Patents-Review.com
ClassID:

171104 ⎘

G01P2015/088 - CPC Classification

Classification description:

Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system for providing wafer-level encapsulation

Recent Application in this class:
#1
20200379004
2020-12-03

Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element

 #2
20190369137
2019-12-05

Physical quantity sensor, composite sensor, inertial measurement unit, vehicle positioning device, portable electronic device, electronic device, vehicle, traveling supporting system, display device, and manufacturing method for physical quantity sensor

 #3
20190226848
2019-07-25

INTEGRATED MOTION PROCESSING UNIT (MPU) WITH MEMS INERTIAL SENSING AND EMBEDDED DIGITAL ELECTRONICS

 #4
20190004084
2019-01-03

Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element

 #5
20180312397
2018-11-01

Method for manufacturing a micromechanical inertial sensor

 #6
20180093883
2018-04-05

Micromechanical component

 #7
20160131680
2016-05-12

Capacitive physical quantity sensor

 #8
20160103149
2016-04-14

Capacitive physical quantity sensor

 #9
20150192416
2015-07-09

Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics

 #10
20150059475
2015-03-05

Electronic device having a cover in which a penetration hole is provided and manufacturing method of electronic device

 #11
20150035093
2015-02-05

Inertial and pressure sensors on single chip

 #12
20140339654
2014-11-20

Micropatterned component and method for manufacturing a micropatterned component

 #13
20140311242
2014-10-23

Multi-axis integrated MEMS inertial sensing device on single packaged chip

 #14
20120256282
2012-10-11

MEMS sensor device with multi-stimulus sensing

 #15
20120253738
2012-10-04

Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics

 #16
20120043627
2012-02-23

Method of producing a microelectromechanical (MEMS) sensor device

 #17
20120038963
2012-02-16

MEMS device and method of manufacturing MEMS device

 #18
20110314913
2011-12-29

MEMS tunneling accelerometer

 #19
20110291208
2011-12-01

ELEMENT STRUCTURE, INERTIA SENSOR, AND ELECTRONIC DEVICE

 #20
20110250760
2011-10-13

Method for manufacturing a micro-electromechanical structure

 #21
20110227174
2011-09-22

Semiconductor physical quantity sensor

 #22
20110133295
2011-06-09

Region divided substrate and semiconductor device

 #23
20110126632
2011-06-02

Laterally integrated MEMS sensor device with multi-stimulus sensing

 #24
20100242600
2010-09-30

Vertically integrated MEMS acceleration transducer

 #25
20090007661
2009-01-08

Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics