G01R1/07307 - page 2 - CPC Classification Index

#301

20100120267

2010-05-13

WAFER LEVEL INTERPOSER

#302

20100082076

2010-04-01

Method and means for connecting and controlling a large number of contacts for electrical cell stimulation in living organisms

#303

20100079156

2010-04-01

Method and means for connecting a large number of electrodes to a measuring device

#304

20100052715

2010-03-04

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#305

20100047934

2010-02-25

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

#306

20100045324

2010-02-25

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#307

20100045321

2010-02-25

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#308

20100045320

2010-02-25

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#309

20100045318

2010-02-25

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#310

20100045317

2010-02-25

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#311

20100045266

2010-02-25

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#312

20100001752

2010-01-07

Parallelism adjusting mechanism of probe card

#313

20090315579

2009-12-24

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#314

20090298307

2009-12-03

Conductive contact unit and conductive contact

#315

20090273358

2009-11-05

Method and apparatus for enhanced probe card architecture

#316

20090260863

2009-10-22

Parallel test fixture for mixed signal integrated circuits

#317

20090260459

2009-10-22

Probe substrate and probe card having the same

#318

20090224410

2009-09-10

Wafer translator having a silicon core fabricated with printed circuit board manufacturing techniques

#319

20090212800

2009-08-27

Electrical connecting apparatus

#320

20090206860

2009-08-20

Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies

#321

20090201041

2009-08-13

Vertical probe array arranged to provide space transformation

#322

20090189288

2009-07-30

ANGLED FLYING LEAD WIRE BONDING PROCESS

#323

20090128176

2009-05-21

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#324

20090108860

2009-04-30

Versatile materials probe

#325

20090033348

2009-02-05

Electrical signal connector

#326

20080315905

2008-12-25

Probe board mounting apparatus

#327

20080290888

2008-11-27

PROBE SUBSTRATE FOR TEST AND MANUFACTURING METHOD THEREOF

#328

20080278186

2008-11-13

PIPELINE TEST APPARATUS AND METHOD

#329

20080265922

2008-10-30

Wafer level interposer

#330

20080252325

2008-10-16

Vertical probe array arranged to provide space transformation

#331

20080246501

2008-10-09

Probe card with stacked substrate

#332

20080217778

2008-09-11

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

#333

20080191720

2008-08-14

Multilayer substrate and probe card

#334

20080164896

2008-07-10

Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof

#335

20080132094

2008-06-05

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#336

20080129320

2008-06-05

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#337

20080129319

2008-06-05

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#338

20080123310

2008-05-29

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#339

20080121879

2008-05-29

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#340

20080117613

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#341

20080117612

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#342

20080117611

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#343

20080116916

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#344

20080116915

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#345

20080116914

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#346

20080116913

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#347

20080116912

2008-05-22

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#348

20080112149

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#349

20080112148

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#350

20080112147

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#351

20080112146

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#352

20080112145

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#353

20080112144

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#354

20080111570

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#355

20080111569

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#356

20080111568

2008-05-15

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#357

20080106872

2008-05-08

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#358

20080106291

2008-05-08

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#359

20080106285

2008-05-08

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#360

20080106284

2008-05-08

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#361

20080106283

2008-05-08

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#362

20080106282

2008-05-08

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#363

20080106281

2008-05-08

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#364

20080105355

2008-05-08

Probe Arrays and Method for Making

#365

20080100324

2008-05-01

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#366

20080100318

2008-05-01

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#367

20080100317

2008-05-01

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#368

20080100316

2008-05-01

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#369

20080094083

2008-04-24

Versatile materials probe

#370

20080093424

2008-04-24

Probe arrays and method for making

#371

20080088332

2008-04-17

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

#372

20080074130

2008-03-27

Apparatus and method for testing conductive bumps

#373

20080074127

2008-03-27

PROBE SUBSTRATE FOR TEST AND MANUFACTURING METHOD THEREOF

#374

20080048697

2008-02-28

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#375

20080048691

2008-02-28

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#376

20080048690

2008-02-28

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#377

20080048689

2008-02-28

Wafer type probe card, method for fabricating the same, and semiconductor test apparatus having the same

#378

20080048688

2008-02-28

Methods for planarizing a semiconductor contactor

#379

20080047741

2008-02-28

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

#380

20080035487

2008-02-14

Probe and method of making same

#381

20080030216

2008-02-07

Contactor assembly

#382

20080030215

2008-02-07

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

#383

20080029889

2008-02-07

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

#384

20080024155

2008-01-31

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

#385

20080024154

2008-01-31

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

#386

20080020498

2008-01-24

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

#387

20080010824

2008-01-17

Probe card and method for manufacturing probe card

#388

20080000499

2008-01-03

System and method for cleaning a contactor device

#389

20070271781

2007-11-29

High density integrated circuit apparatus, test probe and methods of use thereof

#390

20070268032

2007-11-22

Probe Member for Wafer Inspection, Probe Card for Wafer Inspection and Wafer Inspection Apparatus

