120953 ⎘
Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds Heterocyclic compounds
METAL FOIL CONTINUOUS PLATING APPARATUS, METAL FOIL CONTINUOUS PLATING METHOD, AND METHOD FOR MANAGING ELECTROLYTE SOLUTION OF CONTINUOUS PLATING APPARATUS
#2Composition and Method for Fabrication of Nickel Interconnects
#3METHOD AND SYSTEM FOR ELECTROPLATING ARTICLE WITH METAL
#4NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL
#5NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL
#6PRODUCTION OF NANOPOROUS FILMS
#7Composition for Cobalt Electroplating Comprising Leveling Agent
#8Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating
#9Composition and method for fabrication of nickel interconnects
#10Composition for cobalt plating comprising additive for void-free submicron feature filling
#11Cobalt filling of interconnects
#12METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME
#13High-strength single-crystal like nanotwinned nickel coatings and methods of making the same
#14Composition for cobalt or cobalt alloy electroplating
#15COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING
#16Method for plating printed circuit board and printed circuit board using the same
#17Composition for cobalt electroplating comprising leveling agent
#18Production of nanoporous films
#19Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
#20Enhanced plating bath and additive chemistries for cobalt plating
#21COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING
#22Method and device for preparing high strength and durable super-hydrophobic film layer on inner wall of elongated metal tube
#23Pollution-free electroplating solution for electroplating and preparation method thereof
#24Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
#25Nickel electroplating compositions with cationic polymers and methods of electroplating nickel
#26Cobalt filling of interconnects
#27Environmentally friendly nickel electroplating compositions and methods
#28Nickel plated coating and method of manufacturing the same
#29Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
#30Enhanced plating bath and additive chemistries for cobalt plating
#31Method of making sound interface in overcast bimetal components
#32Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
#33Needle and method for manufacturing the same
#34Chemistry additives and process for cobalt film electrodeposition
#35Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
#36Methods of coating substrates with composite coatings of diamond nanoparticles and metal
#37Galvanic nickel electroplating bath for depositing a semi-bright nickel
#38SURFACE TREATED PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMPONENTS
#39Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#40NICKEL-CONTAINING LAYER ARRANGEMENT FOR INTAGLIO PRINTING
#41Composite plated product
#42ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS
#43Biological molecule-immobilized chip and its use
#443-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths