STRUCTURES FOR IN-SITU REFLECTANCE MEASUREMENT DURING HOMO-EPITAXY

METHOD OF INSPECTING SPECTRUM OF REFLECTED LIGHT FROM WORKPIECE, AND POLISHING APPARATUS

MEASUREMENT APPARATUS, MEASUREMENT METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

ENDPOINT DETECTION SYSTEM FOR ENHANCED SPECTRAL DATA COLLECTION

METHOD OF PRODUCING REFERENCE-SPECTRUM LIBRARY FOR USE IN ESTIMATION OF FILM THICKNESS OF WORKPIECE

FILM THICKNESS MEASURING DEVICE, FILM FORMING SYSTEM, AND FILM THICKNESS MEASURING METHOD

Coating Thickness Measuring Device and Coating Device Including the Same

SYSTEM AND METHOD TO MAP THICKNESS VARIATIONS OF SUBSTRATES IN MANUFACTURING SYSTEMS

Optical Sensor and Method for use in Detecting the Deposition of Material from a Fluid

METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANUFACTURING MACHINES

ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES

OPTICAL MONITORING DEVICE AND METHOD FOR CONTROLLING COATING THICKNESSES

THIN FILM, IN-SITU MEASUREMENT THROUGH TRANSPARENT CRYSTAL AND TRANSPARENT SUBSTRATE WITHIN PROCESSING CHAMBER WALL

METHOD AND APPARATUS FOR MICROMACHINING A SAMPLE USING A FOCUSED ION BEAM

ENDPOINT DETECTION SYSTEM FOR ENHANCED SPECTRAL DATA COLLECTION

IN-SITU WAFER THICKNESS AND GAP MONITORING USING THROUGH BEAM LASER SENSOR

FILM THICKNESS MEASURING DEVICE AND FILM THICKNESS MEASURING METHOD

MEASUREMENT OF MELT POOL POSITION IN ADDITIVE MANUFACTURING

Method and device for measuring the thickness of thin films even on rough substrates

PECVD process

ENDPOINT DETECTION METHOD FOR CHAMBER COMPONENT REFURBISHMENT

POLISHING APPARATUS AND POLISHING METHOD

Non-invasive quantitative multilayer assessment method and resulting multilayer component

System and method to map thickness variations of substrates in manufacturing systems

Plasma processing apparatus and plasma processing method

Endpoint detection system for enhanced spectral data collection

Etching method of etching apparatus

Optical metrology models for in-line film thickness measurements

FILM THICKNESS MEASURING DEVICE, FILM FORMING SYSTEM, AND FILM THICKNESS MEASURING METHOD

Etching apparatus and etching method thereof

Electrochemical deposition system including optical probes

OPTICAL CABLE FOR INTERFEROMETRIC ENDPOINT DETECTION

METHOD FOR INSPECTING NONAQUEOUS ELECTROLYTE SECONDARY BATTERY SEPARATOR, METHOD FOR PRODUCING NONAQUEOUS ELECTROLYTE SECONDARY BATTERY SEPARATOR, DEVICE FOR INSPECTING NONAQUEOUS ELECTROLYTE SECONDARY BATTERY SEPARATOR, DEVICE FOR PRODUCING NONAQUEOUS ELECTROLYTE SECONDARY BATTERY SEPARATOR, AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY SEPARATOR

Vacuum processing apparatus and vacuum processing method

Thin film, in-situ measurement through transparent crystal and transparent substrate within processing chamber wall

Adaptive control of coating thickness

Adaptive control of coating thickness

Adaptive control of coating thickness

Adaptive control of coating thickness

Methods and systems of optical inspection of electronic device manufacturing machines

Device for determining a layer thickness in a multilayer film

Semiconductor substrate measuring apparatus and plasma treatment apparatus using the same

ELECTRON BEAM PVD ENDPOINT DETECTION AND CLOSED-LOOP PROCESS CONTROL SYSTEMS

Device and method for measuring thickness

Optical monitor

PECVD process

Height detection apparatus and coating apparatus equipped with the same

Growth rate detection apparatus, vapor deposition apparatus, and vapor deposition rate detection method

Method of coating substrates

Non-invasive quantitative multilayer assessment method and resulting multilayer component

Broadband optical monitoring

Eliminating internal reflections in an interferometric endpoint detection system

Method for determining material removal and device for the beam machining of a workpiece

SYSTEM, APPARATUS AND METHOD FOR MONITORING OF SURFACE PROFILE AND THICKNESS MEASUREMENT IN THIN FILMS

Process for the manufacturing of a steel strip for packaging and associated equipment

Method and system for aligning a terahertz sensor system

Inspecting a multilayer sample

Method of manufacturing substrate for acoustic wave device

Adaptive control of coating thickness

Adaptive control of coating thickness

Adaptive control of coating thickness

Adaptive control of coating thickness

Polishing apparatus and polishing method

Film thickness measuring method and film thickness measuring device

System and method for high speed low noise in-process hyperspectral non-destructive evaluation for rapid composite manufacturing

Shape measurement method and shape measurement device

PECVD process

Height detection apparatus and coating apparatus equipped with the same

Predetermining the thickness of a coating

System and method for measurement of complex structures

Virtual sensor for chamber cleaning endpoint

ENGINEERING THE OPTICAL PROPERTIES OF AN INTEGRATED COMPUTATIONAL ELEMENT BY ION IMPLANTATION

Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus

Depth gauge

MEASUREMENT TOOL AND METHOD FOR MEASURING THICKNESS OF EVAPORATED FILM OF LARGE-SIZED SUBSTRATE

PECVD process

Sensor system and method for characterizing a stack of wet paint layers

Method and coating system for coating cavity walls

Film Thickness Control System, Film Thickness Control Method, Evaporation Device and Evaporation Method

Detection device for detecting thickness of vacuum-evaporated film and vacuum evaporation apparatus

Process for the manufacturing of a steel strip for packaging and associated equipment

PECVD process

Use of a full width array imaging sensor to measure real time film thicknesses on film manufacturing equipment

MONITORING SYSTEM FOR DEPOSITION AND METHOD OF OPERATION THEREOF

Measuring apparatus for determining distances to points on a reflective surface coated with metal and method for same

IN-SITU OPTICAL MONITORING OF FABRICATION OF INTEGRATED COMPUTATIONAL ELEMENTS

IN-PROCESS MONITORING OF COATINGS ON GLASS ARTICLES

Systems and methods to improve optical spectrum fidelity in integrated computational elements

Engineering the optical properties of an integrated computational element by ion implantation

Real-time monitoring of fabrication of integrated computational elements

In-situ monitoring of fabrication of integrated computational elements

PECVD process

Device and method for making dimensional measurements on multilayer objects such as wafers

Method and device for controllably revealing structures buried in objects such as wafers

PECVD apparatus and process

Sensor system and method for characterizing a wet paint layer

Sensor system and method for characterizing a coated body

Feedback of layer thickness timing and clearance timing for polishing control

Computer program product and method of controlling polishing of a substrate

Polishing apparatus and polished-state monitoring method

Device and method for monitoring a property of a coating of a solid dosage form during a coating of the solid dosage form

Apparatus and method for monitoring a thickness of a silicon wafer with a highly doped layer

Plasma processing apparatus and plasma processing method

Removing material from a workpiece with a water jet

Thickness change monitor wafer for in situ film thickness monitoring

PECVD process

In-line metrology system

Method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturing

Method to Determine the Thickness of a Thin Film During Plasma Deposition

In Situ Manufacturing Process Monitoring System of Extreme Smooth Thin Film and Method Thereof

Film thickness monitor

System and method for in situ monitoring of top wafer thickness in a stack of wafers

System and method for measuring layer thickness and depositing semiconductor layers

Method and apparatus for optically measuring by interferometry the thickness of an object

Measurement method and device for measuring layer thicknesses as well as production method and coating system

Method of controlling polishing

Construction of reference spectra with variations in environmental effects

METHOD FOR MEASURING LAYER THICKNESS BY MEANS OF LASER TRIANGULATION, AND DEVICE

METHOD AND SYSTEM FOR THE THICKNESS DATA DETERMINATION OF ULTRATHIN OPTICAL FILMS IN-SITU

Substrate polishing metrology using interference signals

Apparatus of etching glass substrate

Feedback control of polishing using optical detection of clearance

Thin films measurement method and system

ARRANGEMENT AND METHOD FOR MEASUREMENT OF THE TEMPERATURE AND OF THE THICKNESS GROWTH OF SILICON RODS IN A SILICON DEPOSITION REACTOR

Detection of layer clearing using spectral monitoring

In-line metrology system

Film thickness measurement device and measurement method

Determining Physical Property of Substrate

Methods and systems for control of a surface modification process

Test glass changing system

Apparatus and method for monitoring a thickness of a silicon wafer with a highly doped layer

Determining endpoint in a substrate process

Mobile Apparatus Capable of Surface Measurements

Monitoring system for the acquisition of the layer thickness of dust in ventilation ducts

Substrate polishing metrology using interference signals

INTEGRATED THIN FILM METROLOGY SYSTEM USED IN A SOLAR CELL PRODUCTION LINE

Continuous method for treating the surface of metal strips

Methods and compositions for treating bacterial infection

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

Method for the in-situ determination of the material composition of optically thin layers

Wavelength determining apparatus, method and program for thin film thickness monitoring light

Determining physical property of substrate

Substrate polishing metrology using interference signals

FILM DEPOSITION APPARATUS, FILM DEPOSITION METHOD, AND COMPUTER READABLE STORAGE MEDIUM

Dynamic Film Thickness Control System/Method and its Utilization

Dynamic Film Thickness Control System/Method and its Utilization

Device for stabilization and visual monitoring of an elongated metallic strip in a transport direction along a predetermined transport path

GST film thickness monitoring

Dynamic Film Thickness Control System/Method and its Utilization

Dynamic Film Thickness Control System/Method and its Utilization

Dynamic Film Thickness Control System/Method and its Utilization

Dynamic Film Thickness Control System/Method and its Utilization

Determining endpoint in a substrate process

Metrology for GST film thickness and phase

GOODNESS OF FIT IN SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING

Device and method for measuring microporous film on battery electrode plate, coater equipped with film measuring device, and coating method using film measuring method

Wavelength selection method, film thickness measurement method, film thickness measurement apparatus, and system for producing thin film silicon device

Thin films measurement method and system

Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device

Virtual measuring device and method

Film thickness measurement method, epitaxial wafer production process and epitaxial wafer

Use of fluorescent nanoparticles to measure individual layer thicknesses or composition in multi-layer films and to calibrate secondary measurement devices

Apparatus for detecting film delamination and a method thereof

Methods and apparatus for measuring substrate edge thickness during polishing

Etching process state judgment method and system therefor

Optical monitoring system for coating processes

Characterizing films using optical filter pseudo substrate

Method for the in-situ and real-time determination of the thickness, optical properties and quality of transparent coatings during their growth onto polymeric substrates and determination of the modification, activation and the modification depth of polymeric materials surfaces

Method and apparatus for measuring coating thickness with a laser

Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus

Determining physical property of substrate

Methods and apparatus for assigning a beam intensity profile to a gas cluster ion beam used to process workpieces

Measuring system for optical monitoring of coating processes

Substrate polishing metrology using interference signals

PLASMA PROCESSING APPARATUS

Dynamic film thickness control system/method and its utilization

Thin films measurement method and system

Method for monitoring film thickness, a system for monitoring film thickness, a method for manufacturing a semiconductor device, and a program product for controlling film thickness monitoring system

Interferometric endpoint determination in a substrate etching process

Determining physical property of substrate

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

Determining copper concentration in spectra

METHOD OF MEASURING THICKNESS OF LAYER IN IMAGE SENSOR AND PATTERN FOR THE SAME

Real-time system for monitoring and controlling film uniformity and method of applying the same

Apparatus for detection of thin films during chemical/mechanical polishing planarization

Optical film thickness controlling method, optical film thickness controlling apparatus, dielectric multilayer film manufacturing apparatus, and dielectric multilayer film manufactured using the same controlling apparatus or manufacturing apparatus

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

Method and apparatus for the treatment of a semiconductor wafer

Measuring layer thickness or composition changes

Dynamic film thickness control system/method and its utilization

Wavelength determining apparatus, method and program for thin film thickness monitoring light

Mobile apparatus capable of surface measurements

Method and system for monitoring component consumption

Integrated endpoint detection system with optical and eddy current monitoring

FILM FORMING DEVICE, AND PRODUCTION METHOD FOR OPTICAL MEMBER

Measuring layer thickness or composition changes

Film measuring device and method, coater equipped with film measuring device, and coating method using film measuring method

Device and method for measuring microporous film on battery electrode plate, coater equipped with film measuring device, and coating method using film measuring method

Optical emission interferometry for PECVD using a gas injection hole

Polishing assembly with a window

Spectrometer based multiband optical monitoring of thin films

Apparatus and Method for In-Situ Endpoint Detection for Chemical Mechanical Polishing Operations

Method for measuring thickness of thin film, method for forming polycrystal semiconductor thin film, method for manufacturing semiconductor device, apparatus for manufacturing the same, and method for manufacturing image display device

Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus

Monitoring apparatus and method for improving the accuracy and repeatability of electrochemical capacitance voltage (ECV) measurements

In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization

Method for simultaneously coating and measuring parts

Patterned wafer thickness detection system

Method for simultaneously coating and measuring parts

Process endpoint detection method using broadband reflectometry

Iso-reflectance wavelengths

Polishing pad with window and method of fabricating a window in a polishing pad

Integrated endpoint detection system with optical and eddy current monitoring

Apparatus for monitoring deposition processes

Apparatus and method for determining a thickness of a deposited material

Method and arrangement for the regulation of the layer thickness of a coating material on a web moved in its longitudinal direction

Systems and methods for fabricating thin films

System capable of determining applied and anodized coating thickness of a coated-anodized product

Microdevice processing systems and methods

Method and system for monitoring component consumption

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

MEASUREMENT SYSTEM FOR DETERMINING THE THICKNESS OF A LAYER DURING A PLATING PROCESS

Method and apparatus for monitoring optical characteristics of thin films in a deposition process

In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

System and method for measuring coating thickness

Method and apparatus for measuring thickness of thin film and device manufacturing method using same

Method for monitoring film thickness, a system for monitoring film thickness, a method for manufacturing a semiconductor device, and a program product for controlling film thickness monitoring system

Method and apparatus for measuring and monitoring coatings

Apparatus and method of detecting the electroless deposition endpoint