169714 ⎘
Features of devices classified in; Scanning Monitoring and controlling the scan
Sub-classes:INSPECTION DURING THE MANUFACTURE OF MODULES OR PRECURSORS OF MODULES
#2METHOD FOR QUALITY INSPECTION OF ETCHING PASTE MATERIAL BASED ON SPECTRAL RESPONSE DIFFERENCE
#3IMPLEMENTING OBLIQUE VIEW IMAGING SYSTEMS FOR DIE BONDING INSPECTION
#4INSPECTION APPARATUS, METHOD OF INSPECTION USING THE INSPECTION APPARATUS, AND ELECTRONIC DEVICE MANUFACTURED USING THE INSPECTION APPARATUS
#5SEMICONDUCTOR MEASUREMENT APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SEMICONDUCTOR MEASUREMENT APPARATUS
#6DUAL FREQUENCY COMB IMAGING SPECTROSCOPIC ELLIPSOMETER
#7APPARATUS AND METHOD FOR MEASURING WAFERS
#8PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
#9Optimal parameter selection for structured light metrology
#10SAMPLE OBSERVATION DEVICE AND SAMPLE OBSERVATION METHOD
#11Process tool for analyzing bonded workpiece interface
#12Method and device for inspecting a semiconductor device
#13Scanning trajectories for region-of-interest tomograph
#14SPECTROSCOPY APPARATUS AND METHODS
#15Sample substance molecular bonds breakdown and SEL collection
#16Dynamic focusing confocal optical scanning system
#17Body scanner system and method for scanning a person
#18Control device of image reading apparatus, operation method thereof, and image detection system
#19System and method for inducing and detecting multi-photon processes in a sample
#20Optical element rotation type Mueller-matrix ellipsometer and method for measuring Mueller-matrix of sample using the same
#21Metrology optimized inspection
#22Data acquisition method using a laser scanner
#23Fine particle optical measuring method in fluidic channels
#24Optical mode analysis with design-based care areas