171217 ⎘
Details of instruments or arrangements of the types included in groups - and; General constructional details; Housings; Supporting members; Arrangements of terminals; Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets; Sockets for IC's or transistors; Details related to environmental aspects, e.g. temperature
SEMICONDUCTOR TEST APPARATUS
#2ACTIVE THERMAL INTERPOSER DEVICE WITH THERMAL ISOLATION STRUCTURES
#3PACKAGE RETENTION IN A TEST SOCKET BY A PRESSURIZED FLUID
#4SIGNAL TRSANSMISSION CONNECTOR
#5TEST SOCKET ASSEMBLIES COOLED WITH GASEOUS FLUID FOR SEMICONDUCTOR INTEGRATED CIRCUITS
#6SEMICONDUCTOR PACKAGE HEAT GENERATION SIMULATION UNIT FOR CHECKING HEAT DISTRIBUTION OF BURN-IN BOARD AND METHOD FOR ACQUIRING HEAT DISTRIBUTION OF BURN-IN BOARD USING THE SAME
#7TEST INTERCONNECT TEMPERATURE CONTROL WITH GAS FLOW
#8AUTOMATED SOCKET ACTUATION OF A SEMICONDUCTOR DEVICE PROGRAMMER
#9TEST SOCKET
#10ELECTRICAL SOCKET WITH AN IMPROVED ELEVATING MECHANISM FOR A HEATING-DISSIPATION ASSEMBLY
#11HEAT DISSIPATION STRUCTURE
#12Semiconductor Module Inspection Device
#13ACTIVE THERMAL INTERPOSER DEVICE
#14INSPECTION SOCKET
#15PHASE-CHANGE TEMPERATURE REGULATING SYSTEM AND ELECTRONIC COMPONENT TESTING APPARATUS AND METHOD
#16INSPECTION SYSTEM WITH THERMAL INTERFACE, AND ELECTRONIC COMPONENT INSPECTION DEVICE AND METHOD
#17ACTIVE THERMAL INTERPOSER DEVICE WITH THERMAL ISOLATION STRUCTURES
#18SOCKET DEVICE FOR TESTING ICs
#19TEST SYSTEM FOR TESTING SEMICONDUCTOR DEVICES
#20TEST SOCKET FOR AND A METHOD OF TESTING ELECTRONIC COMPONENTS, IN PARTICULAR HIGH-POWER SEMICONDUCTOR COMPONENTS
#21IC INSPECTION SOCKET
#22POGO PIN COOLING SYSTEM AND METHOD AND ELECTRONIC DEVICE TESTING APPARATUS HAVING THE SYSTEM
#23TEST BOARD, AND DIAGNOSTIC SYSTEM, DIAGNOSTIC METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM STORING DIAGNOSTIC PROGRAM OF THE TEST BOARD
#24Plasma reactor having array of coaxial multiple pins and processing low temperature plasma at high efficiency
#25Active thermal interposer device
#26Heat exchanger for thermal control of heat producing devices
#27Liquid cooling system, liquid cooling method and electronic device-testing apparatus having the system
#28Probe apparatus for testing semiconductor devices
#29Testing devices and method for testing semiconductor devices
#30Multi-beam cantilever style contact pin for IC testing
#31Electronic component handling apparatus and electronic component testing apparatus
#32Apparatus for the Temperature Control of a Substrate and Corresponding Production Method
#33Test carrier
#34Active thermal interposer device
#35Chip testing apparatus
#36Test socket assemblies with liquid cooled frame for semiconductor integrated circuits
#37Multistory electronic device testing apparatus
#38Test socket having an automated lid
#39Thermal sensor
#40Test system including active thermal interposer device
#41DUT placement and handling for active thermal interposer device
#42Low-thermal resistance pressing device for a socket
#43Testing system including active thermal interposer device
#44Active thermal interposer device
#45Electronic device characterization systems and methods
#46Chuck unit and method for controlling temperature of the chuck unit
#47Thermal control system for an automated test system
#48Modular automated test system
#49Test site configuration in an automated test system
#50Test and burn-in apparatus that provides variable thermal resistance
#51Frame for contact unit and socket
#52IC socket for semiconductor
#53Method and apparatus for conducting burn-in testing of semiconductor devices
#54Test apparatus which tests semiconductor chips
#55Latch assembly, heat sink assembly, and computer product incorporating the same
#56Heating device for carrying out temperature-dependent tests on electronic components arranged in a socket
#57Socket side thermal system
#58Apparatus for the Temperature Control of a Substrate and Corresponding Production Method
#59Testing apparatus
#60Electronic component handling device and electronic component testing apparatus
#61Electronic component handling device and electronic component testing apparatus
#62History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management pad
#63Contact and socket device for testing semiconductor
#64Apparatus for testing an optoelectronic device and method of operating the same
#65System for testing devices inside of carriers
#66Semiconductor test system with flexible and robust form factor
#67Socket for electrical component
#68Burn-in test apparatus for semiconductor devices
#69Electrical connector assembly having fan support thereon
#70Kelvin contact finger for high current testing
#71Testing system for semiconductor package components and its thermal barrier layer element
#72DUT testing with configurable cooling control using DUT internal temperature data
#73Method for continuous tester operation during multiple stage temperature testing
#74Device testing using dual-fan cooling with ambient air
#75Electrical contact terminal and electronic component socket
#76Socket side thermal system
#77Dew resistant module for test socket and electronic component testing device having the same
#78Method for protecting an electronic circuit board
#79Test apparatus which tests semiconductor chips
#80Temperature-controlled module for electronic devices and testing apparatus provided with the same
#81Shield box, shield box assembly and apparatus for testing a semiconductor device
