168119 ⎘
Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light; Systems specially adapted for particular applications; Investigating thin films, e.g. matrix isolation method Mutilayers
INSPECTION DURING THE MANUFACTURE OF MODULES OR PRECURSORS OF MODULES
#2DEFECT INSPECTION SYSTEM AND DEFECT INSPECTION METHOD
#3MEASUREMENT APPARATUS AND MEASUREMENT METHOD
#4WEB EDGE METROLOGY
#5TERAHERTZ WAVE DETECTION CHIP AND TERAHERTZ WAVE DETECTION SYSTEM
#6Cylindrical shell detection method and cylindrical shell detection device
#7Part quality monitoring in a stereolithographic additive manufacturing system
#8METHOD FOR EVALUATING ADHESION RELIABILITY AND HEAT RADIATION PERFORMANCE OF COMPOSITE, AND COMPOSITE
#9Making and inspecting a web of vitreous lithium sulfide separator sheet and lithium electrode assemblies and battery cells
#10Method for determining the composition of a multi-layer system showing a predetermined colour flip-flop effect
#11Web edge metrology
#12Part quality monitoring in a stereolithographic additive manufacturing system
#13Measuring deflection to determine a characteristic of a cantilever
#14Method for detecting defects in thin film layers
#15Inspection of bonding quality of transparent materials using optical coherence tomography
#16Non-destructive method for measuring thickness of three-layered reinforced hydrogen ion exchange membrane for fuel cell
#17Measuring deflection to determine a characteristic of a layered-material strip
#18Measuring deflection to determine a characteristic of a cantilever
#19Method of forming enhanced super-resolution image
#20Method to determine properties of a coating on a transparent film, method for manufacturing a capacitor film and device to determine properties of a coating on a transparent film
#21Methods and systems for measurement of thick films and high aspect ratio structures
#22Systems and methods for determining characteristics of semiconductor devices
#23FIELD-BIASED NONLINEAR OPTICAL METROLOGY USING CORONA DISCHARGE SOURCE
#24APPARATUS AND METHOD FOR TIME-RESOLVED CAPTURE OF PULSED ELECTROMAGNETIC RADIO FREQUENCY RADIATION
#25Detection system for a multilayer film and method thereof using dual image capture devices for capturing forward scattered light and back scattered light
#26Inspection system, inspection device, and inspecting method
#27Apparatus and method for measurement of multilayer structures
#28Manufacturing process for integrated computational elements
#29Systems and methods for metrology with layer-specific illumination spectra
#30Growth-rate measuring apparatus and growth-rate detection method
#31Methods and systems for measurement of thick films and high aspect ratio structures
#32CHARACTERIZATION OF MULTILAYER STRUCTURES
#33Three-dimensional imaging for semiconductor wafer inspection
#343D printer with hovering printing head or printing bed
#35Arrangement for spatially resolved determination of the specific electrical resistance and/or the specific electrical conductivity of samples
#36Sensor system and method for characterizing a stack of wet paint layers
#37Systems and methods for quality control of a periodic structure
#38Optical element, article, and method of producing optical element
#39Method for detecting bonding failure part and inspection system
#40Arrangement for determining properties and/or parameters of a sample and/or of at least one film formed on the surface of a sample
#41Apparatus and methods for probing a material as a function of depth using depth-dependent second harmonic generation
#42Systems and Methods to Reduce Delamination In Integrated Computational Elements Used Downhole
#43TEMPERATURE-DEPENDENT FABRICATION OF INTEGRATED COMPUTATIONAL ELEMENTS
#44In-situ spectroscopy for monitoring fabrication of integrated computational elements
#45Method and system for determining and verifying ply orientation of a composite laminate
#46Scanning interferometry technique for through-thickness evaluation in multi-layered transparent structures
#47Multilayer ceramic electronic component
#48Inspecting apparatus for inspecting a multilayer structure
#49Composite inspection and structural check of multiple layers
#50Method and system for the ply-by-ply machining of a component made of composite material, by applying energy
#51Method and device for nondestructive testing of material health especially in the fillets of a composite part
#52Computer program product and method of controlling polishing of a substrate
#53Method for detecting buried layers
#54Methods and systems for inspection of composite irregularities
#55Method and apparatus for measuring damage to an organic layer of a thin film encapsulation
#56Resin article
#57Photon doppler velocimetry for laser bond inspection
#58Method of detecting volatile organic compounds
#59Resin article
#60Resin article
#61Method and apparatus for supervision of optical material production
#62Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layer
#63Combining X-ray and VUV analysis of thin film layers
#64Method of controlling polishing
#65Construction of reference spectra with variations in environmental effects
#66APPARATUS AND METHOD FOR MEASURING CHARACTERISTICS OF MULTI-LAYERED THIN FILMS
#67POSITION-SENSITIVE METROLOGY SYSTEM
#68Method for measuring and method for viewing a wave surface using spectrophotometry
#69Device and method for determining a piece of polarization information and polarimetric imaging device
#70Device and method for determining a piece of polarisation information and polarimetric imaging device
#71Laser ultrasonic multi-component imaging
#72Apparatus and method for enhancing the electromagnetic signal of a sample
#73Thin film interference filter and bootstrap method for interference filter thin film deposition process control
#74Use of fluorescent nanoparticles to measure individual layer thicknesses or composition in multi-layer films and to calibrate secondary measurement devices
#75Multiple measurement techniques including focused beam scatterometry for characterization of samples
#76PROPERTY DETERMINATION WITH LIGHT IMPINGING AT CHARACTERISTIC ANGLE
#77Surface defect inspection apparatus
#78Thin Film Interference Filter and Bootstrap Method for Interference Filter Thin Film Deposition Process Control
#79System and method for counting number of layers of multilayer object by means of electromagnetic wave
#80Systems and methods for metrology with layer-specific illumination spectra