199340 ⎘
Details of stores covered by group; Disposition of storage elements, e.g. in the form of a matrix array Supports for storage elements, e.g. memory modules ; Mounting or fixing of storage elements on such supports
Capacitive structures for crosstalk reduction
#602Apparatuses and methods for performing intra-module databus inversion operations
#603Hybrid LPDDR4-DRAM with cached NVM and flash-nand in multi-chip packages for mobile devices
#604Delay-compensated error indication signal
#605Asymmetric on-state resistance driver optimized for multi-drop DDR4
#606Memory module error tracking
#607Memory with alternative command interfaces
#608System including hierarchical memory modules having different types of integrated circuit memory devices
#609Memory device using sense amplifiers as buffer memory with reduced access time and method of cache operation of the same
#610Self-optimized power management for DDR-compatible memory systems
#611276-pin buffered memory card with enhanced memory system interconnect
#612Dynamic random access memory (DRAM) component for high-performance, high-capacity registered memory modules
#613Controlling temperature of a system memory
#614Memory system with threaded transaction support
#615Dual inline memory module with temperature-sensing scenario mode
#616DRAM retention test method for dynamic error correction
#617Memory systems and methods for improved power management
#618Signal timing alignment based on a common data strobe in memory devices configured for stacked arrangements
#619Memory module with controlled byte-wise buffers
#620Memory systems, modules, and methods for improved capacity
#621High capacity memory system using controller component
#622Memory controller for selective rank or subrank access
#623Component placement within a solid state drive
#624System-in-package module with memory
#625System and method for performance optimal partial rank/bank interleaving for non-symmetrically populated DIMMs across DDR channels
#626Semiconductor device
#627Coherency management for volatile and non-volatile memory in a through-silicon via (TSV) module
#628Semiconductor device having interconnection in package and method for manufacturing the same
#629Memory module adaptor card
#630Bridge board with structure for preventing solid state drive module bending and data storage device including the same
#631Nonvolatile memory device, memory system including the same and method of operating the same
#632Buffer circuit with adaptive repair capability
#633Read delivery for memory subsystem with narrow bandwidth repeater channel
#634Semiconductor package
#635Power-down interrupt of nonvolatile dual in-line memory system
#636Stacked chip-on-board module with edge connector
#637Apparatus for power management
#638Storage apparatus and data access method
#639Semiconductor memory device including output buffer
#640Coordinated in-module RAS features for synchronous DDR compatible memory
#641SSD storage module, SSD component, and SSD
#642Memory interface circuit capable of controlling driving ability and associated control method
#643Method for reduced load memory module
#644HYBRID SYSTEM INTEGRATING PACKAGE-ON-PACKAGE SOC AND EMBEDDED MULTI-CHIP PACKAGE ON ONE MAIN CIRCUIT BOARD
#645DATA CLOCK SYNCHRONIZATION IN HYBRID MEMORY MODULES
#646Memory access signal detection utilizing a tracer DIMM
#647Memory module including on-die termination circuit and control method thereof
#648Boundary scan chain for stacked memory
#649Semiconductor memory device having rank interleaving operation in memory module
#650Semiconductor apparatus having multiple ranks with noise elimination
#651Nonvolatile memory devices including controller for operating nonvolatile memory cell array layer in memory chip in one of memory mode and storage mode
#652Common platform for one-level memory architecture and two-level memory architecture
#653Input circuit of three-dimensional semiconductor apparatus capable of enabling testing and direct access
#654Electronic system and electronic device capable of capturing high speed signal
#655Dual in-line memory module (DIMM) form factor backup power supply
#656Distributed serialized data buffer and a memory module for a cascadable and extended memory subsystem
#657Semiconductor memory devices and methods of operating the same
#658Semiconductor support frame and storage device having the same
#659Memory module with reduced read/write turnaround overhead
#660Buffered multi-rank memory modules configured to selectively link rank control signals and methods of operating the same
#661Configurable memory circuit system and method
#662Memory module, electronic device and method
#663Nonvolatile memory module having dual-port DRAM
#664Memory module adaptor card
#665Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#666Data processing device
#667Data processing device
#668Flash module
#669Printed circuit board
#670Three-dimensional one-time-programmable memory comprising off-die address/data-translator
#671Memory system which transfers management information between first and second memories in a burst mode before a read process is performed on a third memory
