171247 ⎘
Details of instruments or arrangements of the types included in groups - and; General constructional details; Measuring leads; Measuring probes; Measuring probes; Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
PROBE CARD STRUCTURE
#2PROBE DEVICE, PROBE SYSTEM INCLUDING THE PROBE DEVICE AND OPERATING METHOD THEREOF
#3PROBE DEVICE
#4Low force wafer test probe with variable geometry
#5MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND INSPECTION APPARATUS FOR SEMICONDUCTOR DEVICE
#6Low force wafer test probe with variable geometry
#7Testing head of electronic devices
#8Probe card and method for selecting the same
#9Three-dimensional microprobe array
#10JIG FOR PRINTED SUBSTRATE INSPECTION AND PRINTED SUBSTRATE INSPECTION APPARATUS
#11Resilient probes for electrical testing