121094 ⎘
Constructional parts, or assemblies thereof, of cells for electrolytic coating Current directing devices
ELECTROPLATED COATINGS FOR HYDRAULIC COMPONENTS
#2ELECTRODE PLATE AND ELECTROPLATING DEVICE WITH SAME
#3ELECTROPLATING EQUIPMENT AND ELECTROPLATING FLUID DISTURBANCE DEVICE THEREOF
#4ELECTROCHEMICAL-DEPOSITION APPARATUSES UTILIZING MULTIPLE ELECTROLYTIC SOLUTIONS
#5RESISTOR FOR PLATING APPARATUS, AND PLATING APPARATUS
#6ROTATING PLATING FIXTURE
#7Plating apparatus
#8MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS DISTRIBUTION CONTROL
#9ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
#10RESISTOR AND PLATING APPARATUS
#11PLATING APPARATUS AND PLATING METHOD
#12Electroplating Device
#13Method and system for electrolytically coating a steel strip by means of pulse technology
#14SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
#15DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE
#16Method for creating a chromium-plated surface with a matte finish
#17PLATING APPARATUS
#18Methods of electroplating a target electrode
#19DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A ROTATABLE SUBSTRATE
#20Dual wafer plating fixture for a continuous plating line
#21Plating apparatus having conductive liquid and plating method
#22Electroplating system
#23Apparatus for plating and method of plating
#24Electroplating apparatus and electroplating method
#25PLATING APPARATUS, PLATING METHOD, AND METHOD FOR PRODUCING WIRE ROD HAVING THE SURFACE PLATED
#26MULTILAYER COPPER FOIL, METHOD FOR MANUFACTURING SAME, AND ELECTROPLATING APPARATUS TO PREPARE THE MULTILAYER COPPER FOIL
#27Electrochemical-deposition apparatuses and associated methods of electroplating a target electrode
#28DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE
#29Plating apparatus and method for electroplating wafer
#30Method and system for electrolytically coating a steel strip by means of pulse technology
#31Semiconductor device manufacturing jig and method for manufacturing same
#32Preparation method of copper-based graphene composite with high thermal conductivity
#33Regulation plate, anode holder, and substrate holder
#34Method and apparatus for continuously applying nanolaminate metal coatings
#35Electroplating system
#36Array substrate, method for preparing array substrate, and backlight module
#37Plating apparatus
#38Masking and sealing system for multi-step surface treatment
#39Plating apparatus and method for electroplating wafer
#40DAMAGED PORTION TREATMENT METHOD AND DAMAGED PORTION TREATMENT DEVICE, AND CORROSION RESISTANCE TEST METHOD AND CORROSION RESISTANCE TEST APPARATUS FOR COATED METAL MATERIAL
#41Electroplating system
#42Method for creating a chromium-plated surface with a matte finish
#43Method of Forming Corrosion Resistant Coating and Related Apparatus
#44Electroplating apparatus for tailored uniformity profile
#45Metal Three-Dimensional Printing without Sintering using Concurrent Particle Deposition and Electroplating
#46Plating processing apparatus
#47Substrate holder and plating device
#48Apparatus for plating
#49ELECTROPLATING ASSEMBLY
#50Method and apparatus for continuously applying nanolaminate metal coatings
#51Method for producing chromium plated parts, and chromium plating apparatus
#52Methods of preparing articles by electrodeposition and additive manufacturing processes
#53High resistance virtual anode for electroplating cell
#54One-piece anode for tuning electroplating at an edge of a substrate
#55Regulation plate, anode holder, and substrate holder
#56Magnetic structure for metal plating control
#57Dual wafer plating fixture for a continuous plating line
#58Non-permeable substrate carrier for electroplating
#59Electrolytic processing jig and electrolytic processing method
#60Metal coating device and method for production of double-layered and copper coated pipe
#61Electroplating dynamic edge control
#62ANODE UNIT OF ELECTROPLATING APPARATUS, ELECTROPLATING APPARATUS INCLUDING ANODE UNIT, AND METHOD FOR ADJUSTING POWER FEEDING POSITION TO ANODE
#63Method for creating a chromium-plated surface with a matte finish
#64High resistance virtual anode for electroplating cell
#65Plating apparatus
#66Substrate holder and plating apparatus
#67Method for creating a chromium-plated surface with a matte finish
#68Method of forming corrosion resistant coating and related apparatus
