168261 ⎘
Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light; Systems specially adapted for particular applications; Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined; Inspecting patterns on the surface of objects for PCB's Through-holes
Systems and methods for semiconductor chip hole geometry metrology
#2Signal sectioning for profiling printed-circuit-bord vias with vertical scanning interferometry
#3Printed circuit board
#4Device and method for measuring via hole of silicon wafer
#5Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed Laminate
#6Apparatus for inspecting printed circuit board
#7Method for measuring via bottom profile
#8Charged particle beam processing system with visual and infrared imaging
#9System and method for via structure measurement
#10Inspection method
#11OPTICALLY MONITORING AN ALOX FABRICATION PROCESS
#12Apparatus and methods for the inspection of microvias in printed circuit boards