164400 ⎘
Aspects not specifically covered by any group under , e.g. of wheel alignment, caliper-like sensors; Caliper-like sensors for measurement of a wafer
Height detection apparatus and coating apparatus equipped with the same
#2Chip defect detection device and detection method
#3DEVICE AND METHOD FOR MEASURING HEIGHT IN THE PRESENCE OF THIN LAYERS
#4Height detection apparatus and coating apparatus equipped with the same
#5Sample observation method and sample observation device
#6Scatterometry system and method for generating non-overlapping and non-truncated diffraction images
#7Predictive wafer modeling based focus error prediction using correlations of wafers
#8Patterned wafer geometry measurements for semiconductor process controls
#9Scatterometry system and method for generating non-overlapping and non-truncated diffraction images
#10Method and apparatus for measuring shape and thickness variation of a wafer
#11METHOD AND APPARATUS OF ARRAYED, CLUSTERED OR COUPLED EDDY CURRENT SENSOR CONFIGURATION FOR MEASURING CONDUCTIVE FILM PROPERTIES