#82Low cost apparatus for insitu testing of packaged integrated circuits during stressing
#83Thermal clutch for thermal control unit and methods related thereto
#84Interface structure
#85High-temperature test fixture
#86Systems and methods for conforming device testers to integrated circuit device with pressure relief valve
#87ENVIRONMENTAL SENSOR
#88Failure estimation apparatus and failure estimation method
#89SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#90Systems and methods for conforming test tooling to integrated circuit device with whirlwind cold plate
#91Integrated circuit test temperature control mechanism
#92METHOD OF CONTACTING INTEGRATED CIRCUIT COMPONENTS IN A TEST SYSTEM
#93Customizable tester having testing modules for automated testing of devices
#94Method and system for transient voltage suppression devices with active control
#95Systems and methods for conforming test tooling to integrated circuit device with heater socket
#96Test board with local thermal conditioning elements
#97Test platform
#98Systems and methods for conforming device testers to integrated circuit device with pressure relief valve
#99Burn-in socket with a heat sink
#100Test system with localized heating and method of manufacture thereof
#101Testing electronic components on electronic assemblies with large thermal mass
#102Integrated circuit test temperature control mechanism
#103Systems and methods for conforming test tooling to integrated circuit device profiles with ejection mechanisms
#104Systems and methods for conforming test tooling to integrated circuit device profiles with sockets having secured and replaceable bushings
#105Systems and methods for conforming test tooling to integrated circuit device profiles with compliant pedestals
#106Burn-in socket with improved terminals
#107Systems and methods for conforming device testers to integrated circuit device profiles with feedback temperature control
#108Shock test device
#109Systems and methods for conforming device testers to integrated circuit device profiles
#110Thermal chamber for IC chip testing
#111Pneumatically actuated IC socket with integrated heat sink
#112Device retention for test socket
#113Burn-in socket and testing fixture using the same
#114Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
#115Burn-in socket having actuating mechanism driven alternatively for driving sliding plate
#116Burn-in-test socket incorporating with actuating mechanism perfecting leveling of driving plate
#117BURN-IN SOCKET
#118Burn-in socket assembly with loading member having positioning clumps
#119Electric connecting apparatus
#120Burn-in socket connector
#121BURN-IN SOCKET WITH INTENSIFIED SOCKET BODY
#122Socket assembly with heat sink module
#123Probe for a socket, socket for a semiconductor integrated circuit and electronic device
#124TEST SOCKET ASSEMBLY HAVING HEAT DISSIPATION MODULE
#125Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
#126Burn-in socket with sliding member movable in dual directions
#127Integrated unit for electrical/reliability testing with improved thermal control
#128Conductive contact holder and conductive contact unit
#129Test socket, and test apparatus with test socket to control a temperature of an object to be tested
#130Method of manufacturing a heat sink pedestal device with interface medium chamber
#131IC SOCKET HAVING HEAT DISSIPATION FUNCTION
#132Electrical connector having heat sink with large dissipation area
#133Socket for testing main board having water-cooled cooler fixing structure
#134Ducted test socket
#135Burn-in socket
#136Method for manufacturing conductive contact holder, and conductive contact holder
#137Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
#138ATTACHMENT FOR SOCKET AND SEMICONDUCTOR DEVICE-TESTING UNIT HAVING THE SAME
#139Apparatus for securing heat sinks to a device under test
#140Electronic device testing apparatus and temperature control method in an electronic device testing apparatus
#141Test socket
#142Method and Device for Tempering a Substrate
#143Active thermal control unit for maintaining the set point temperature of a DUT
#144TEMPERATURE SENSING AND PREDICTION IN IC SOCKETS
#145BGA-type test and burn-in socket for integrated circuits (ICs)
#146Multilayer substrate and probe card
#147COOLING APPARATUS FOR SEMICONDUCTOR DEVICE
#148Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same
#149Securing heat sinks to a device under test
#150Burn-in testing apparatus and method
#151Burn-in socket with organizer arranging cable
#152Thermal optical chuck
#153Burn-in testing apparatus and method
#154TEMPERATURE CONTROL IN IC SOCKETS
#155Cooling fin connected to a cooling unit and a pusher of the testing apparatus
#156INTEGRATED CIRCUIT TEMPERATURE SENSING DEVICE AND METHOD
#157Temperature sensing and prediction in IC sockets
#158Heat sink pedestal with interface medium chamber
#159Burn-in testing apparatus and method
#160Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
#161Thermal optical chuck
#162Semiconductor device socket
#163Burn-in socket assembly
#164Cooling fin connected to a cooling unit and a pusher of the testing apparatus
#165Device and method of testing an electronic component
#166Burn-in testing apparatus and method
#167Integrated circuit temperature sensing device and method
#168Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet
#169Burn-in socket adapt to assembly sensor thereon
#170Electronic device aging test apparatus