#69Method of adjusting plating apparatus, and measuring apparatus
#70Manufacturing apparatus and manufacturing method for semiconductor device
#71Electroplating apparatus for tailored uniformity profile
#72Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
#73Two-shot molding for selectively metalizing parts
#74Electrolytic plating apparatus
#75METHOD AND APPARATUS FOR DYNAMIC CURRENT DISTRIBUTION CONTROL DURING ELECTROPLATING
#76Dynamic current distribution control apparatus and method for wafer electroplating
#77Feeder capable of feeding anode and plating apparatus
#78Electroplating apparatus with current crowding adapted contact ring seal and thief electrode
#79Plating apparatus and plating method
#80ELECTROPLATING SYSTEM
#81Rotor for polishing hollow tubes
#82Substrate processing apparatus and substrate processing method
#83PATTERN TRANSFER DEVICE AND PATTERN TRANSFER METHOD
#84Anisotropic high resistance ionic current source (AHRICS)
#85Methods of preparing articles by electrodeposition and additive manufacturing processes
#86Electrochemical etching apparatus
#87Electrolytic treatment apparatus and electrolytic treatment method
#88High resistance virtual anode for electroplating cell
#89APPARATUS FOR ELECTROPLATING OF ELECTRODES ON PHOTOVOLTAIC STRUCTURES
#90DURABLE LOW CURE TEMPERATURE HYDROPHOBIC COATING IN ELECTROPLATING CUP ASSEMBLY
#91Electroplating processor with current thief electrode
#92Plating apparatus, plating method, and substrate holder
#93Electroplating apparatus with membrane tube shield
#94Method of adjusting plating apparatus, and measuring apparatus
#95Substrate holder, plating apparatus, and plating method
#96Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
#97Electric field treatment method and electric field treatment device
#98SEMICONDUCTOR ELECTROPLATING SYSTEM
#99Electroplating method and electroplating device
#100Coating forming device and coating forming method for forming metal coating
#101Plating apparatus
#102Apparatus for use in an electroetching or electrodeposition process and an electroetching or electrodeposition process
#103ELECTROPLATING APPARATUS AND METHOD
#104Electroplating apparatus with notch adapted contact ring seal and thief electrode
#105Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
#106Multi-contact lipseals and associated electroplating methods
#107Film formation system and film formation method for forming metal film
#108Lipseals and contact elements for semiconductor electroplating apparatuses
#109METHODS, SYSTEMS, AND COMPUTER READABLE MEDIA FOR VOLTAGE CONTROLLED RECONFIGURATION OF LIQUID METAL STRUCTURES
#110Contact bar and capping board for supporting symmetrical electrodes for enhanced electrolytic refining of metals
#111Plating cup with contoured cup bottom
#112Electroplating apparatus for tailored uniformity profile
#113ANODE AND HIGH-SPEED PLATING MACHINE PROVIDED WITH THE SAME
#114NON-PERMEABLE SUBSTRATE CARRIER FOR ELECTROPLATING
#115Power supplying member and high-speed plating machine provided with the same
#116Plating method
#117Method and Apparatus for Continuously Applying Nanolaminate Metal Coatings
#118System in package structure, electroplating module thereof and memory storage device
#119METHOD OF MAKING CURRENT COLLECTOR
#120Device with electrospray coating to deliver active ingredients
#121Electrodeposition systems and methods that minimize anode and/or plating solution degradation
#122Manufacturing a hardened formed part
#123Device and method for electrolytically coating an object
#124Anode unit and plating apparatus having such anode unit
#125Plating cup with contoured cup bottom
#126Electrochemical etching apparatus
#127Bonded stacked wafers and methods of electroplating bonded stacked wafers
#128Electroplating apparatus for tailored uniformity profile
#129Magnetic structure for metal plating control
#130Electroplating apparatus with improved throughput
#131Anisotropic high resistance ionic current source (AHRICS)
#132Electro chemical plating process
#133Device suitable for the electrochemical processing of an object, a holder suitable for such a device, and a method for the electrochemical processing of an object
#134Device and method for coloring anode coatings using the coloring device
#135Method and apparatus for dynamic current distribution control during electroplating
#136Contact bar and capping board for supporting symmetrical electrodes for enhanced electrolytic refining of metals