#391

20070246819

2007-10-25

Semiconductor components having encapsulated through wire interconnects (TWI)

#392

20070245552

2007-10-25

Probe interposers and methods of fabricating probe interposers

#393

20070236233

2007-10-11

Probe interposers and methods of fabricating probe interposers

#394

20070229102

2007-10-04

Mechanically reconfigurable vertical tester interface for IC probing

#395

20070216434

2007-09-20

Method for validating and monitoring automatic test equipment contactor

#396

20070207559

2007-09-06

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

#397

20070190671

2007-08-16

Manufacturing method of semiconductor integrated circuit device and probe card

#398

20070182431

2007-08-09

Probe card and probe device for inspection of a semiconductor device

#399

20070182430

2007-08-09

Probe head with machine mounting pads and method of forming same

#400

20070176614

2007-08-02

Probe card

#401

20070139061

2007-06-21

Probing apparatus with guarded signal traces

#402

20070123082

2007-05-31

Interconnect assemblies and methods

#403

20070090855

2007-04-26

Method and apparatus for testing bumped die

#404

20070075713

2007-04-05

Tester for in-circuit testing bed of nails fixture and testing circuit thereof

#405

20070063722

2007-03-22

Method and apparatus for testing bumped die

#406

20070063718

2007-03-22

Contact assembly and LSI chip inspecting device using the same

#407

20070028946

2007-02-08

Method and apparatus for cleaning a probe card

#408

20060286828

2006-12-21

Contact Structures Comprising A Core Structure And An Overcoat

#409

20060279304

2006-12-14

Contact terminal for measurement, measurement apparatus, probe card set, wafer probe apparatus, and testing apparatus

#410

20060279302

2006-12-14

Method for using probe card

#411

20060257631

2006-11-16

Probe pad structure in a ceramic space transformer

#412

20060186540

2006-08-24

Method to create flexible connections for integrated circuits

#413

20060185164

2006-08-24

Methods for making plated through holes usable as interconnection wire or probe attachments

#414

20060171425

2006-08-03

Probe and method of making same

#415

20060108678

2006-05-25

Probe arrays and method for making

#416

20060103399

2006-05-18

Apparatus and method for testing conductive bumps

#417

20060091898

2006-05-04

Process and circuit for protection of test contacts in high current measurement of semiconductor components

#418

20060087327

2006-04-27

Probe device and display substrate testing apparatus using same

#419

20060028220

2006-02-09

Reinforced probes for testing semiconductor devices

#420

20060027747

2006-02-09

Probe tip plating

#421

20060024988

2006-02-02

Interconnect assemblies and methods

#422

20060022690

2006-02-02

Method and apparatus for producing co-planar bonding pads on a substrate

#423

20060006384

2006-01-12

Special contact points for accessing internal circuitry of an intergrated circuit

#424

20050277323

2005-12-15

Mechanically reconfigurable vertical tester interface for IC probing

#425

20050258847

2005-11-24

Method of connecting probe pin to circuit board and method of manufacturing probe card

#426

20050253608

2005-11-17

Electrical test device

#427

20050227383

2005-10-13

Manufacturing method of semiconductor integrated circuit device and probe card

#428

20050225336

2005-10-13

Flat portions of a probe card flattened to have same vertical level with one another by compensating the unevenness of a substrate and each identical height needle being mounted on the corresponding flat portion through an adhesive

#429

20050179456

2005-08-18

Method for fabricating a structure for making contact with a device

#430

20050174134

2005-08-11

Method and apparatus for testing bumped die

#431

20050159027

2005-07-21

See-saw interconnect assembly with dielectric carrier grid providing spring suspension

#432

20050159025

2005-07-21

See-saw interconnect assembly with dielectric carrier grid providing spring suspension

#433

20050156165

2005-07-21

Test assembly including a test die for testing a semiconductor product die

#434

20050108876

2005-05-26

Methods for making plated through holes usable as interconnection wire or probe attachments

#435

20050095734

2005-05-05

Fabrication method of semiconductor integrated circuit device

#436

20050093565

2005-05-05

Fabrication method of semiconductor integrated circuit device

#437

20050062492

2005-03-24

High density integrated circuit apparatus, test probe and methods of use thereof

#438

20050062464

2005-03-24

Apparatus for planarizing a probe card and method using same

#439

20050028363

2005-02-10

Contact structures and methods for making same

#440

18143165

2026-01-06

Anti abrasion wafer probes

#441

14212168

2016-05-17

On-center electrically conductive pins for integrated testing

#442

14178171

2017-06-13

Methods to manufacture semiconductor probe tips

#443

13242703

2017-04-04

Methods and apparatus to detect a conductive object