#672Buffer memory devices, memory modules and solid state disks with non-uniform memory device connections
#673Smart in-module refresh for DRAM
#674Flash controller to provide a value that represents a parameter to a flash memory
#675Data I/O circuits and semiconductor systems including the same
#676Switches coupling volatile memory devices to a power source
#677System including hierarchical memory modules having different types of integrated circuit memory devices
#678Failure safe power source for solid state disk drives
#679276-pin buffered memory card with enhanced memory system interconnect
#680Memory module
#681Methods of forming trenches in packages structures and structures formed thereby
#682Magnetoresistive memory device
#683Instant restart in non volatile system memory computing systems with embedded programmable data checking
#684Protective cover
#685Stacked semiconductor device
#686Memory circuit and cache circuit configuration
#687Data storage and method of operating the same
#688Semiconductor packages usable with semiconductor chips having different pad arrangements and electronic devices having the same
#689Semiconductor device
#690Signal timing alignment based on a common data strobe in memory devices configured for stacked arrangements
#691Method of controlling temperature of non-volatile storage device
#692Memory module including battery
#693Tracking and use of tracked bit values for encoding and decoding data in unreliable memory
#694Memory system having a plurality of types of memory chips and a memory controller for controlling the memory chips
#695Memory modules including plural memory devices arranged in rows and module resistor units
#696Training and operations with a double buffered memory topology
#697Stacked memory device and system
#698Integrated circuit having multiple identified identical blocks
#699Three-dimensional vertical memory comprising dice with different interconnect levels
#700Memory module register access
#701On-die termination of address and command signals
#702Memory device and operation method thereof
#703Wireless serial links for communications between devices formed in a package
#704Memory type designation and/or verification system
#705Non-binary rank multiplication of memory module
#706Circuit having a non-symmetrical layout
#707Memory module and memory system
#708Stub minimization for assemblies without wirebonds to package substrate
#709Reduced load memory module using wire bonds and a plurality of rank signals
#710Single node power management for multiple memory devices
#711Memory controller configured to transmit interrupt signal if volatile memory has no data corresponding to address requested from source
#712Reliability-aware memory partitioning mechanisms for future memory technologies
#713ABOVE MOTHERBOARD INTERPOSER WITH QUARTER WAVELENGTH ELECTRICAL PATHS
#714Testing impedance adjustment
#715Front/back control of integrated circuits for flash dual inline memory modules
#716Memory module, memory system including the same, and data storage system including the memory module
#717Extended capacity memory module with dynamic data buffers
#718Multi-die memory device
#719High capacity memory system
#720Memory buffer with data scrambling and error correction
#721Memory access methods and apparatus
#722Degradation detection circuit and degradation adjustment apparatus including the same
#723Method and apparatus for performing error handling operations using error signals
#724Semiconductor package with PoP structure and refresh control method thereof
#725Wireless communication link using near field coupling
#726Stacked chip-on-board module with edge connector
#727Discrete three-dimensional one-time-programmable memory
#728High capacity memory system using standard controller component
#729Three-dimensional one-time-programmable memory comprising off-die read/write-voltage generator
#730Packed write completions
#731Memory system topologies including a buffer device and an integrated circuit memory device
#732Memory management method, memory storage device and memory controlling circuit unit
#733Power management
#734Method and apparatus for providing a host memory controller write credits for write commands
#735Method and apparatus for using an error signal to indicate a write request error and write request acceptance
#736Allocating and configuring persistent memory
#737System and method for performance optimal partial rank/bank interleaving for non-symmetrically populated DIMMs across DDR channels
#738Memory module in a package
#739Semiconductor device and electronic device
#740Memory with alternative command interfaces
#741Input circuit of three-dimensional semiconductor apparatus capable of enabling testing and direct access
#742Memory module with local synchronization
#743Semiconductor device having plural memory chip
#744Distributed capacitive delay tracking boost-assist circuit
#745Method and apparatus for selecting one of a plurality of bus interface configurations to use
#746Buffer circuit with data bit inversion
#747Controlled multi-step de-alignment of clocks
