ELECTRODEPOSITION OF NANOTWINNED CU ALLOYS

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene Process

Bronze layers as noble metal substitutes

PLUMBING COMPONENT WITH A COATING AND METHOD FOR COATING A PLUMBING COMPONENT

ADDITIVE COMPOSITION FOR PLATING SOLUTION

Method for Improving Copper Alloy Electroplating Filling Process

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene Process

Nano-twinned Cu—Ni alloy layer and method for manufacturing the same

PCB terminal, connector, wiring harness with connector and board unit

Copper or copper alloy electroplating bath

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND AND BISEPOXOIDES

Dilute alloy catalysts for electrochemical CO2 reduction

COPPER-IRON ALLOY ELECTROPLATING SOLUTION AND ELECTROPLATING METHOD USING THE SAME

Metal or metal alloy deposition composition and plating compound

METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC MATERIALS

Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths

Composition for metal electroplating comprising leveling agent

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones

Cladded metal interconnects

Electroplating method

Plated material and manufacturing method therefor

Metal plating compositions

Metal wires, manufacturing methods therefor and tires

Metal deposits, compositions, and methods for making the same

Electrode for battery and fabrication method thereof

Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire

Copper foil with minimized bagginess and tear, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same

Electrically conductive material for connection component

Plating bronze on polymer sheets

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides

Copper plating bath composition and method for deposition of copper

Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones

Copper electroplating baths containing compounds of reaction products of amines and quinones

Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides

Method for manufacturing composition controlled thin alloy foil by using electro-forming

METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC MATERIALS

Easily handleable electrolytic copper foil, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same

Tin-plated product and method for producing same

Material and process for electrochemical deposition of nanolaminated brass alloys

Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device

Copper-nickel alloy electroplating device

Copper-nickel alloy electroplating bath

Reaction products of amino acids and epoxies

COPPER-TIN ALLOY PLATING BATH

Surface-treated copper foil

Leveling composition and method for electrodeposition of metals in microelectronics

Hybrid thrust reverser inner wall for aircraft engines

PLATING SOLUTION FOR THREADED CONNECTION FOR PIPE OR TUBE AND PRODUCING METHOD OF THREADED CONNECTION FOR PIPE OR TUBE

Plating solution for threaded connection for pipe or tube and producing method of threaded connection for pipe or tube

Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device

Electrolytic copper plating solution analyzer, and electrolytic copper plating solution analysis method

Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring board

DEPOSITION OF COPPER-TIN AND COPPER-TIN-ZINC ALLOYS FROM AN ELECTROLYTE

Complexing Agent and Preparation Method and Use Thereof

Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens

CYANIDE-FREE ELECTROPLATING BATHS FOR WHITE BRONZE BASED ON COPPER (I) IONS

Copper foil for printed circuit

Laminating magnetic cores for on-chip magnetic devices

Nitrogen containing polymers as levelers

Use of metal phosphorus in metallization of photovoltaic devices and method of fabricating same

Sulfonamide based polymers for copper electroplating

Amino sulfonic acid based polymers for copper electroplating

Reaction products of amino acids and epoxies

Sulfonamide based polymers for copper electroplating

Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens

Plating of articles

Electrical contact element and method for manufacturing same

Metallic materials with embedded luminescent particles

Leveling composition and method for electrodeposition of metals in microelectronics

Surface-coated steel sheet and process for the production thereof

Self-assembly of coatings utilizing surface charge

Copper plating bath composition

Surface treated copper foil and laminate using the same

Electrodeposition of thin-film cells containing non-toxic elements

Oxidation-resistant elongate electrically conductive element

Additives for electroplating baths

Copper-nickel alloy electroplating bath and plating method

Carrier-attached copper foil

Method for regenerating plating liquid, plating method, and plating apparatus

Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials

Lithium-ion battery

High strength, high heat resistance electrodeposited copper foil and manufacturing method for same

Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby

Non-vacuum method of manufacturing light-absorbing materials for solar cell application

Composite dual blackened copper foil and method of manufacturing the same

Laminating magnetic cores for on-chip magnetic devices

Laminating magnetic cores for on-chip magnetic devices

Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys

Liquid crystal polymer copper-clad laminate and copper foil used for said laminate

Electrolysis copper-alloy foil, method of the same, electrolytic-solution using the production, negative electrode aggregation used the same, secondary battery, and electrode of the same

Button or fastener member of copper-plated aluminum or aluminum alloy and method of production thereof

Method of producing displacement plating precursor

Adhesion promotion of cyanide-free white bronze

Carrier-attached copper foil

Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil

ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF COPPER-TIN ALLOY LAYERS

Material and process for electrochemical deposition of nanolaminated brass alloys

Composite material, electric contact electrode, electric contact film, conductive filler, electric contact structure using composite material, and manufacturing method of composite material

Composition for metal electroplating comprising leveling agent

ANTI-FRETTING LAYER

COPPER FOIL FOR NEGATIVE ELECTRODE CURRENT COLLECTOR OF SECONDARY BATTERY

Copper foil for printed circuit

Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures

Method for preparing an absorber thin film for photovoltaic cells

Use of metal phosphorus in metallization of photovoltaic devices and method of fabricating same

ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER

METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIAMOND ON METAL SUBSTRATE FOR THERMAL DISSIPATION

Self-assembly of coatings utilizing surface charge

ELECTRODEPOSITION METHODS OF GALLIUM AND GALLIUM ALLOY FILMS AND RELATED PHOTOVOLTAIC STRUCTURES

Electrodeposition of thin-film cells containing non-toxic elements

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

ELECTROPLATING METHODS AND CHEMISTRIES FOR CIGS PRECURSOR STACKS WITH CONDUCTIVE SELENIDE BOTTOM LAYER

COPPER-ZINC ALLOY ELECTROPLATING BATH AND METHOD OF PLATING USING SAME

METALLIC MATERIALS WITH EMBEDDED LUMINESCENT PARTICLES

Gold alloy electrolytes

Copper foil for printed circuit

Cyanide free electrolyte composition for the galvanic deposition of a copper layer

COPPER-TIN ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF BRONZE LAYERS

Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA)

MODIFIED COPPER-TIN ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF BRONZE LAYERS

METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC MATERIALS

COPPER-ZINC ALLOY ELECTROPLATING BATH AND PLATING METHOD USING THE SAME

PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS

Sn-plated copper or Sn-plated copper alloy having excellent heat resistance and manufacturing method thereof

COPPER-ZINC ALLOY ELECTROPLATING BATH AND PLATING METHOD USING THE COPPER-ZINC ALLOY ELECTROPLATING BATH

Copper foil for printed circuit and copper-clad laminate

Enhanced plating chemistries and methods for preparation of group IBIIIAVIA thin film solar cell absorbers

Electroplating method and electroplated product

Copper-tin electrolyte and method for depositing bronze layers

Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films

SELENIUM CONTAINING ELECTRODEPOSITION SOLUTION AND METHODS

Lithium-ion battery

Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell

Electroplating bronze

Sn-Plated Cu-Ni-Si Alloy Strip

Gold alloy electrolytes

Electrolyte and process for depositing a matt metal layer

Copper-tin-oxygen alloy plating

COPPER WELDING SOLID WIRE WITH GOOD ARC STABILITY

Electric arc welding wire

Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield

POST DEPOSITION TREATMENTS OF ELECTRODEPOSITED CUINSE2-BASED THIN FILMS

Method for manufacturing semiconductor device

COPPER WELDING SOLID WIRE WITH GOOD ARC STABILITY

METHOD FOR ELECTRODEPOSITION OF BRONZES

Method for bronze galvanic coating

Differentially metal doped copper damascenes

Surface treated copper foil and circuit board

Electroplated metals with silvery-white appearance and method of making

Electroplated metals with silvery-white appearance and method of making

Alloy composition and plating method

Method for alloy-electroplating group IB metals with refractory metals for interconnections

Method for electrodeposition of bronzes

Copper film containing tungsten nitride for improving thermal stability, electrical conductivity and electric leakage properties and a manufacturing method for the copper film

Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby

Pyrophosphoric acid bath for use in copper-tin alloy plating

Tubular member having an anti-galling coating

Copper bath for electroplating fine circuitry on semiconductor chips

Semiconductor device manufacturing method