169117 ⎘
Investigating or analysing materials by specific methods not covered by groups - Grinding-materials
Method for evaluating abrasive grains, and method for manufacturing silicon wafer
#2Device for detecting profile in refiner and method therefore
#3Method Of Determining Wear Abrasion Resistance Of Polycrystalline Diamond Compact (PDC) Cutters
#4Non-destructive leaching depth measurement using capacitance spectroscopy
#5Method and apparatus to assess the thermal damage caused to a PCD cutter using capacitance spectroscopy
#6Use of capacitance to analyze polycrystalline diamond
#7Use of Capacitance And Eddy Currents to Analyze Polycrystalline Diamond
#8Use of Eddy Currents to Analyze Polycrystalline Diamond
#9Apparatus for measuring the crushing strength of micron superabrasives
#10Detection of one or more interstitial constituents in a polycrystalline diamond element using radiation