ClassID:

191660

G06F2217/38 - CPC Classification

Classification description:

Recent Application in this class:
#1
20210064709
2021-03-04

Determining optimal size and shape of additive manufactured packaging

#2
20190377850
2019-12-12

Semiconductor package metal shadowing checks

#3
20190347378
2019-11-14

Method for routing bond wires in system in a package (SiP) devices

#4
20190213291
2019-07-11

Article-storage simulation device, article-storage simulation method, program, and recording medium

#5
20190102506
2019-04-04

Semiconductor package metal shadowing checks

#6
20180265228
2018-09-20

DUNNAGE AND PACKAGING OPTIMIZATION

#7
20180108185
2018-04-19

METHOD AND COMPUTER SYSTEM FOR VIRTUALLY DISPLAYING IMAGES ON CARTON BOXES

#8
20170280569
2017-09-28

EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY

#9
20170192413
2017-07-06

Method for producing a padding for transporting cargo

#10
20170183139
2017-06-29

Object recognition for protective packaging control

#11
20170154127
2017-06-01

Efficient packing of objects

#12
20170147726
2017-05-25

Modeling localized temperature changes on an integrated circuit chip using thermal potential theory

#13
20160342712
2016-11-24

Creation of cut files to fit a large package flat on one or more substrates

#14
20160342711
2016-11-24

Creation of cut files for personalized package design using multiple substrates

#15
20160283639
2016-09-29

Semiconductor device design methods and conductive bump pattern enhancement methods

#16
20150379180
2015-12-31

Layout method for printed circuit board

#17
20150317411
2015-11-05

Dynamic optimization of detailed flat design based on desired final structural attributes

#18
20150195901
2015-07-09

Area array device connection structures with complimentary warp characteristics

#19
20150143324
2015-05-21

Semiconductor device design methods and conductive bump pattern enhancement methods

#20
20150113495
2015-04-23

Structure for logic circuit and serializer-deserializer stack

#21
20150019379
2015-01-15

Enhancing touch and feel on the Internet

#22
20140379111
2014-12-25

Designing a folded sheet object

#23
20140268603
2014-09-18

Area array device connection structures with complimentary warp characteristics

#24
20140109035
2014-04-17

Layout method for printed circuit board

#25
20060178952
2006-08-10

Enhancing touch and feel on the internet

#26
14503407
2016-03-08

Methods, systems, and articles of manufacture for analyzing a multi-fabric electronic design and displaying analysis results for the multi-fabric electronic design spanning and displaying simulation results across multiple design fabrics

#27
14503406
2015-12-29

Method, system, and computer program product for checking, verifying, or testing a multi-fabric electronic design spanning across multiple design fabrics

#28
14503403
2016-06-07

Method, system, and computer program product for implementing a multi-fabric electronic design spanning across multiple design fabrics

#29
10289662
2014-08-05

Methods and apparatus for designing the racking and wiring configurations for pieces of hardware