ClassID:

171217

G01R1/0458 - CPC Classification

Classification description:

Details of instruments or arrangements of the types included in groups  -  and; General constructional details; Housings; Supporting members; Arrangements of terminals; Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets; Sockets for IC's or transistors; Details related to environmental aspects, e.g. temperature

Recent Application in this class:
#1
20260140167
2026-05-21

SEMICONDUCTOR TEST APPARATUS

#2
20260104449
2026-04-16

ACTIVE THERMAL INTERPOSER DEVICE WITH THERMAL ISOLATION STRUCTURES

#3
20260079176
2026-03-19

PACKAGE RETENTION IN A TEST SOCKET BY A PRESSURIZED FLUID

#4
20260056228
2026-02-26

SIGNAL TRSANSMISSION CONNECTOR

#5
20260043828
2026-02-12

TEST SOCKET ASSEMBLIES COOLED WITH GASEOUS FLUID FOR SEMICONDUCTOR INTEGRATED CIRCUITS

#6
20260029462
2026-01-29

SEMICONDUCTOR PACKAGE HEAT GENERATION SIMULATION UNIT FOR CHECKING HEAT DISTRIBUTION OF BURN-IN BOARD AND METHOD FOR ACQUIRING HEAT DISTRIBUTION OF BURN-IN BOARD USING THE SAME

#7
20260002985
2026-01-01

TEST INTERCONNECT TEMPERATURE CONTROL WITH GAS FLOW

#8
20250377378
2025-12-11

AUTOMATED SOCKET ACTUATION OF A SEMICONDUCTOR DEVICE PROGRAMMER

#9
20250231218
2025-07-17

TEST SOCKET

#10
20250189558
2025-06-12

ELECTRICAL SOCKET WITH AN IMPROVED ELEVATING MECHANISM FOR A HEATING-DISSIPATION ASSEMBLY

#11
20250176144
2025-05-29

HEAT DISSIPATION STRUCTURE

#12
20250130252
2025-04-24

Semiconductor Module Inspection Device

#13
20250093408
2025-03-20

ACTIVE THERMAL INTERPOSER DEVICE

#14
20250052782
2025-02-13

INSPECTION SOCKET

#15
20250040095
2025-01-30

PHASE-CHANGE TEMPERATURE REGULATING SYSTEM AND ELECTRONIC COMPONENT TESTING APPARATUS AND METHOD

#16
20250027987
2025-01-23

INSPECTION SYSTEM WITH THERMAL INTERFACE, AND ELECTRONIC COMPONENT INSPECTION DEVICE AND METHOD

#17
20240183898
2024-06-06

ACTIVE THERMAL INTERPOSER DEVICE WITH THERMAL ISOLATION STRUCTURES

#18
20240183879
2024-06-06

SOCKET DEVICE FOR TESTING ICs

#19
20240183878
2024-06-06

TEST SYSTEM FOR TESTING SEMICONDUCTOR DEVICES

#20
20240168055
2024-05-23

TEST SOCKET FOR AND A METHOD OF TESTING ELECTRONIC COMPONENTS, IN PARTICULAR HIGH-POWER SEMICONDUCTOR COMPONENTS

#21
20240159793
2024-05-16

IC INSPECTION SOCKET

#22
20240151746
2024-05-09

POGO PIN COOLING SYSTEM AND METHOD AND ELECTRONIC DEVICE TESTING APPARATUS HAVING THE SYSTEM

#23
20240077530
2024-03-07

TEST BOARD, AND DIAGNOSTIC SYSTEM, DIAGNOSTIC METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM STORING DIAGNOSTIC PROGRAM OF THE TEST BOARD

#24
20240006162
2024-01-04

Plasma reactor having array of coaxial multiple pins and processing low temperature plasma at high efficiency

#25
20240003967
2024-01-04

Active thermal interposer device

#26
20230408545
2023-12-21

Heat exchanger for thermal control of heat producing devices

#27
20230400478
2023-12-14

Liquid cooling system, liquid cooling method and electronic device-testing apparatus having the system

