162276 ⎘
Component parts of trickle coolers for distributing, circulating, and accumulating liquid Splashing boards or grids, e.g. for converting liquid sprays into liquid films; Elements or beds for increasing the area of the contact surface
Sub-classes:Evaporative cooling systems and methods of using
#2Modular cooling tower with screwless FRP exterior
#3Cooling tower fill structures
#4Heat exchanger
#5Installation element for use in the fields of cooling technology, water treatment or mass transfer and method for the manufacture of such an installation element
#6Bi-directional fill for use in cooling towers
#7Cooling tower drift eliminator
#8Gas distributor for heat exchange and/or mass transfer column
#9Asymmetric evaporator
#10Modular counterflow fill hanging system apparatus and method
#11Restoring cooling tower outlet fog into water cycle
#12Gas distributor for heat exchange and/or mass transfer column
#13CONTACTING DEVICE AND METHOD
#14Cooling tower nozzle and methods of assembly
#15Modular counterflow fill hanging system apparatus and method
#16Modular counterflow fill hanging system apparatus and method
#17HEAT EXCHANGER
#18Air-to-air atmospheric exchanger
#19Machine for descaling cellular bodies of an air-water heat exchanger
#20Silicon-containing steel compostition with improved heat exchanger corrosion and fouling resistance
#21Chromiun-enriched oxide containing material and preoxidation method of making the same to mitigate corrosion and fouling associated with heat transfer components
#22Installation element of an installed packing
#23Separation Method Using A Column With A Corrugated Cross Structure Packing For Separating A Gaseous Mixture
#24Splash bar apparatus and method
#25Chromium-enriched oxide containing material and preoxidation method of making the same to mitigate corrosion and fouling associated with heat transfer components
#26Reactor with packing mean
#27Insert and method for reducing fouling in a process stream
#28Silicon-containing steel composition with improved heat exchanger corrosion and fouling resistance
#29Method for improving interlevel dielectric gap filling over semiconductor structures having high aspect ratios
#30Cooling tower with high surface area packing