ClassID:

166846

G01L19/0076 - CPC Classification

Classification description:

Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges; Electrical connection means from the sensor to its support using buried connections

Recent Application in this class:
#1
20200075466
2020-03-05

Sensor device and method of manufacture

#2
20190265118
2019-08-29

Pressure sensor package

#3
20190254168
2019-08-15

Sensor device having printed circuit board substrate with built-in media channel

#4
20190202687
2019-07-04

Method for producing a stress-decoupled micromechanical pressure sensor

#5
20180343745
2018-11-29

Sensor device having printed circuit board substrate with built-in media channel

#6
20180305201
2018-10-25

MEMS integrated pressure sensor devices and methods of forming same

#7
20180172571
2018-06-21

DETERMINING FLUID DENSITY WITHIN A TANK

#8
20180113042
2018-04-26

Sensor for detecting one or more quantities of a fluid, in particular a pressure sensor

#9
20180029877
2018-02-01

Packages and methods of packaging sensors

#10
20170362077
2017-12-21

Cavity type pressure sensor device

#11
20170052084
2017-02-23

Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments

#12
20170038271
2017-02-09

Universal hermetically sealed button pressure sensor

#13
20160377496
2016-12-29

Pressure sensor device with a MEMS piezoresistive element attached to an in-circuit ceramic board

#14
20160320255
2016-11-03

3D stacked piezoresistive pressure sensor

#15
20160159644
2016-06-09

MEMS integrated pressure sensor devices and methods of forming same

#16
20150276512
2015-10-01

Capacitive pressure sensors for high temperature applications

#17
20150246807
2015-09-03

MEMS integrated pressure sensor devices and methods of forming same

#18
20150162264
2015-06-11

Package structure and fabrication method thereof

#19
20150137274
2015-05-21

Semiconductor sensor chips

#20
20150033878
2015-02-05

Method for producing a pressure sensor and corresponding sensor

#21
20140291850
2014-10-02

Method for manufacturing electronic devices

#22
20140123765
2014-05-08

Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments

#23
20140033824
2014-02-06

Pressure detection module and pressure sensor device having such a pressure detection module

#24
20130241012
2013-09-19

Eutectic bonding of thin chips on a carrier substrate

#25
20130118265
2013-05-16

MEMS capacitive pressure sensor, operating method and manufacturing method

#26
20130099382
2013-04-25

Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough

#27
20130042694
2013-02-21

Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments

#28
20120104518
2012-05-03

Pressure sensor

#29
20120037412
2012-02-16

Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough

#30
20120032283
2012-02-09

Sensor module

#31
20110256652
2011-10-20

Method for forming a transducer

#32
20110068421
2011-03-24

Integrated MEMS and ESD protection devices

#33
20100155866
2010-06-24

High temperature resistant solid state pressure sensor

#34
20100139410
2010-06-10

Micromechanical pressure sensing device

#35
20100065934
2010-03-18

Transducer with fluidly isolated connection

#36
20090203163
2009-08-13

Method for making a transducer

#37
20090108382
2009-04-30

Transducer for use in harsh environments

#38
20080178680
2008-07-31

Micromechanical pressure sensing device

#39
20050229710
2005-10-20

Capacitive sensor