177123 ⎘
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor; Processing photosensitive materials; Apparatus therefor; Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
CLEANING COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN USING THE SAME
#2COMPOSITIONS FOR SELECTIVE REMOVAL OF POLYMERIC MATERIALS
#3TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST
#4METHOD FOR TREATING A SUBSTRATE
#5TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST
#6Etching Composition And Method For EUV Mask Protective Structure
#7Silicon-containing resist underlayer film-forming composition including organic group having ammonium group
#8Wafer processing device and method
#9Treatment liquid, method for washing substrate, and method for removing resist
#10Process flow with wet etching for smooth sidewalls in silicon nitride waveguides
#11Silicon-containing underlayers
#12Semiconductor device production method employing silicon-containing resist underlayer film-forming composition including organic group having ammonium group
#13Method for producing ozone water
#14Cleaning agent and preparation method and use thereof
#15Method of producing heated ozone water, heated ozone water, and semiconductor wafer-cleaning liquid
#16APPARATUS FOR REMOVING PHOTORESISTS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#17Substrate processing apparatus
#18Photonically tuned etchant reactivity for wet etching
#19Thinner composition
#20UV-assisted stripping of hardened photoresist to create chemical templates for directed self-assembly
#21SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING ORGANIC GROUP HAVING DIHYDROXY GROUP
#22Cleaning solution and method for cleaning substrate
#23Stripping compositions for removing photoresists from semiconductor substrates
#24SILICON-CONTAINING UNDERLAYERS
#25Treatment liquid, method for washing substrate, and method for removing resist
#26Treatment liquid, method for washing substrate, and method for removing resist
#27Substrate processing method and substrate processing device
#28Resist multilayer film-attached substrate and patterning process
#29Substrate processing apparatus, substrate processing method and recording medium
#30Use of non-oxidizing strong acids for the removal of ion-implanted resist
#31Methods and systems for generating process gases
#32Post-etch residue removal for advanced node beol processing
#33Cleaning compositions and methods of use therefor
#34Lithographic mask layer
#35Photoresist with gradient composition for improved uniformity
#36Cleaning formulations
#37Substrate processing method and substrate processing device
#38Photoresist removal
#39Embossing lacquer and method for embossing, and substrate surface coated with the embossing lacquer
#40Stripping compositions for removing photoresists from semiconductor substrates
#41Alkaline earth metal-containing cleaning solution for cleaning semiconductor element, and method for cleaning semiconductor element using same
#42Substrate treatment apparatus and substrate treatment method
#43Method for treating substrates with an aqueous liquid medium exposed to UV-radiation
#44Substrate processing apparatus
#45Substrate liquid processing apparatus, substrate liquid processing method, and storage medium
#46Substrate liquid processing apparatus, substrate liquid processing method, and storage medium
#47USE OF NON-OXIDIZING STRONG ACIDS FOR THE REMOVAL OF ION-IMPLANTED RESIST
#48Removal composition for selectively removing hard mask and methods thereof
#49METHOD FOR WET STRIPPING SILICON-CONTAINING ORGANIC LAYERS
#50Removal composition for selectively removing hard mask and methods thereof
#51Cleaning liquid for lithography and method for forming wiring
#52Stripping compositions for removing photoresists from semiconductor substrates
#53Stripping compositions having high WN/W etching selectivity
#54Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
#55Compositions and methods for selectively etching titanium nitride
#56Substrate processing apparatus and substrate processing method
#57Compositions and methods for selectively etching titanium nitride
#58Pressure-less ozonated DI-water (DIO) recirculation reclaim system
#59Method and apparatus of patterning a semiconductor device
#60Photoresist system and method
#61Cleaning composition, cleaning process, and process for producing semiconductor device
#62Composition and process for stripping photoresist from a surface including titanium nitride
#63METHOD AND COMPOSITION FOR SELECTIVELY REMOVING METAL HARDMASK AND OTHER RESIDUES FROM SEMICONDUCTOR DEVICE SUBSTRATES COMPRISING LOW-K DIELECTRIC MATERIAL AND COPPER
#64Aqueous solution and process for removing substances from substrates
#65Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition
#66Photoresist removal
#67UV-assisted stripping of hardened photoresist to create chemical templates for directed self-assembly
#68Cleaning solution comprising an ether acetate for preventing pattern collapse
#69Photoresist removal
#70Method and apparatus for surface treatment using inorganic acid and ozone