#748Semiconductor device capable of rescuing defective characteristics occurring after packaging
#749Method and apparatus for setting high address bits in a memory module
#750Extended-height DIMM
#751Memory system, memory module, and methods of operating the same
#752Semiconductor apparatus and system capable of reducing peak current in transmitting signals
#753Apparatuses and methods including selectively providing a single or separate chip select signals
#754Method and apparatus for a memory module to accept a command in multiple parts
#755Method and apparatus for encoding registers in a memory module
#756System including hierarchical memory modules having different types of integrated circuit memory devices
#757Method and apparatus for determining a timing adjustment of output to a host memory controller
#758Devices, methods, and systems supporting on unit termination
#759Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein
#760RAIDed memory system management
#761Semiconductor memory device including output buffer
#762Regulating voltage responsive to the shortest aggregate distance to the installed memory modules
#763Selecting a voltage sense line that maximizes memory margin
#764Netmory
#765Controlling temperature of a system memory
#766Semiconductor package on package memory channels with arbitration for shared calibration resources
#767Data buffer with strobe-based primary interface and a strobe-less secondary interface
#768Reconfigurable PoP
#769Discrete three-dimensional memory
#770Memory module with distributed data buffers and method of operation
#771Semiconductor memory device, memory system including the same, and method of operating the same
#772Communication interface architecture using serializer/deserializer
#773Flash controller to provide a value that represents a parameter to a flash memory
#774Stacked semiconductor device
#775Semiconductor device having interconnection in package and method for manufacturing the same
#776Stacked semiconductor package
#777Filter customization for search facilitation
#778Atomic non-volatile memory data transfer
#779Memory module set having offset memory module units facilitating pin connections to main IC, and semiconductor memory device and system including the same
#780System in package structure, electroplating module thereof and memory storage device
#781Techniques for handling errors in persistent memory
#782Semiconductor module having a tab pin with no tie bar
#783System for generating a test pattern to detect and isolate stuck faults for an interface using transition coding
#784Reclaimable semiconductor device package and associated systems and methods
#785Semiconductor device chip selection
#786Memory module and system supporting parallel and serial access modes
#787DRAM with SDRAM interface, and hybrid flash memory module
#788DRAM having SDRAM interface and flash memory consolidated memory module
#789Semiconductor device and structure
#790Semiconductor device
#791Apparatuses and methods for controlling refresh operations
#792Memory module having address mirroring function
#793Memory error repair
#794Multi-die memory device
#795Memory device comprising programmable command-and-address and/or data interfaces
#796Memory rank and ODT configuration in a memory system
#797Memory module and operation method thereof
#798Semiconductor device and semiconductor chip
#799Enhanced flash chip and method for packaging chip
#800Software-based self-test and diagnosis using on-chip memory
#801Accessing memory
#802Single package dual channel memory with co-support
#803System and method for offsetting the data buffer latency of a device implementing a JEDEC standard DDR-4 LRDIMM chipset
#804Allocating memory address space between DIMMs using memory controllers
#805Low latency, high bandwidth memory subsystem incorporating die-stacked DRAM
#806Allocating memory address space between DIMMs using memory controllers
#807Memory module having error correction logic
#808Traffic and temperature based memory testing
#809Traffic and temperature based memory testing
#810Semiconductor device
#811METHOD FOR READING A THIRD-DIMENSIONAL EMBEDDED RE-WRITEABLE NON-VOLATILE MEMORY AND REGISTERS
#812Non-volatile memory channel control using a general purpose programmable processor in combination with a low level programmable sequencer
#813Semiconductor memory device with a three-dimensional stacked memory cell structure
#814Semiconductor packages and data storage devices including the same
#815Combined rank and linear address incrementing utility for computer memory test operations
#816Semiconductor device
#817Dual-port DDR4-DIMMs of SDRAM and NVRAM for SSD-blades and multi-CPU servers
#818Stacked semiconductor apparatus and semiconductor system capable of inputting signals through various paths
#819Memory system which transfers management information between first and second memories in a burst mode before a read process is performed on a third memory
#820Memory module with dedicated repair devices
#821Device and method for repairing memory cell and memory system including the device
