121009 ⎘
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces; After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
RHENIUM-COBALT ALLOY COMPOSITION AND PROCESS FOR EFFECTIVE METAL ELECTRODEPOSITION IN 3D-INTEGRATION
#2SURFACE-TREATED STEEL SHEET AND METHOD OF PRODUCING SAME
#3CHROMIUM-FREE PASSIVATED FILM-COVERED TINNED PLATE AND PREPARATION METHOD THEREFOR
#4METHOD FOR PASSIVATING A TINPLATE STRIP AND APPARATUS FOR PRODUCING SAID PASSIVATED TINPLATE STRIP
#5Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with plating film, and methods of producing the same
#6METAL MATERIAL, CONNECTION TERMINAL, AND METHOD FOR PRODUCING METAL MATERIAL
#7Sheet Metal Packaging Product with Textured Surface And Method of Producing Such a Sheet Metal Packaging Product
#8STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER
#9TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS, AND METHOD FOR PRODUCING CIRCUIT BOARD
#10METHOD FOR MANUFACTURING LAMINATED TINPLATE, A LAMINATED TINPLATE PRODUCED THEREBY AND USE THEREOF
#11Sn-based plated steel sheet
#12Terminal material for connector
#13Reflow Melting System and Terminal Production System
#14Plated product and method for producing same
#15Method for surface treatment of matte tinplated product
#16Manufacturing method of indium tin oxide
#17Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products
#18SELECTIVE ANTI-TARNISH COATING
#19COPPER OR COPPER ALLOY SHEET STRIP WITH SURFACE COATING LAYER
#20COPPER STRIP FOR MAKING ELECTRICAL CONTACTS AND PROCESS FOR PRODUCING A COPPER STRIP AND CONNECTOR
#21Terminal material with silver coating film and terminal with silver coating film
#22Tin or tin alloy plating solution and bump forming method
#23Sn-plated steel sheet and method for manufacturing Sn-plated steel sheet
#24AQUEOUS INDIUM OR INDIUM ALLOY PLATING BATH AND PROCESS FOR DEPOSITION OF INDIUM OR AN INDIUM ALLOY
#25HIGHLY CORROSION-RESISTANT POROUS METAL BODY
#26Conductive external connector structure and method of forming
#27METALLIZED COMPONENTS AND SURGICAL INSTRUMENTS
#28Tin-plated copper terminal material, terminal and electric wire terminal-end structure
#29Method of tin-plating copper alloy for electric or electronic parts and automobile parts and tin-plating material of copper alloy manufactured therefrom
#30CHEMICAL TREATMENT STEEL SHEET, AND METHOD FOR PRODUCING CHEMICAL TREATMENT STEEL SHEET
#31Electric contact and connector terminal pair
#32Tin-plated product and method for producing same
#33Conductive external connector structure and method of forming
#34METHOD FOR MANUFACTURING POROUS METAL BODY
#35HIGHLY CORROSION-RESISTANT POROUS METAL BODY AND METHOD FOR PRODUCING THE SAME
#36Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
#37Method of manufacturing tin-plated copper terminal material
#38Terminal fitting and connector
#39Metal plate for terminal, terminal, and terminal pair
#40COPPER ALLOY SHEET WITH SN COATING LAYER FOR A FITTING TYPE CONNECTION TERMINAL AND A FITTING TYPE CONNECTION TERMINAL
#41Steel sheet for container and method for producing steel sheet for container
#42Tin-plated product and method for producing same
#43Metal foil for electromagnetic shielding, electromagnetic shielding material and shielded cable
#44Steel sheet for containers, and method for producing steel sheet for containers
#45Proportional-Integral-Derivative Radio Frequencies Synchronized plasma Coupled Harmonic Closed Loop Feedback Oscilllator to Maintain a Constant Resonance Oscillating Harmonic Enhanced Exothermic Reaction Within Metal Lattice During Hydrogen Loading to Generating Efficient Exothermic Thermoelectric, Mechanical Power and Graphene Nano Tubes
#46Plated material and connecting terminal using same
#47Steel sheet for container and method for producing steel sheet for container
#48ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTION COMPONENT
#49Metallized components and surgical instruments
#50Terminal fitting and connector
#51Tin-plated copper-alloy terminal material
#52Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices
#53Mitigation of whisker growth in tin coatings by alloying with indium
#54Chemical treatment steel sheet, and method for producing chemical treatment steel sheet
#55Coated steel sheet, method for producing the same, and resin-coated steel sheet obtained using the same
#56Copper alloy for electronic/electric device, copper alloy plastic working material for electronic/electric device, and component and terminal for electronic/electric device
#57Chemical treatment steel sheet, and method for producing chemical treatment steel sheet
#58Separation of alpha emitting species from plating baths
#59Separation of alpha emitting species from plating baths
#60Separation of alpha emitting species from plating baths
#61SYNTHESIS OF SUPERCONDUCTING NB-SN
#62Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same
#63Method for producing a porous metal body
#64Tin-plated product and method for producing same
#65Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer
#66Electrical contact material, method of producing an electrical contact material, and terminal
#67Porous metal body and method for producing porous metal body
#68Copper alloy sheet strip with surface coating layer excellent in heat resistance
#69Copper alloy sheet strip with surface coating layer excellent in heat resistance
#70Terminal pair and connector pair including terminal pair
#71Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable
#72Semiconductor package and method of manufacturing thereof
