ClassID:

120991

C25D5/06 - CPC Classification

Classification description:

Electroplating characterised by the process; Pretreatment or after-treatment of workpieces; Electroplating with moving electrodes Brush or pad plating

Recent Application in this class:
#1
20240254646
2024-08-01

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

#2
20240200222
2024-06-20

PLATING ELECTRODE AND PLATING METHOD THAT USES THE PLATING ELECTRODE

#3
20220380923
2022-12-01

Film forming method for forming metal film and film forming apparatus for forming metal film

#4
20220098753
2022-03-31

Film formation method for metallic coating and film formation device for metallic coating

#5
20210207279
2021-07-08

Electroplating systems and methods

#6
20190309431
2019-10-10

Controlled method for applying coating materials to complex heat transfer surfaces

#7
20190249321
2019-08-15

Film forming method for metal film and film forming apparatus therefor

#8
20190112723
2019-04-18

Apparatus and method of contact electroplating of isolated structures

#9
20180355490
2018-12-13

METHOD FOR PRESERVING A MARK ON A METALLIC WORKPIECE

#10
20180274115
2018-09-27

Method of forming nickel film and nickel solution used for the method

#11
20180171500
2018-06-21

Electroplating systems and methods

#12
20180155553
2018-06-07

Corrosion-resistant metal substrate

#13
20180016695
2018-01-18

Apparatus and method of contact electroplating of isolated structures

#14
20170362730
2017-12-21

Method for optically inscribing and/or marking round stock

#15
20170356097
2017-12-14

Method of mirror coating an optical article and article thereby obtained

#16
20170335479
2017-11-23

Film forming method for metal film and film forming apparatus therefor

#17
20170190921
2017-07-06

Corrosion resistant coating composition of Ni and a phosphate corrosion inhibitor and an electrodeposition method for the manufacture thereof

#18
20170175281
2017-06-22

Method of forming metal coating

#19
20170159196
2017-06-08

ELECTRICAL DEPOSITION APPARATUS

#20
20170107628
2017-04-20

Method for preserving a mark on a metallic workpiece

#21
20170014043
2017-01-19

Electrodermal Activity Sensor

#22
20160289851
2016-10-06

Hydrogel-mediated electropolymerization of conducting polymers

#23
20160265129
2016-09-15

Film formation apparatus and film formation method forming metal film

#24
20160253586
2016-09-01

COUNTERFEIT PROOFING OF PLATED POLYMERS

#25
20160186353
2016-06-30

Metal coating film formation device and method

#26
20160161242
2016-06-09

Non-contact strain measurement

#27
20160145758
2016-05-26

In-situ balancing of plated polymers

#28
20160145747
2016-05-26

BRUSH PLATING REPAIR METHOD FOR PLATED POLYMERS

#29
20160130713
2016-05-12

Porous, flow-through consumable anodes for use in selective electroplating

#30
20160108534
2016-04-21

ALUMINUM DEPOSITION DEVICES AND THEIR USE IN SPOT ELECTROPLATING OF ALUMINUM

#31
20150243831
2015-08-27

Electrodeposition of thin-film cells containing non-toxic elements

#32
20150218723
2015-08-06

Electroplating cell, and metal coating and method of forming the same

#33
20150184308
2015-07-02

Device for electrochemical treatment, locally in particular, of a conductor substrate

#34
20140251815
2014-09-11

Electrical brush plating system and method for metal parts

#35
20140234527
2014-08-21

Methods for fabrication of orthodontic appliances and orthodontic appliances made thereby

#36
20140224662
2014-08-14

Solid electrolyte/electrode assembly for electrochemical surface finishing applications

#37
20130112563
2013-05-09

Flow-through consumable anodes

#38
20130015074
2013-01-17

Methods for repairing steel components

#39
20120325379
2012-12-27

METHOD FOR PRODUCING A CORROSION-RESISTANT, WORKABLE SHEET METAL WITH FULL-SURFACE COATING OF THE JOINED, THERMALLY TREATED STEEL SHEETS

#40
20120318671
2012-12-20

Electrohydraulic and shear cavitation radial counterflow liquid processor

#41
20120269982
2012-10-25

METHOD FOR ELECTROCHEMICAL COATING

#42
20120247966
2012-10-04

METHOD FOR ELECTROCHEMICAL COATING OF A SUBSTRATE BY MEANS OF BRUSH PLATING AND DEVICE FOR CARRYING OUT SAID METHOD

#43
20120048378
2012-03-01

Electrodeposition of thin-film cells containing non-toxic elements

#44
20110195272
2011-08-11

PROCESS FOR THE PROTECTION OF A METAL SUBSTRATE FROM CORROSION AND ABRASION, AND METAL SUBSTRATE OBTAINED BY THIS PROCESS

#45
20110048791
2011-03-03

Printed circuit board and method of manufacturing the same

#46
20110031125
2011-02-10

Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method

#47
20100264035
2010-10-21

REEL-TO-REEL PLATING OF CONDUCTIVE GRIDS FOR FLEXIBLE THIN FILM SOLAR CELLS

#48
20100224501
2010-09-09

Plating methods for low aspect ratio cavities

#49
20100170803
2010-07-08

Method and apparatus for plating semiconductor wafers

#50
20100147463
2010-06-17

CATALYST-AIDED CHEMICAL PROCESSING METHOD AND APPARATUS

#51
20100086793
2010-04-08

Web pressure welding method, pressure welding device, power supply method, power supply device, continuous electrolytic plating apparatus and method for manufacturing web with plated coating film

#52
20100032306
2010-02-11

Selective electrochemical deposition of conductive coatings on fuel cell bipolar plates

#53
20090321250
2009-12-31

Apparatus for plating semiconductor wafers

#54
20090280649
2009-11-12

Topography reduction and control by selective accelerator removal

#55
20090277867
2009-11-12

Topography reduction and control by selective accelerator removal

#56
20090242418
2009-10-01

COATING METHOD AND ELECTROLYZING APPARATUS USED THEREFOR

#57
20090242413
2009-10-01

Electroplating head and method for operating the same

#58
20090242410
2009-10-01

Method for electrochemical plating and marking of metals

#59
20090159461
2009-06-25

Electrohydraulic and shear cavitation radial counterflow liquid processor

#60
20090101511
2009-04-23

ELECTROPLATING DEVICE AND METHOD

#61
20090090634
2009-04-09

Method of plating metal onto titanium

#62
20080296150
2008-12-04

Device and a method for metal plating

#63
20080272983
2008-11-06

Method for producing a non-developable surface printed circuit and the thus obtained printed circuit

#64
20080271992
2008-11-06

Apparatus and method for plating semiconductor wafers

#65
20080263864
2008-10-30

TURBOMACHINE BLADE AND TURBOMACHINE COMPRISING THIS BLADE

#66
20080102251
2008-05-01

Plating method and apparatus for controlling deposition on predetermined portions of a workpiece

#67
20080099344
2008-05-01

Electropolishing system and process

#68
20080073222
2008-03-27

Catalyst-aided chemical processing method and apparatus

#69
20080017503
2008-01-24

Electroplating apparatus

#70
20070131563
2007-06-14

MEANS TO IMPROVE CENTER TO EDGE UNIFORMITY OF ELECTROCHEMICAL MECHANICAL PROCESSING OF WORKPIECE SURFACE

#71
20070131562
2007-06-14

Method and apparatus for planarizing a substrate with low fluid consumption

#72
20070128851
2007-06-07

FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURES

#73
20070082299
2007-04-12

Methods and apparatus for fabricating conductive features on glass substrates used in liquid crystal displays

#74
20070051635
2007-03-08

Method for controlling conductor deposition on predetermined portions of a wafer

#75
20060219573
2006-10-05

Electrochemical processing of conductive surface

#76
20060113192
2006-06-01

Plating device and planting method

#77
20060013961
2006-01-19

In situ plating of electrical connector contacts

#78
20050284767
2005-12-29

Method and apparatus for plating semiconductor wafers

#79
20050284748
2005-12-29

Electroplating head and method for operating the same

#80
20050258046
2005-11-24

Plating method and apparatus for controlling deposition on predetermined portions of a workpiece

#81
20050230264
2005-10-20

Electroplating solution and method for electroplating

#82
20050211560
2005-09-29

Plating method

#83
20050205425
2005-09-22

Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents

#84
20050121329
2005-06-09

Thrust pad assembly for ECP system

#85
20050061659
2005-03-24

Plating apparatus and plating method

#86
20050034976
2005-02-17

Method and apparatus for plating and polishing semiconductor substrate

#87
20050016868
2005-01-27

Electrochemical mechanical processing apparatus

#88
15003784
2019-01-29

Interior plating and automated surface-deposition system