120991 ⎘
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces; Electroplating with moving electrodes Brush or pad plating
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
#2PLATING ELECTRODE AND PLATING METHOD THAT USES THE PLATING ELECTRODE
#3Film forming method for forming metal film and film forming apparatus for forming metal film
#4Film formation method for metallic coating and film formation device for metallic coating
#5Electroplating systems and methods
#6Controlled method for applying coating materials to complex heat transfer surfaces
#7Film forming method for metal film and film forming apparatus therefor
#8Apparatus and method of contact electroplating of isolated structures
#9METHOD FOR PRESERVING A MARK ON A METALLIC WORKPIECE
#10Method of forming nickel film and nickel solution used for the method
#11Electroplating systems and methods
#12Corrosion-resistant metal substrate
#13Apparatus and method of contact electroplating of isolated structures
#14Method for optically inscribing and/or marking round stock
#15Method of mirror coating an optical article and article thereby obtained
#16Film forming method for metal film and film forming apparatus therefor
#17Corrosion resistant coating composition of Ni and a phosphate corrosion inhibitor and an electrodeposition method for the manufacture thereof
#18Method of forming metal coating
#19ELECTRICAL DEPOSITION APPARATUS
#20Method for preserving a mark on a metallic workpiece
#21Electrodermal Activity Sensor
#22Hydrogel-mediated electropolymerization of conducting polymers
#23Film formation apparatus and film formation method forming metal film
#24COUNTERFEIT PROOFING OF PLATED POLYMERS
#25Metal coating film formation device and method
#26Non-contact strain measurement
#27In-situ balancing of plated polymers
#28BRUSH PLATING REPAIR METHOD FOR PLATED POLYMERS
#29Porous, flow-through consumable anodes for use in selective electroplating
#30ALUMINUM DEPOSITION DEVICES AND THEIR USE IN SPOT ELECTROPLATING OF ALUMINUM
#31Electrodeposition of thin-film cells containing non-toxic elements
#32Electroplating cell, and metal coating and method of forming the same
#33Device for electrochemical treatment, locally in particular, of a conductor substrate
#34Electrical brush plating system and method for metal parts
#35Methods for fabrication of orthodontic appliances and orthodontic appliances made thereby
#36Solid electrolyte/electrode assembly for electrochemical surface finishing applications
#37Flow-through consumable anodes
#38Methods for repairing steel components
#39METHOD FOR PRODUCING A CORROSION-RESISTANT, WORKABLE SHEET METAL WITH FULL-SURFACE COATING OF THE JOINED, THERMALLY TREATED STEEL SHEETS
#40Electrohydraulic and shear cavitation radial counterflow liquid processor
#41METHOD FOR ELECTROCHEMICAL COATING
#42METHOD FOR ELECTROCHEMICAL COATING OF A SUBSTRATE BY MEANS OF BRUSH PLATING AND DEVICE FOR CARRYING OUT SAID METHOD
#43Electrodeposition of thin-film cells containing non-toxic elements
#44PROCESS FOR THE PROTECTION OF A METAL SUBSTRATE FROM CORROSION AND ABRASION, AND METAL SUBSTRATE OBTAINED BY THIS PROCESS
#45Printed circuit board and method of manufacturing the same
#46Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method
#47REEL-TO-REEL PLATING OF CONDUCTIVE GRIDS FOR FLEXIBLE THIN FILM SOLAR CELLS
#48Plating methods for low aspect ratio cavities
#49Method and apparatus for plating semiconductor wafers
#50CATALYST-AIDED CHEMICAL PROCESSING METHOD AND APPARATUS
#51Web pressure welding method, pressure welding device, power supply method, power supply device, continuous electrolytic plating apparatus and method for manufacturing web with plated coating film
#52Selective electrochemical deposition of conductive coatings on fuel cell bipolar plates
#53Apparatus for plating semiconductor wafers
#54Topography reduction and control by selective accelerator removal
#55Topography reduction and control by selective accelerator removal
#56COATING METHOD AND ELECTROLYZING APPARATUS USED THEREFOR
#57Electroplating head and method for operating the same
#58Method for electrochemical plating and marking of metals
#59Electrohydraulic and shear cavitation radial counterflow liquid processor
#60ELECTROPLATING DEVICE AND METHOD
#61Method of plating metal onto titanium
#62Device and a method for metal plating
#63Method for producing a non-developable surface printed circuit and the thus obtained printed circuit
#64Apparatus and method for plating semiconductor wafers
#65TURBOMACHINE BLADE AND TURBOMACHINE COMPRISING THIS BLADE
#66Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
#67Electropolishing system and process
#68Catalyst-aided chemical processing method and apparatus
#69Electroplating apparatus
#70MEANS TO IMPROVE CENTER TO EDGE UNIFORMITY OF ELECTROCHEMICAL MECHANICAL PROCESSING OF WORKPIECE SURFACE
#71Method and apparatus for planarizing a substrate with low fluid consumption
#72FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURES
#73Methods and apparatus for fabricating conductive features on glass substrates used in liquid crystal displays
#74Method for controlling conductor deposition on predetermined portions of a wafer
#75Electrochemical processing of conductive surface
#76Plating device and planting method
#77In situ plating of electrical connector contacts
#78Method and apparatus for plating semiconductor wafers
#79Electroplating head and method for operating the same
#80Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
#81Electroplating solution and method for electroplating
#82Plating method
#83Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
#84Thrust pad assembly for ECP system
#85Plating apparatus and plating method
#86Method and apparatus for plating and polishing semiconductor substrate
#87Electrochemical mechanical processing apparatus
#88Interior plating and automated surface-deposition system