#822Memory module and memory system including the same
#823Failure diagnosis circuit
#824Load reduced memory module
#825Chip storing a value that represents adjustment to output drive strength
#826Chip having register to store value that represents adjustment to output drive strength
#827Chip having port to receive value that represents adjustment to transmission parameter
#828Memory buffers and modules supporting dynamic point-to-point connections
#829Stacked device detection and identification
#830Stub minimization for multi-die wirebond assemblies with parallel windows
#831Memory devices and methods for managing error regions
#832Stub minimization with terminal grids offset from center of package
#833Common platform for one-level memory architecture and two-level memory architecture
#834On-die termination of address and command signals
#835Semiconductor module
#836Memory system having a plurality of types of memory chips and a memory controller for controlling the memory chips
#837Memory system
#838Stack position determination in memory devices configured for stacked arrangements
#839High capacity memory system using standard controller component
#840High capacity memory system using standard controller component
#841Interlayer communications for 3D integrated circuit stack
#842Programming multiple serial input devices
#843Semiconductor memory device and a method of operating the same
#844System-in-package module with memory
#845Signal timing alignment based on a common data strobe in memory devices configured for stacked arrangements
#846Solid state drive card and an electronic system including the same
#847Load reduced memory module
#848Apparatuses and methods including selectively providing a single or separate chip select signals
#849System and method for heat dissipation
#850High capacity memory systems with inter-rank skew tolerance
#851Memory controller for selective rank or subrank access
#852Semiconductor device having plural memory chip
#853Memory module and manufacturing method thereof
#854TRANSMISSION LINE WITH DATA STORAGE FUNCTION
#855Memory module errors
#856Electronic device
#857Data processing device
#858Dual asynchronous and synchronous memory system
#859Method and system for synchronizing address and control signals in threaded memory modules
#860Method of using non-volatile memories for on-DIMM memory address list storage
#861Memory module
#862Valid command detection based on stack position identifiers in memory devices configured for stacked arrangements
#863Latency adjustment based on stack position identifier in memory devices configured for stacked arrangements
#864Memory devices with serially connected signals for stacked arrangements
#865Pad selection in memory devices configured for stacked arrangements
#866Chip having register to store value that represents adjustment to reference voltage
#867Storage apparatus and production method thereof
#868Memory module and memory system
#869Memory module in a package
#870Single package dual channel memory with co-support
#871Component placement within a solid state drive
#872Semiconductor chip, semiconductor apparatus having the same and method of arranging the same
#873Memory margin management
#874Semiconductor device including plural chips stacked to each other
#875Semiconductor device
#876Reconfigurable load-reduced memory buffer
#877Off-die charge pump that supplies multiple flash devices
#878Printed-circuit board supporting memory systems with multiple data-bus configurations
#879Semiconductor memory device with a 3-dimensional stacked memory cell structure
#880Systems and methods for testing pages of data stored in a memory module
#881DRAM retention test method for dynamic error correction
#882Data processing apparatus and method of controlling same
#883Semiconductor device capable of performing a read leveling and a write leveling based on an ambient temperature
#884Dual asynchronous and synchronous memory system
#885Training of storage devices in computing systems and environments
#886Synchronous semiconductor memory device having delay locked loop circuit and method of controlling the delay locked loop circuit
#887Semiconductor device
#888276-pin buffered memory card with enhanced memory system interconnect
#8893D non-volatile memory having low-current cells and methods
#890Semiconductor memory device and system conducting parity check and operating method of semiconductor memory device
#891Wiring configuration of a bus system and power wires in a memory chip
#892Multi-die memory device
#893Semiconductor memory and memory system including the semiconductor memory
#894Chip die and semiconductor memory device including the same
#895Modular, Scalable Rigid Flex Memory Module
#896Non-volatile memory channel control using a general purpose programmable processor in combination with a low level programmable sequencer
#897Apparatuses and methods for coupling semiconductor devices of a memory module in a memory system
#898Memory system topologies including a buffer device and an integrated circuit memory device
#899Memory module status indication
#900Memory module and memory system comprising same