C25D7/0671 - CPC Classification Index

ClassID:

121031 ⎘

C25D7/0671 - CPC Classification

Classification description:

Electroplating characterised by the article coated; Wires; Strips; Foils; Strips or foils Selective plating

Sub-classes:

C25D7/0678 » {using masks} 15

Recent Application in this class:

20240234859

2024-07-11

HOLLOW COPPER THERMAL CONDUCTORS

20220010445

2022-01-13

CIRCUIT PATTERN CONTINUOUS MANUFACTURING DEVICE

20160183380

2016-06-23

Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

20160157356

2016-06-02

Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

20140291159

2014-10-02

Partial plating device and partial plating method

20090197164

2009-08-06

Plated steel plate for cell can, battery, alkaline dry battery

20090065364

2009-03-12

Plating method, light-transmitting electrically-conductive film and light-transmitting electromagnetic wave shield film

20080096044

2008-04-24

Plating Method, Electrically Conductive Film And Light-Transmitting Electromagnetic Wave Shielding Film