166868 ⎘
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges; Housings Monolithic housings, e.g. molded or one-piece housings
Pressure Sensor and Pressure Interface Thereof
#2PRESSURE SENSOR
#3STRUCTURE AND METHOD TO CREATE A PORT ON THE EDGE OF A PRESSURE SENSOR PACKAGE
#4PRESSURE SENSOR APPARATUS
#5OUTER HOUSING FOR PRESSURE MONITORING SYSTEM
#6PRESSURE SENSOR AND BOREHOLE SYSTEM
#7DIFFERENTIAL PRESSURE SENSOR FOR DETERMINING THE DIFFERENTIAL PRESSURE BETWEEN TWO PRESSURES
#8Sensor Module Having an Intermediate Pedestal on Which One or More Die Are Mounted
#9SENSOR DEVICE
#10Arch bracket for diaphragm pressure gauge
#11Pressure monitoring system and housing therefor
#12Systems and methods for pressure sensor assembly including improved encapsulation material
#13Flexible printed wiring board, joined body, pressure sensor and mass flow controller
#14Electronic pressure and temperature sensor for a fluid media
#15Pressure sensor for evaporated fuel leak detector
#16Mechanical formwork pressure sensor for in-situ measurement of fluid pressure during concrete matertal placement and method of using the same
#17Method for manufacturing pressure-sensitive sensor, pressure-sensitive sensor manufacturing equipment, and pressure-sensitive sensor
#18Targeted antimicrobials and related compositions, methods and systems
#19Housing with pressure compensating element
#20Pressure sensor assembly and measurement transducer for process instrumentation with the pressure sensor assembly
#21Pressure monitor housing with cap-engaging projection
#22Manifold for measuring differential pressure on a gas meter
#23Electronic pressure sensor for measurement of pressure in a fluid media
#24Pipe sensors
#25Pressure detection device with noise resistant pressure sensor
#26Sensor package and a method of manufacturing a sensor package
#27Knock sensor with lower collar bored with attachment holes
#28Rectangular snap fit pressure sensor unit
#29Pressure sensor unit with rectangular gasket
#30MEMS pressure sensor with multiple sensitivity and small dimensions
#31Method for manufacturing pressure-sensitive sensor, pressure-sensitive sensor manufacturing equipment, and pressure-sensitive sensor
#32Pressure sensor
#33Low profile pressure sensor on the body of a vehicle
#34Optically powered remotely interrogated liquid gauging system
#35Method for the manufacturing of a carrying device, carrying device, system for detection of a physical parameter and method for detection of a physical parameter
#36Micro flexible force sensor
#37Sensor device with media channel between substrates
#38Bond pad protection for harsh media applications
#39MEMS sensor package systems and methods
#40Pressure sensor and manufacture method thereof
#41PRESSURE SENSOR SYSTEM
#42Cavity type pressure sensor device
#43Electronic pressure sensor for measurement of pressure in a fluid media
#44Semiconductor pressure sensor including improved structure and integrated sensor chip
#45Micromechanical pressure sensor
#46Pressure sensor system
#47MEASUREMENT SENSOR
#48Pressure sensor for recording a pressure of a fluid medium
#49Sensor module for measuring a pressure of a fluid with at least one electronic circuit, particularly an integrated circuit, arranged on a circuit carrier, and at least one pressure measuring chip
#50Pressure Sensor System
#51Electronic device and method for manufacturing the same
#52Multi-die sensor device
#53Sensor arrangement
#54Integrated sensor chip package with directional light sensor, apparatus including such a package and method of manufacturing such an integrated sensor chip package
#55Fluid pressure sensor
#56Quick-release coupling
#57Piezoresistive transducer with low thermal noise
#58Combined pressure and humidity sensor
#59MEMS sensor package systems and methods
#60LOW STRESS COMPONENT PACKAGE
#61Capacitive pressure sensor in an overmolded package
#62Sensor package
#63Packaged sensor structure having sensor opening and package opening aligned with sensor element
#64Manufacturing method of molded package
#65Knocking sensor
#66Dual port pressure sensor
#67Method of making a dual port pressure sensor
#68Methods for fabricating sensor device package using a sealing structure
#69Component support and assembly having a MEMS component on such a component support
#70Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed
#71Relative pressure sensor
#72Sensor device having a structure element
#73Device for use as dual-sided sensor package
#74EXTRUSION-COATING METHOD FOR A SENSOR DEVICE AND SENSOR DEVICE
#75Pressure sensor and method for manufacturing a pressure sensor
#76Pressure sensor package systems and methods
#77Inductively coupled pressure sensor
#78Device and method for producing a device
#79Lead Frame and Method of Producing Lead Frame
#80Semiconductor package structure and package process
#81Method for forming a transducer
