ClassID:

121115

C25D21/10 - page 2 - CPC Classification

Classification description:

Processes for servicing or operating cells for electrolytic coating Agitating of electrolytes; Moving of racks

Recent Application in this class:
#301
20090139870
2009-06-04

Plating apparatus and plating method

#302
20090095633
2009-04-16

COPPER PLATING METHOD AND APPARATUS FOR A GRAVURE CYLINDER

#303
20090065363
2009-03-12

Electroplating cell and tool

#304
20090045069
2009-02-19

Plating apparatus and plating method

#305
20090017622
2009-01-15

Chemical treatment method

#306
20090014321
2009-01-15

Surface treatment electrode

#307
20080311235
2008-12-18

Replication tools and related fabrication methods and apparatus

#308
20080271995
2008-11-06

AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION

#309
20080257717
2008-10-23

Process for the surface treatment of hollow parts, tank for implementing such a process, and continuous surface treatment process and installation using such a tank

#310
20080245669
2008-10-09

Plating apparatus and method

#311
20080237048
2008-10-02

METHOD AND APPARATUS FOR SELECTIVE ELECTROFILLING OF THROUGH-WAFER VIAS

#312
20080227294
2008-09-18

Method of making an interconnect structure

#313
20080190776
2008-08-14

Heat spreader plating methods and devices

#314
20080141933
2008-06-19

Semiconductor plating system for plating semiconductor object

#315
20080123248
2008-05-29

Laminated electronic component

#316
20080117711
2008-05-22

Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus

#317
20080116077
2008-05-22

System and method for solder bump plating

#318
20080110751
2008-05-15

Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece

#319
20080090079
2008-04-17

High-resistivity magnetic film from nano-particle plating

#320
20080067072
2008-03-20

Method of forming metal and metal alloy features

#321
20080047829
2008-02-28

Plating apparatus

#322
20080041727
2008-02-21

Method and system for depositing alloy composition

#323
20080035475
2008-02-14

Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes

#324
20080006527
2008-01-10

Surface treatment apparatus for small object

#325
20070289867
2007-12-20

Apparatus for enhanced electrochemical deposition

#326
20070199827
2007-08-30

Method for electroplating with tin-zinc alloy

#327
20070172695
2007-07-26

Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance

#328
20070102300
2007-05-10

Method for ceramic electroplating a cylinder assembly of an internal combustion engine

#329
20060219566
2006-10-05

Method for fabricating metal layer

#330
20060199381
2006-09-07

ELECTRO-CHEMICAL DEPOSITION APPARATUS AND METHOD OF PREVENTING CAVITIES IN AN ECD COPPER FILM

#331
20060194448
2006-08-31

Replication tools and related fabrication methods and apparatus

#332
20060113185
2006-06-01

Plating apparatus

#333
20060103261
2006-05-18

Electroplating method for sealing liquid-cooled generator stator bar structures

#334
20060103244
2006-05-18

Electroplated stator bar end and fitting

#335
20060102469
2006-05-18

Electroplating apparatus

#336
20060081478
2006-04-20

Plating apparatus and plating method

#337
20060051512
2006-03-09

Apparatus and systems for coating objects

#338
20060051511
2006-03-09

Apparatus and systems for coating objects

#339
20060049062
2006-03-09

Processes for coating of objects

#340
20060030157
2006-02-09

Apparatus configurations for affecting movement of fluids within a microelectric topography processing chamber

#341
20060030143
2006-02-09

Barrier layer configurations and methods for processing microelectronic topographies having barrier layers

#342
20060029833
2006-02-09

Methods for forming a barrier layer with periodic concentrations of elements and structures resulting therefrom

#343
20060029727
2006-02-09

Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes

#344
20050245084
2005-11-03

Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)

#345
20050205429
2005-09-22

Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating

#346
20050167276
2005-08-04

Process for electrolytic coating of a strand casting mould

#347
20050167275
2005-08-04

Method and apparatus for fluid processing a workpiece

#348
20050160977
2005-07-28

Method and apparatus for fluid processing a workpiece

#349
20050089645
2005-04-28

Method and apparatus for fluid processing a workpiece

#350
20050082163
2005-04-21

Plating apparatus and method

#351
20050072680
2005-04-07

Apparatus and method for electroplating a wafer surface

#352
20050051425
2005-03-10

Electroplating apparatus with functions of voltage detection and flow rectification

#353
20050006241
2005-01-13

Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces

#354
20050000817
2005-01-06

Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods

#355
18066055
2023-09-19

Device and apparatus for agitation of liquid

#356
15785251
2018-10-09

Convection optimization for mixed feature electroplating

#357
15375279
2019-09-10

Method of electrochemically-driven coated material synthesis

#358
14950720
2016-06-07

Separation of alpha emitting species from plating baths