#28
20230366926
2023-11-16

Probe apparatus for testing semiconductor devices

#29
20230366910
2023-11-16

Testing devices and method for testing semiconductor devices

#30
20230349949
2023-11-02

Multi-beam cantilever style contact pin for IC testing

#31
20230305053
2023-09-28

Electronic component handling apparatus and electronic component testing apparatus

#32
20230148124
2023-05-11

Apparatus for the Temperature Control of a Substrate and Corresponding Production Method

#33
20230131189
2023-04-27

Test carrier

#34
20230129112
2023-04-27

Active thermal interposer device

#35
20230048515
2023-02-16

Chip testing apparatus

#36
20230047762
2023-02-16

Test socket assemblies with liquid cooled frame for semiconductor integrated circuits

#37
20230022501
2023-01-26

Multistory electronic device testing apparatus

#38
20220404394
2022-12-22

Test socket having an automated lid

#39
20220365129
2022-11-17

Thermal sensor

#40
20220326299
2022-10-13

Test system including active thermal interposer device

#41
20220268831
2022-08-25

DUT placement and handling for active thermal interposer device

#42
20220206059
2022-06-30

Low-thermal resistance pressing device for a socket

#43
20220187361
2022-06-16

Testing system including active thermal interposer device

#44
20220178991
2022-06-09

Active thermal interposer device

#45
20220178983
2022-06-09

Electronic device characterization systems and methods

#46
20220146550
2022-05-12

Chuck unit and method for controlling temperature of the chuck unit

#47
20220128625
2022-04-28

Thermal control system for an automated test system

#48
20220128598
2022-04-28

Modular automated test system

#49
20220128597
2022-04-28

Test site configuration in an automated test system

#50
20220082587
2022-03-17

Test and burn-in apparatus that provides variable thermal resistance

#51
20210408719
2021-12-30

Frame for contact unit and socket

#52
20210341533
2021-11-04

IC socket for semiconductor

#53
20210293877
2021-09-23

Method and apparatus for conducting burn-in testing of semiconductor devices

#54
20210181288
2021-06-17

Test apparatus which tests semiconductor chips

#55
20210151361
2021-05-20

Latch assembly, heat sink assembly, and computer product incorporating the same

#56
20210096156
2021-04-01

Heating device for carrying out temperature-dependent tests on electronic components arranged in a socket

#57
20210063436
2021-03-04

Socket side thermal system

#58
20200388513
2020-12-10

Apparatus for the Temperature Control of a Substrate and Corresponding Production Method

#59
20200355740
2020-11-12

Testing apparatus

#60
20200241582
2020-07-30

Electronic component handling device and electronic component testing apparatus

#61
20200241040
2020-07-30

Electronic component handling device and electronic component testing apparatus

#62
20200233029
2020-07-23

History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad

#63
20200049736
2020-02-13

Contact and socket device for testing semiconductor

#64
20190324081
2019-10-24

Apparatus for testing an optoelectronic device and method of operating the same

#65
20190324056
2019-10-24

System for testing devices inside of carriers

#66
20190250188
2019-08-15

Semiconductor test system with flexible and robust form factor

#67
20190207351
2019-07-04

Socket for electrical component

#68
20190204378
2019-07-04

Burn-in test apparatus for semiconductor devices

#69
20190120896
2019-04-25

Electrical connector assembly having fan support thereon

#70
20190072583
2019-03-07

Kelvin contact finger for high current testing

#71
20190064258
2019-02-28

Testing system for semiconductor package components and its thermal barrier layer element

#72
20180340974
2018-11-29

DUT testing with configurable cooling control using DUT internal temperature data

#73
20180313888
2018-11-01

Method for continuous tester operation during multiple stage temperature testing

#74
20180259573
2018-09-13

Device testing using dual-fan cooling with ambient air

#75
20180241142
2018-08-23

Electrical contact terminal and electronic component socket

#76
20180196084
2018-07-12

Socket side thermal system

#77
20180113151
2018-04-26

Dew resistant module for test socket and electronic component testing device having the same