#82Ultra miniature pressure sensor
#83Semiconductor chip arrangement with sensor chip and manufacturing method
#84Pressure sensor device
#85Molded differential PRT pressure sensor
#86Targeted antimicrobials and related compositions, methods and systems
#87Pressure sensor for side-impact sensing and method for forming a surface of a protective material for a pressure sensor
#88Pressure sensor package
#89Sensor device having a porous structure element
#90Sensor device and manufacturing method thereof
#91Exposed pad backside pressure sensor package
#92Semiconductor device and manufacturing method therefor
#93High temperature resistant solid state pressure sensor
#94DIFFERENTIAL-PRESSURE SENSOR SYSTEM AND CORRESPONDING PRODUCTION METHOD
#95Pressure sensing module having an integrated seal plate and method of assembling pressure sensing module
#96PHYSICAL QUANTITY SENSING APPARATUS HAVING AN INTERNAL CIRCUIT, A FILTER CIRCUIT HAVING RESISTORS, POWER SUPPLY, GROUNDING, AND OUTPUT PADS, WITH THE LENGTH AND WIDTH OF WIRING BETWEEN THE OUTPUT OR POWER SUPPLY PAD AND THE INTERNAL CIRCUIT SET SO THAT THE RESISTANCE OF RESISTORS AND THE PARASITIC RESISTANCE COMPONENT OF THE WIRING SATISFY A CERTAIN RELATIONAL EXPRESSION
#97Sensor module and method for producing a sensor module
#98Transducer with fluidly isolated connection
#99Integrated circuit encapsulation and method therefor
#100Sensor device including two sensors embedded in a mold material
#101Pressure sensor for measuring pressure in a medium
#102Conductive elastomeric seal and method of fabricating the same
#103APPARATUS FOR PASSIVATING A COMPONENT AND METHOD FOR PRODUCING THE APPARATUS
#104Device for recording the pressure and the temperature in an intake manifold of an internal combustion engine
#105Pressure sensing device package and manufacturing method thereof
#106Multi-chip package
#107INTEGRATED MECHANICAL PACKAGE DESIGN FOR COMBI SENSOR APPARATUS
#108Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates
#109Pressure sensor module and method for manufacturing the same
#110Lead frame and package of semiconductor device
#111Semiconductor pressure sensor
#112Integrated circuit package
#113Method for making a transducer
#114Molded Sensor Package and Assembly Method
#115Electrical device and method
#116Transducer for use in harsh environments
#117SENSOR ARRAY HAVING A SUBSTRATE AND A HOUSING, AND METHOD FOR MANUFACTURING A SENSOR ARRAY
#118Pressure sensor and method for manufacturing the same
#119Pressure sensor with water restriction plate
#120Device structure with preformed ring and method therefor
#121Pressure sensor with sensing chip protected by protective material
#122Dual pressure sensor apparatus
#123Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor
#124Differential pressure sensing device and fabricating method therefor
#125Method for mounting semiconductor chips, and corresponding semiconductor chip system
#126Pressure sensor apparatus and pressure sensor housing
#127Micro electro-mechanical system module package
#128Packaging of hybrid integrated circuits
#129Differential pressure sensor having symmetrically-provided sensor chips and pressure introduction passages
#130Integrated circuit encapsulation and method therefor
#131Integrated circuit having a semiconductor sensor device with embedded column-like spacers
#132Sensor assembly with insert molded bead
#133Semiconductor pressure sensor and die for molding a semiconductor pressure sensor
#134Semiconductor package and process for making the same
#135Ultra miniature pressure sensor
#136Ultra miniature pressure sensor
#137Method for detecting a pressure of a medium and pressure measuring device
#138Semiconductor sensor device with sensor chip and method for producing the same
#139Semiconductor pressure sensor
#140Analog data-input device provided with a pressure sensor of a microelectromechanical type
#141SEMICONDUCTOR APPARATUS AND PHYSICAL QUANTITY SENSING APPARATUS
#142Diaphragm-type pressure sensing apparatus
#143Method of manufacturing a cavity package
#144Piezoresistive strain concentrator
#145Piezoresistive strain concentrator
#146Ultra miniature pressure sensor
#147Sensor device
#148Differential pressure detection type pressure sensor and method for manufacturing the same
#149Sensor packages and methods of making the same
#150Safety module and measuring arrangement with safety module
#151Method for mounting semiconductor chips and corresponding semiconductor chip system
#152Pressure transmitter and a method of making a pressure transmitter from a sensor unit and a body part
#153Method for packaging semiconductor chips and corresponding semiconductor chip system
#154Surface mount package and method for forming multi-chip microsensor device
#155Pressure sensor, flowmeter electronic component, and method for manufacturing the same
#156Pressure measuring device