#73Method for producing plated material, and plated material
#74Method of manufacturing a steel sheet for containers
#75Electric contact and connector terminal pair
#76Method for producing surface-treated steel sheet, surface-treated steel sheet, and organic resin coated metal container
#77Electric contact material for connector and method for producing same
#78Board terminal and board connector
#79Pipe connector and method
#80Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable
#81Porous metal body, method for manufacturing porous metal body, and fuel cell
#82METHOD FOR MANUFACTURING CHROMIUM-CHROMIUM OXIDE COATED SUBSTRATES
#83Porous metal body and method for producing same
#84Steel sheet for containers, and method for producing steel sheet for containers
#85Electrical contact element and method for manufacturing same
#86Solar cell metallisation and interconnection method
#87METHOD FOR PRODUCING A CHROMIUM COATING ON A METAL SUBSTRATE
#88Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
#89Electronic component metal material and method for manufacturing the same
#90Enhanced techniques for production of golden bronze by inter-diffusion of tin and copper under controlled conditions
#91TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAME
#92SURFACE TREATED PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMPONENTS
#93Electronic component metal material and method for manufacturing the same
#94Method for manufacturing product with bright surface
#95Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#96Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#97Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
#98Process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby
#99Coated substrate for packaging applications and a method for producing said coated substrate
#100Process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby
#101Polymer coated substrate for packaging applications and a method for producing said coated substrate
#102METHOD FOR IMPROVING A METAL COATING ON A STEEL STRIP
#103Electroplating baths of silver and tin alloys
#104Bath for surface treatment, method of producing surface-treated steel plate by using the bath for surface treatment, and surface treated steel plate produced by the same method
#105Metal material for electronic component and method for manufacturing the same
#106Electronic component and manufacturing method therefor
#107Non-vacuum method of manufacturing light-absorbing materials for solar cell application
#108Three-piece resealable can
#109Tin-plated copper-alloy material for terminal having excellent insertion/extraction performance
#110Method for enhancing corrosion resistance of a metallic coating on a steel strip or plate
#111Method for manufacturing Ni/In/Sn/Cu multilayer structure
#112Conductive member and method for producing the same
#113Thin-tin tinplate
#114Process for tin coating a metallic substrate, process for hardening a tin layer and wire having a tin coating
#115Sn-coated copper alloy strip having excellent heat resistance
#116Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same
#117Method for producing a mating-type connecting part
#118Method to Produce Golden Bronze by Diffusion of Tin Into Copper Under Controlled Conditions
#119Electroconductive material for connection component
#120Steel sheet for containers and manufacturing method for same
#121Steel sheet for containers
#122Steel sheet for containers and manufacturing method for same
#123Tin-plated copper-alloy material for terminal and method for producing the same
#124Flux method for tin and tin alloys
#125Process for producing an iron-tin layer on a packaging steel substrate
#126Seek scan probe (SSP) cantilever to mover wafer bond stop
#127Surface-treated steel plate
#128High-Temperature Solder with Multi-Layer Structure and Manufacturing Method Thereof
#129Electronic component
#130Reflow Sn plated material
#131SOLDERING PROCESS USING ELECTRODEPOSITED INDIUM AND/OR GALLIUM, AND ARTICLE COMPRISING AN INTERMEDIATE LAYER WITH INDIUM AND/OR GALLIUM
#132HIGH SPEED TIN PLATING PROCESS
#133Whisker-Free Coating Structure and Method for Fabricating the Same
#134Conductive member and method for producing the same
#135Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same
#136Method to form solder deposits on substrates
#137METHOD FOR INHIBITING GROWTH OF TIN WHISKERS
#138METHOD FOR PRODUCING TINNED STEEL SHEET, TINNED STEEL SHEET, AND CHEMICAL CONVERSION SOLUTION
#139Composite material for electric/electronic part, production method thereof, and electric/electronic part
#140Terminal for connector and method of producing the same
#141ELECTRICAL CONTACT ELEMENT AND A METHOD OF PRODUCING THE SAME
#142Plated steel sheet for cans
#143Metal material for electrical electronic component
#144Sn-PLATED MATERIALS FOR ELECTRONIC COMPONENTS
#145Terminal for engaging type connector
#146WHISKER-FREE COATING STRUCTURE AND METHOD OF FABRICATING THE SAME
#147PLATED MEMBER AND METHOD FOR MANUFACTURING THE SAME
#148Plated steel sheet for cans and production method thereof
#149Retainer for rolling bearing and rolling bearing
#150Sn-plated copper alloy strip having improved fatigue characteristics
#151METHOD OF MANUFACTURING ELECTRICALLY CONDUCTIVE STRIPS
#152High speed tin plating process
#153Terminal for engaging type connector
#154Metal duplex method
#155Metal duplex method
#156Acid electrolytes
#157Tin-plated film and method for producing the same
#158Electrocodeposition of lead free tin alloys
#159Method of forming a lead-free bump and a plating apparatus therefor