#71Controlling cleaning of a layer on a substrate using nozzles
#72Method and system of process chemical temperature control using an injection nozzle
#73Pressure-less ozonated Di-water (DIO) recirculation reclaim system
#74Compositions for use in semiconductor devices
#75COMPOSITION OF SOLUTIONS AND CONDITIONS FOR USE ENABLING THE STRIPPING AND COMPLETE DISSOLUTION OF PHOTORESISTS
#76Device manufacturing and cleaning method
#77METHOD AND SYSTEM FOR RAPID MIXING OF PROCESS CHEMICALS USING AN INJECTION NOZZLE
#78Composition for and method of suppressing titanium nitride corrosion
#79Method for processing a substrate and apparatus for performing the same
#80Sequential stage mixing for a resist batch strip process
#81Sequential stage mixing for single substrate strip processing
#82METHOD AND DEVICE TO ENABLE SEMICONDUCTOR PROCESSING IN SOLUTION THAT GENERATES PARTICLES
#83Techniques providing photoresist removal
#84Stripping solution for photolithography and pattern formation method
#85Aqueous cerium-containing solution having an extended bath lifetime for removing mask material
#86Process for removing material from substrates
#87Methods for cleaning a semiconductor substrate
#88Substrate treatment device and substrate treatment method
#89Liquid process apparatus and liquid process method
#90Photoresist removal
#91Spin-on formulation and method for stripping an ion implanted photoresist
#92Spin-on formulation and method for stripping an ion implanted photoresist
#93ION IMPLANTED RESIST STRIP WITH SUPERACID
#94SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
#95Resist remover composition and method for removing resist using the composition
#96Processing agent composition for semiconductor surface and method for processing semiconductor surface using same
#97Method and apparatus for surface treatment using inorganic acid and ozone
#98LIQUID PROCESSING METHOD, LIQUID PROCESSING APPARATUS AND STORAGE MEDIUM STORING PROGRAM FOR PERFORMING LIQUID PROCESSING METHOD
#99Compositions and methods for removing organic substances
#100Multi-agent type cleaning kit for semiconductor substrates, cleaning method using the same and method of producing semiconductor element
#101Method for supplying hydroxyl radical-containing water and apparatus for supplying hydroxyl radical-containing water
#102Cleaning agent for semiconductor substrate, cleaning method using the cleaning agent, and method for producing semiconductor element
#103Enhanced stripping of implanted resists
#104Stripping compositions for cleaning ion implanted photoresist from semiconductor device wafers
#105METHOD FOR CLEANING ELECTRONIC MATERIAL AND DEVICE FOR CLEANING ELECTRONIC MATERIAL
#106METHOD FOR TREATMENT SUBSTRATES AND TREATMENT COMPOSITION FOR SAID METHOD
#107Solution supplying unit and substrate treating apparatus having the same
#108PHOTORESIST REMOVING PROCESSOR AND METHODS
#109SEMICONDUCTOR CLEANING USING SUPERACIDS
#110Method and apparatus of patterning a semiconductor device
#111Spin-on formulation and method for stripping an ion implanted photoresist
#112PROCESS FOR CLEANING SEMICONDUCTOR ELEMENT
#113METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, APPARATUS FOR PROCESSING SUBSTRATE, AND COMPUTER READABLE MEDIUM
#114ETCHING METHOD, METHOD FOR MANUFACTURING MICROSTRUCTURE, AND ETCHING APPARATUS
#115Removal of masking material
#116Formulations and method for post-CMP cleaning
#117Method and system for uniformly applying a multi-phase cleaning solution to a substrate
#118METHOD AND APPARATUS FOR SURFACE TREATMENT USING A MIXTURE OF ACID AND OXIDIZING GAS
#119Method for removing photoresist
#120Cleaning composition, cleaning process, and process for producing semiconductor device
#121CLEANING METHOD, CLEANING SYSTEM, AND METHOD FOR MANUFACTURING MICROSTRUCTURE
#122CLEANING LIQUID, CLEANING METHOD, CLEANING SYSTEM, AND METHOD FOR MANUFACTURING MICROSTRUCTURE
#123METHOD FOR TREATING A LITHOGRAPHIC PRINTING PLATE
#124COMPOSITION AND METHOD FOR REMOVING ION-IMPLANTED PHOTORESIST
#125PROCESSING METHOD OF LIQUID
#126Electrolysis method
#127Method for removing resist and for producing a magnetic recording medium, and systems thereof
#128Process for treatment of substrates with water vapor or steam
#129METHOD FOR PROCESSING A SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME
#130Two-phase substrate cleaning material
#131Apparatus for cleaning contaminants from substrate
#132PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#133Method of removing resist and apparatus therefor
#134Semiconductor processing method
#135Method of manufacturing semiconductor device
#136Compositions and methods for removing organic substances
#137Combinatorial approach to the development of cleaning formulations for wet removal of high dose implant photoresist
#138Substrate processing apparatus and substrate processing method
#139Photoresist residue removal composition
#140Processing system, processing method, and storage medium
#141Coated-type silicon-containing film stripping process
#142Method of removing resist and apparatus therefor
