ClassID:

120961

C25D3/34 - CPC Classification

Classification description:

Electroplating: Baths therefor from solutions of lead

Sub-classes:
Recent Application in this class:
#1
20220154357
2022-05-19

Method and apparatus for continuously applying nanolaminate metal coatings

#2
20210348292
2021-11-11

ELECTRODEPOSITION OF PURE PHASE SnSb FROM EUTECTIC ETHALINE SOLUTION FOR SODIUM-ION AND LITHIUM-ION BATTERY ANODES

#3
20210087700
2021-03-25

Device for manufacturing hybrid metal foams

#4
20200392642
2020-12-17

Method and apparatus for continuously applying nanolaminate metal coatings

#5
20190003067
2019-01-03

Method of manufacturing hybrid metal foams

#6
20180298496
2018-10-18

CORROSION AND FATIGUE RESISTANT COATING FOR A NON-LINE-OF-SIGHT (NLOS) PROCESS

#7
20180005764
2018-01-04

Process of forming a photoactive layer of an optoelectronic device

#8
20160281250
2016-09-29

Electrochemical process for the preparation of lead foam

#9
20160097140
2016-04-07

ENHANCED CONDUCTIVITY METAL-CHALCOGENIDE FILMS VIA POST ELECROPHORETIC DEPOSITION (EPD) TREATMENT

#10
20160002813
2016-01-07

Method and Apparatus for Continuously Applying Nanolaminate Metal Coatings

#11
20150329983
2015-11-19

Process for the electrochemical deposition of a semiconductor material

#12
20150083600
2015-03-26

Electrolytic copper process using anion permeable barrier

#13
20120152751
2012-06-21

Electrolytic process using anion permeable barrier

#14
20120032352
2012-02-09

Side wettable plating for semiconductor chip package

#15
20090297913
2009-12-03

Nanostructure-Enhanced stereo-electrodes for fuel cells and biosensors

#16
20080128293
2008-06-05

Configurations and Methods of Electrochemical Lead Recovery from Contaminated Soil

#17
20070071998
2007-03-29

Preferred copper plated finish and method of making same