#137Method and apparatus for electroplating
#138Electrochemical processor
#139ELECTROPLATING JIG FOR PROCESSING ELECTROPLATING AT CERTAIN LOCATION, ELECTROPLATING METHOD INCORPORATING WITH THE SAME, AND ELECTRO PRODUCT FREE OF PLATING PROOF LAYER PRODUCED THEREBY
#140Device and method for coloring anode coatings using the device
#141Dynamic current distribution control apparatus and method for wafer electroplating
#142Contact ring for an electrochemical processor
#143Apparatus for use in electrorefining and electrowinning
#144Method for refurbishing PtAl coating to turbine hardware removed from service
#145PLATING CUP WITH CONTOURED CUP BOTTOM
#146Lipseals and contact elements for semiconductor electroplating apparatuses
#147Tool for galvanically coating sliding bearings
#148Method and apparatus for controlling and monitoring the potential
#149Multi-anode system for uniform plating of alloys
#150Electrochemical processor
#151Electrochemical processor
#152Electroplating apparatus for tailored uniformity profile
#153BARREL APPARATUS FOR BARREL PLATING
#154Method and electrochemical cell for synthesis and treatment of metal monolayer electrocatalysts metal, carbon, and oxide nanoparticles ion batch, or in continuous fashion
#155Electro chemical deposition systems and methods of manufacturing using the same
#156Bonded stacked wafers and methods of electroplating bonded stacked wafers
#157Plating apparatus and plating method
#158Multi-anode system for uniform plating of alloys
#159Non-permeable substrate carrier for electroplating
#160Method and apparatus for controlling and monitoring the potential
#161Electroplating Apparatus
#162Apparatus for electrochemical plating semiconductor wafers
#163ELECTROSPRAY COATING OF OBJECTS
#164Apparatus for an enhanced magnetic plating method
#165APPARATUS AND METHOD FOR IMPROVING UNIFORMITY IN ELECTROPLATING
#166METHOD AND DEVICE FOR SUPPLYING ELECTRICAL POWER
#167Method and apparatus for electrochemical plating semiconductor wafers
#168Method and apparatus for electroplating
#169Method and apparatus for electroplating
#170Method and apparatus for electroplating
#171Electroplating method and apparatus
#172Device suitable for electrochemically processing an object as well as a method for manufacturing such a device, a method for electrochemically processing an object, using such a device, as well as an object formed by using such a method
#173Plating apparatus and plating method
#174Plating apparatus
#175Electro chemical deposition systems and methods of manufacturing using the same
#176Direct nanoscale patterning of metals using polymer electrolytes
#177Enhanced magnetic plating method
#178Device and a method for metal plating
#179STRUCTURE FOR OPTIMIZING FILL IN SEMICONDUCTOR FEATURES DEPOSITED BY ELECTROPLATING
#180Method for fabricating plated product
#181Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
#182Free standing single-crystal nanowire growth by electro-chemical deposition
#183Multi-anode system for uniform plating of alloys
#184Method and apparatus for treating a component of a gas turbine engine
#185Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece
#186Electrolysis Plating System
#187Metal plating process
#188Electroplating apparatus
#189Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
#190Electrolytic capacitor for electric field modulation
#191Pattern transfer by solid state electrochemical stamping
#192Electrospray coating of objects
#193UNIVERSAL PLATING FIXTURE
#194Thickness distribution control for electroplating
#195Structure for optimizing fill in semiconductor features deposited by electroplating
#196Auxiliary electrode encased in cation exchange membrane tube for electroplating cell
#197Apparatus and method for improving uniformity in electroplating
#198Apparatus and method for electrochemically processing a microelectronic workpiece
#199Apparatus and method for electrochemically processing a microelectronic workpiece
#200Method and apparatus for electrochemical plating semiconductor wafers
#201Current collimation for thin seed and direct plating
#202Fixtureless vertical paddle electroplating cell
#203Plating apparatus and plating method
#204Electroplating apparatus
#205Plating of a thin metal seed layer
#206Method and system of controlling alloy composition during electroplating