C25F3/30 - CPC Classification Index

#1

20250353136

2025-11-20

Polishing Pad Assembly for Electrochemical Mechanical Polishing

#2

20240035192

2024-02-01

Polishing Device for Indium Phosphide Substrate, and Polishing Process

#3

20230290899

2023-09-14

METHOD FOR PLANARIZING CIS-BASED THIN FILM, CIS-BASED THIN FILM MANUFACTURED USING THE SAME, AND SOLAR CELL COMPRISING CIS-BASED THIN FILM

#4

20210230765

2021-07-29

Controlled induced warping of electronic substrates via electroplating

#5

20190032240

2019-01-31

Distribution system for chemical and/or electrolytic surface treatment

#6

20160115613

2016-04-28

Apparatus and method for plating and/or polishing wafer

#7

20150247255

2015-09-03

Electrochemical polishing solution, process for electrochemically polishing graphite gate electrode and graphite gate electrode

#8

20150155183

2015-06-04

Method and apparatus for pulse electrochemical polishing

#9

20150090606

2015-04-02

Enhanced porosification

#10

20150090605

2015-04-02

Electro-polishing and porosification

#11

20150072599

2015-03-12

Nozzle for stress-free polishing metal layers on semiconductor wafers

#12

20140377953

2014-12-25

Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates

#13

20130327650

2013-12-12

Method and apparatus for electroplating

#14

20130075265

2013-03-28

APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROFEATURE WAFERS

#15

20110042224

2011-02-24

Apparatus and methods for electrochemical processing of microfeature wafers

#16

20100193374

2010-08-05

METHOD OF REAR SURFACE TREATMENT, ANALYSIS METHOD OF INTEGRATED CIRCUIT FROM REAR SURFACE SIDE, AND REAR SURFACE TREATMENT APPARATUS

#17

20100193373

2010-08-05

METHOD OF REAR SURFACE TREATMENT, ANALYSIS METHOD OF INTEGRATED CIRCUIT FROM REAR SURFACE SIDE, AND REAR SURFACE TREATMENT APPARATUS

#18

20100116672

2010-05-13

Method and apparatus for electroplating

#19

20100065819

2010-03-18

Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same

#20

20100044236

2010-02-25

Method and apparatus for electroplating

#21

20100038584

2010-02-18

Polishing Composition and Polishing Method Using the Same

#22

20090280649

2009-11-12

Topography reduction and control by selective accelerator removal

#23

20090280588

2009-11-12

METHOD OF FORMING AN ELECTRONIC DEVICE INCLUDING REMOVING A DIFFERENTIAL ETCH LAYER

#24

20090277867

2009-11-12

Topography reduction and control by selective accelerator removal

#25

20090277802

2009-11-12

Pad-assisted electropolishing

#26

20090266707

2009-10-29

Pad-assisted electropolishing

#27

20090107851

2009-04-30

Electrolytic polishing method of substrate

#28

20090020437

2009-01-22

Method and system for controlled material removal by electrochemical polishing

#29

20080213995

2008-09-04

Ultrasonic electropolishing of conductive material

#30

20080179180

2008-07-31

Apparatus and methods for electrochemical processing of microfeature wafers

#31

20080142375

2008-06-19

ELECTROLYTE FORMULATION FOR ELECTROCHEMICAL MECHANICAL PLANARIZATION

#32

20080045009

2008-02-21

METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIVE MATERIALS FROM MICROELECTRONIC SUBSTRATES

#33

20070089991

2007-04-26

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

#34

20060223425

2006-10-05

Semiconductor processing methods of removing conductive material

#35

20050189227

2005-09-01

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

#36

20050167274

2005-08-04

Tuning electrodes used in a reactor for electrochemically processing a microelectronics workpiece

#37

20050167273

2005-08-04

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

#38

20050020004

2005-01-27

Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates