treatment apparatus and solution treatment method

Method and apparatus for plating semiconductor wafers

Substrate support element for an electrochemical plating cell

Electrochemical plating cell with a counter electrode in an isolated anolyte compartment

Sequential station tool for wet processing of semiconductor wafers

Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence

Plating apparatus

Method of making rolling electrical contact to wafer front surface

Plating method and apparatus for controlling deposition on predetermined portions of a workpiece

Plating apparatus

Method of plating

Electrolytic reactor

Plating apparatus and plating method

Substrate processing apparatus

Electrochemical methods for the formation of protective features on metallized features

Plating apparatus and method

Method and apparatus for electroplating

Method for improved local planarity control during electropolishing

System for electrochemically processing a workpiece

Proximity head heating method and apparatus

Electropolishing and/or electroplating apparatus and methods

Plating method

Apparatus and methods for electrochemical processing of microelectronic workpieces

Wet processing method and processing apparatus of substrate

Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating

Apparatus and methods for electrochemical processsing of microelectronic workpieces

Apparatus and methods for electrochemical processing of microelectronic workpieces

Method and apparatus for processing a microfeature workpiece with multiple fluid streams

Single workpiece processing chamber with tilting load/unload upper rim

Electroless deposition apparatus

Apparatus and methods for electrochemical processing of microelectronic workpieces

Method and apparatus for electroplating a semiconductor wafer

Electroplating apparatus

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Apparatus and methods for electrochemical processing of microelectronic workpieces

Apparatus and methods for electrochemical processing of microelectronic workpieces

Method and apparatus for copper plating using electroless plating and electroplating

Method and systems for controlling current in electrochemical processing of microelectronic workpieces

Method and apparatus for infilm defect reduction for electrochemical copper deposition

Device and method for monitoring an electrolytic process

Apparatus having plating solution container with current applying anodes

Method and apparatus for fluid processing a workpiece

Tuning electrodes used in a reactor for electrochemically processing a microelectronics workpiece

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

System for electrochemically processing a workpiece

Plating method and plating apparatus

Electroplating apparatus with segmented anode array

Electroplating apparatus with segmented anode array

Method and apparatus for fluid processing a workpiece

Substrate processing apparatus and substrate processing method

Adaptable electrochemical processing chamber

Substrate proximity processing housing and insert for generating a fluid meniscus

Plating apparatus, plating method, and manufacturing method of semiconductor device

Plating of a thin metal seed layer

Apparatus for avoiding particle accumulation in electrochemical processing

Apparatus and method for processing substrate

Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer

Plating method and plating apparatus

Electroetching methods and systems using chemical and mechanical influence

Processing pad assembly with zone control

Thrust pad assembly for ECP system

Chambers, systems, and methods for electrochemically processing microfeature workpieces

Chambers, systems, and methods for electrochemically processing microfeature workpieces

Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station

System for electrochemically processing a workpiece

System for electrochemically processing a workpiece

System for electrochemically processing a workpiece

System for electrochemically processing a workpiece

Electroplating apparatus with segmented anode array

Electroplating apparatus with segmented anode array

System and method for applying constant pressure during electroplating and electropolishing

Distributing forces for electrodeposition

Method of electroplating and varying the resistance of a wafer

Electrochemical plating cell having a membrane stack

Electrochemical plating cell having a diffusion member

Substrate holder, plating apparatus, and plating method

Method and apparatus for fluid processing a workpiece

Revolution member supporting apparatus and semiconductor substrate processing apparatus

Chambers, systems, and methods for electrochemically processing microfeature workpieces

Plating apparatus and method

Volume measurement apparatus and method

Plating apparatus for substrate

Apparatus and method for electroplating a wafer surface

Substrate processing apparatus and substrate processing method

[ELECTROPLATING APPARATUS]

Methods for depositing copper on a noble metal layer of a work piece

System for electrochemically processing a workpiece

System and method for electrolytic plating

Plating apparatus and plating method

Insoluble anode with an auxiliary electrode

Plating apparatus and plating method

Method and apparatus for monitoring, dosing and distribution of chemical solutions

Electroplating apparatus with functions of voltage detection and flow rectification

Wet chemical processing chambers for processing microfeature workpieces

Copper electrodeposition in microelectronics

Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof

Device for galvanizing member-shaped substrates

Anode assembly for plating and planarizing a conductive layer

Method for achieving wafer contact for electro-processing

Apparatus for processing surface of workpiece with small electrodes and surface contacts

Method and apparatus for plating and polishing semiconductor substrate

Plating apparatus, plating method and substrate processing apparatus

Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface

Substrate holder and plating apparatus

Electrode assembly for electrochemical processing of workpiece

Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces

Apparatus and method for processing a substrate

Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece

Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods

Electroplating systems and methods with increased metal ion concentrations

Convection optimization for mixed feature electroplating

Separation of alpha emitting species from plating baths

Sequential station tool for wet processing of semiconductor wafers