#78
20180088171
2018-03-29

Method for protecting an electronic circuit board

#79
20180031668
2018-02-01

Test apparatus which tests semiconductor chips

#80
20180024162
2018-01-25

Temperature-controlled module for electronic devices and testing apparatus provided with the same

#81
20170359925
2017-12-14

Shield box, shield box assembly and apparatus for testing a semiconductor device

#82
20170199238
2017-07-13

Low cost apparatus for insitu testing of packaged integrated circuits during stressing

#83
20170176515
2017-06-22

Thermal clutch for thermal control unit and methods related thereto

#84
20170171985
2017-06-15

Interface structure

#85
20170160336
2017-06-08

High-temperature test fixture

#86
20170030964
2017-02-02

Systems and methods for conforming device testers to integrated circuit device with pressure relief valve

#87
20170030963
2017-02-02

ENVIRONMENTAL SENSOR

#88
20170023634
2017-01-26

Failure estimation apparatus and failure estimation method

#89
20160377652
2016-12-29

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

#90
20160313390
2016-10-27

Systems and methods for conforming test tooling to integrated circuit device with whirlwind cold plate

#91
20160291083
2016-10-06

Integrated circuit test temperature control mechanism

#92
20160146882
2016-05-26

METHOD OF CONTACTING INTEGRATED CIRCUIT COMPONENTS IN A TEST SYSTEM

#93
20150355271
2015-12-10

Customizable tester having testing modules for automated testing of devices

#94
20150311701
2015-10-29

Method and system for transient voltage suppression devices with active control

#95
20150309114
2015-10-29

Systems and methods for conforming test tooling to integrated circuit device with heater socket

#96
20150204942
2015-07-23

Test board with local thermal conditioning elements

#97
20150137847
2015-05-21

Test platform

#98
20150109009
2015-04-23

Systems and methods for conforming device testers to integrated circuit device with pressure relief valve

#99
20140375345
2014-12-25

Burn-in socket with a heat sink

#100
20140253157
2014-09-11

Test system with localized heating and method of manufacture thereof

#101
20140125365
2014-05-08

Testing electronic components on electronic assemblies with large thermal mass

#102
20140062513
2014-03-06

Integrated circuit test temperature control mechanism

#103
20140055154
2014-02-27

Systems and methods for conforming test tooling to integrated circuit device profiles with ejection mechanisms

#104
20140021972
2014-01-23

Systems and methods for conforming test tooling to integrated circuit device profiles with sockets having secured and replaceable bushings

#105
20140015556
2014-01-16

Systems and methods for conforming test tooling to integrated circuit device profiles with compliant pedestals

#106
20130344711
2013-12-26

Burn-in socket with improved terminals

#107
20130271170
2013-10-17

Systems and methods for conforming device testers to integrated circuit device profiles with feedback temperature control

#108
20130061682
2013-03-14

Shock test device

#109
20130021049
2013-01-24

Systems and methods for conforming device testers to integrated circuit device profiles

#110
20130008628
2013-01-10

Thermal chamber for IC chip testing

#111
20120252243
2012-10-04

Pneumatically actuated IC socket with integrated heat sink

#112
20120235700
2012-09-20

Device retention for test socket

#113
20120025860
2012-02-02

Burn-in socket and testing fixture using the same

#114
20120007623
2012-01-12

Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis

#115
20110250777
2011-10-13

Burn-in socket having actuating mechanism driven alternatively for driving sliding plate

#116
20110223791
2011-09-15

Burn-in-test socket incorporating with actuating mechanism perfecting leveling of driving plate

#117
20110104927
2011-05-05

BURN-IN SOCKET

#118
20110097921
2011-04-28

Burn-in socket assembly with loading member having positioning clumps

#119
20110058338
2011-03-10

Electric connecting apparatus

#120
20110045682
2011-02-24

Burn-in socket connector

#121
20100304595
2010-12-02

BURN-IN SOCKET WITH INTENSIFIED SOCKET BODY

#122
20100291793
2010-11-18

Socket assembly with heat sink module

#123
20100289515
2010-11-18

Probe for a socket, socket for a semiconductor integrated circuit and electronic device

