187485 ⎘
Program-control systems; Nc systems; Nc applications CMP chemical mechanical polishing of wafer
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
#2INFORMATION PROCESSING DEVICE, SUBSTRATE PROCESSING DEVICE, AND INFORMATION PROCESSING METHOD
#3PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTING METHOD, AND WAFER PRODUCTION SYSTEM
#4SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
#5CMP polishing system and associated pilot management system
#6Computer controlled work tool apparatus and method
#7Display of spectra contour plots versus time for semiconductor processing system control
#8High temperature silicon oxide atomic layer deposition technology
#9High temperature silicon oxide atomic layer deposition technology
#10Selection of polishing parameters to generate removal or pressure profile
#11Polishing with pre deposition spectrum
#12Adjustment apparatus for adjusting processing units provided in a substrate processing apparatus, and a substrate processing apparatus having such an adjustment apparatus
#13Endpoint method using peak location of spectra contour plots versus time
#14Selection of polishing parameters to generate removal profile
#15Selecting reference libraries for monitoring of multiple zones on a substrate
#16Method for Controlling Polishing Wafer
#17Computer controlled work tool apparatus and method
#18Endpoint method using peak location of spectra contour plots versus time
#19Polishing apparatus and program thereof
#20Monitoring Device of Chemical Mechanical Polishing Apparatus
#21EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY
#22Algorithm for real-time process control of electro-polishing
#23EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY
#24Algorithm for real-time process control of electro-polishing
#25Chemical-mechanical planarization controller
#26Extended Kalman filter incorporating offline metrology
#27Chemical-mechanical planarization controller