#143Compositions for reducing metal etch rates using stripper solutions containing copper salts
#144METHOD FOR REMOVING ETCHING RESIDUES FROM SEMICONDUCTOR COMPONENTS
#145METHOD FOR MANUFACTURING IMAGE SENSOR
#146Method and apparatus for removing contamination from substrate
#147Treating liquid for photoresist removal and method for treating substrate
#148COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD
#149Cleaning composition and process for producing semiconductor device
#150Apparatus for removing material from one or more substrates
#151Cleaning method by electrolytic sulfuric acid and manufacturing method of semiconductor device
#152ULTRASONIC CLEANING SYSTEM FOR REMOVING HIGH DOSE ION IMPLANTED PHOTORESIST IN SUPERCRITICAL CARBON DIOXIDE
#153Substrate processing method and substrate processing apparatus
#154Low pH mixtures for the removal of high density implanted resist
#155Composition for removing protective layer in fabrication of mems and method for removing same
#156Composition for removing protective layer in fabrication of MEMS and method for removing same
#157PHOTORESIST AND ANTIREFLECTIVE LAYER REMOVAL SOLUTION AND METHOD THEREOF
#158Method of reducing photoresist defects during fabrication of a semiconductor device
#159Rapid prototyping method and radiation-curable composition for use therein
#160METHOD FOR TREATING A SUBSTRATE
#161Treating liquid for photoresist removal, and method for treating substrate
#162PROCESS FOR REMOVING ION-IMPLANTED PHOTORESIST
#163PHOTORESIST STRIP WITH OZONATED ACETIC ACID SOLUTION
#164WET PHOTORESIST STRIP FOR WAFER BUMPING WITH OZONATED ACETIC ANHYDRIDE
#165Composition for removing photoresist layer and method for using it
#166Aqueous fluoride compositions for cleaning semiconductor devices
#167Composition for Removing Photresist Layer and Method for Using it
#168STRIPPING LIQUID FOR SEMICONDUCTOR DEVICE, AND STRIPPING METHOD
#169OZONATION FOR ELIMINATION OF BACTERIA FOR WET PROCESSING SYSTEMS
#170Reduced metal etch rates using stripper solutions containing a copper salt
#171Compositions for use in semiconductor devices
#172Photoresist residue remover composition and semiconductor circuit element production process employing the same
#173Composition for cleaning semiconductor device
#174Resist removing method and resist removing apparatus
#175Compositions for Dissolution of Low-K Dielectric Films, and Methods of Use
#176Process for treatment of substrates with water vapor or steam
#177Composition for the removal of sidewall residues
#178Compositions for the removal of post-etch and ashed photoresist residues and bulk photoresist
#179Treating liquid for photoresist removal, and method for treating substrate
#180Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition
#181Compositions for cleaning ion implanted photoresist in front end of line applications
#182Method for processing semiconductor wafer
#183WET PHOTORESIST STRIPPING PROCESS AND APPARATUS
#184Epoxy removal process for microformed electroplated devices
#185Cleaning system and cleaning method
#186Integrated etch and supercritical COprocess and chamber design
#187REMOVING PHOTORESIST FROM SUBSTRATES BY MEANS OF TREATMENT LIQUID, AND PROCESSING TREATEMENT LIQUID WITH OZONE
#188POST ETCH RESIDUE REMOVAL FROM SUBSTRATES
#189METHODS TO ACCELERATE PHOTOIMAGEABLE MATERIAL STRIPPING FROM A SUBSTRATE
#190System using ozonated acetic anhydride to remove photoresist materials
#191Separation-material composition for photo-resist and manufacturing method of semiconductor device
#192REWORK METHODOLOGY THAT PRESERVES GATE PERFORMANCE
#193HIGH TEMPERATURE SPM TREATMENT FOR PHOTORESIST STRIPPING
#194SUBSTRATE-PROCESSING METHOD AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
#195Photoresist stripping solution and a method of stripping photoresists using the same
#196Resist, barc and gap fill material stripping chemical and method
#197Semiconductor manufacturing apparatus for use in process of cleaning semiconductor substrate and method of manufacturing semiconductor device using the same
#198Method of removing a photoresist pattern, method of forming a dual polysilicon layer using the removing method and method of manufacturing a semiconductor device using the removing
#199Method of removing ion implanted photoresist
#200Cleaning of contaminated articles by aqueous supercritical oxidation
#201Microelectronic cleaning compositions containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
#202METHODS FOR REMOVING PHOTORESIST
#203HIGH-PRESSURE PROCESSING METHOD
#204Cleaning compositions and methods of use thereof
#205Substrate processing apparatus for resist film removal
#206Stripping and removal of organic-containing materials from electronic device substrate surfaces
#207Process for removing material from substrates
#208Aqueous solution for removing post-etch residue
#209Systems and methods for gas assisted resist removal
#210SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#211Washing apparatus with bubbling reaction and a washing method of using bubbling reaction
#212Process sequence for photoresist stripping and cleaning of photomasks for integrated circuit manufacturing
#213SUBSTRATE TREATING METHOD AND APPARATUS
#214Photoresist stripping solution and method of treating substrate with the same
#215Substrate processing system and substrate processing method
#216Stripping and cleaning of organic-containing materials from electronic device substrate surfaces
#217Manufacturing method of semiconductor device
#218Method and system for using a two-phases substrate cleaning compound
#219Method and apparatus for cleaning a semiconductor substrate
#220Method and apparatus for cleaning a semiconductor substrate
#221Resist film removing method
#222Method and apparatus for removing contamination from substrate
#223Method of removing organic contaminants from a semiconductor surface
#224Ozonation for elimination of bacteria for wet processing systems
#225Stripper for electronics
#226Resist removing method and resist removing apparatus
#227Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
#228Photoresist stripping solution and a method of stripping photoresists using the same
#229Method of treating and removing a photoresist pattern and method of manufacturing a semiconductor device using the same
#230Surface treatment of a dry-developed hard mask and surface treatment compositions used therefor
#231Surface treatment of a dry-developed hard mask and surface treatment compositions used therefor
#232Selective removal chemistries for semiconductor applications, methods of production and uses thereof
#233Method to remove resist, etch residue, and copper oxide from substrates having copper and low-k dielectric material
#234Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods
#235Semiconductor cleaning using superacids
#236Removing solution
#237Method and system for flowing a supercritical fluid in a high pressure processing system
#238Method for manufacturing high-transmittance optical filter for image display devices
#239System and method for reducing metal oxides with hydrogen radicals
#240Etching composition and use thereof with feedback control of HF in BEOL clean
#241Treating liquid for photoresist removal, and method for treating substrate
#242Effective photoresist stripping process for high dosage and high energy ion implantation
#243Composition for the removing of sidewall residues
#244Copper processing using an ozone-solvent solution
#245Computer readable storage medium for controlling substrate processing apparatus
#246Using ozone to process wafer like objects
#247Photoresist stripping solution and method of treating substrate with the same
#248Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
#249Stripping composition for removing a photoresist and method of manufacturing TFT substrate for a liquid crystal display device using the same
#250Supercritical carbon dioxide/chemical formulation for removal of photoresists
#251Cleaning composition and method
#252Semiconductor fabrication methods and apparatus
#253Silicon recess improvement through improved post implant resist removal and cleans
#254Method and apparatus for stripping photo-resist
#255Composition for removing photoresist residue and polymer residue
#256Photoresist stripper composition
#257Wet cleaning apparatus and methods
#258Remover compositions for dual damascene system
#259Compositions and processes for photoresist stripping and residue removal in wafer level packaging
#260Process for removing organic materials during formation of a metal interconnect
#261Resist removing apparatus and method of removing resist
#262Microelectronic cleaning compositions containing oxidizers and organic solvents
#263Photoresist residue remover composition and semiconductor circuit element production process employing the same
#264Resist stripping method and resist stripping apparatus
#265Compositions for cleaning organic and plasma etched residues for semiconductor devices
#266Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
#267Surface treatment of a dry-developed hard mask and surface treatment compositions used therefor
#268Semiconductor processing methods
#269Cleaning solution, method for cleaning semiconductor substrate using the same, and method for forming metal wiring
#270Method and apparatus for treating a substrate with an ozone-solvent solution III
#271Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof
#272Electrolytic method for photoresist stripping
#273Method for manufacturing a semiconductor device and a cleaning device for stripping resist
#274Method of integrating post-etching cleaning process with deposition for semiconductor device
#275Composition for cleaning semiconductor device
#276Gas assisted method for applying resist stripper and gas-resist stripper combinations
#277Photoresist stripping solution and a method of stripping photoresists using the same
#278Detergent composition
#279FRAM capacitor stack clean
#280Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing
#281Aqueous fluoride compositions for cleaning semiconductor devices
#282Substrate processing apparatus for resist film removal
#283Composition for cleaning