#124
20100289513
2010-11-18

TEST SOCKET ASSEMBLY HAVING HEAT DISSIPATION MODULE

#125
20100231250
2010-09-16

Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

#126
20100221929
2010-09-02

Burn-in socket with sliding member movable in dual directions

#127
20100201389
2010-08-12

Integrated unit for electrical/reliability testing with improved thermal control

#128
20100184306
2010-07-22

Conductive contact holder and conductive contact unit

#129
20100164525
2010-07-01

Test socket, and test apparatus with test socket to control a temperature of an object to be tested

#130
20100101088
2010-04-29

Method of manufacturing a heat sink pedestal device with interface medium chamber

#131
20100072587
2010-03-25

IC SOCKET HAVING HEAT DISSIPATION FUNCTION

#132
20100009558
2010-01-14

Electrical connector having heat sink with large dissipation area

#133
20090311894
2009-12-17

Socket for testing main board having water-cooled cooler fixing structure

#134
20090261852
2009-10-22

Ducted test socket

#135
20090253276
2009-10-08

Burn-in socket

#136
20090183908
2009-07-23

Method for manufacturing conductive contact holder, and conductive contact holder

#137
20090173476
2009-07-09

Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis

#138
20090128177
2009-05-21

ATTACHMENT FOR SOCKET AND SEMICONDUCTOR DEVICE-TESTING UNIT HAVING THE SAME

#139
20090103270
2009-04-23

Apparatus for securing heat sinks to a device under test

#140
20090051381
2009-02-26

Electronic device testing apparatus and temperature control method in an electronic device testing apparatus

#141
20090009204
2009-01-08

Test socket

#142
20080302513
2008-12-11

Method and Device for Tempering a Substrate

#143
20080252324
2008-10-16

Active thermal control unit for maintaining the set point temperature of a DUT

#144
20080238466
2008-10-02

TEMPERATURE SENSING AND PREDICTION IN IC SOCKETS

#145
20080207036
2008-08-28

BGA-type test and burn-in socket for integrated circuits (ICs)

#146
20080191720
2008-08-14

Multilayer substrate and probe card

#147
20080180124
2008-07-31

COOLING APPARATUS FOR SEMICONDUCTOR DEVICE

#148
20080174333
2008-07-24

Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same

#149
20080144289
2008-06-19

Securing heat sinks to a device under test

#150
20080054926
2008-03-06

Burn-in testing apparatus and method

#151
20070238327
2007-10-11

Burn-in socket with organizer arranging cable

#152
20070075724
2007-04-05

Thermal optical chuck

#153
20070075721
2007-04-05

Burn-in testing apparatus and method

#154
20060290370
2006-12-28

TEMPERATURE CONTROL IN IC SOCKETS

#155
20060255822
2006-11-16

Cooling fin connected to a cooling unit and a pusher of the testing apparatus

#156
20060238212
2006-10-26

INTEGRATED CIRCUIT TEMPERATURE SENSING DEVICE AND METHOD

#157
20060164111
2006-07-27

Temperature sensing and prediction in IC sockets

#158
20060158854
2006-07-20

Heat sink pedestal with interface medium chamber

#159
20060145718
2006-07-06

Burn-in testing apparatus and method

#160
20050275419
2005-12-15

Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis

#161
20050270056
2005-12-08

Thermal optical chuck

#162
20050231919
2005-10-20

Semiconductor device socket

#163
20050231224
2005-10-20

Burn-in socket assembly

#164
20050225346
2005-10-13

Cooling fin connected to a cooling unit and a pusher of the testing apparatus

#165
20050225343
2005-10-13

Device and method of testing an electronic component

#166
20050206368
2005-09-22

Burn-in testing apparatus and method

#167
20050189957
2005-09-01

Integrated circuit temperature sensing device and method

#168
20050161800
2005-07-28

Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet

#169
20050012516
2005-01-20

Burn-in socket adapt to assembly sensor thereon

#170
19201619
2025-08-19

Electronic device aging test apparatus