ClassID:

206423

H01J2237/1518 - CPC Classification

Classification description:

Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging; Means for deflecting or directing discharge; Electrostatic means for X-Y scanning

Recent Application in this class:
#1
20240395495
2024-11-28

COMPACT 2D SCANNER MAGNET WITH TRAPEZOIDAL COILS

#2
20240096587
2024-03-21

DISTORTION OPTIMIZED MULTI-BEAM SCANNING SYSTEM

#3
20230282439
2023-09-07

Semiconductor wafer

#4
20220277921
2022-09-01

Method of influencing a charged particle beam, multipole device, and charged particle beam apparatus

#5
20210319974
2021-10-14

Multi-charged particle beam irradiation apparatus and multi-charged particle beam inspection apparatus

#6
20210296075
2021-09-23

Method and device for implanting ions in wafers

#7
20200043695
2020-02-06

Charged particle beam device

#8
20190267209
2019-08-29

Method and device for implanting ions in wafers

#9
20150325403
2015-11-12

Focused ion beam low kV enhancement

#10
20140352615
2014-12-04

High-energy ion implanter

#11
20130161511
2013-06-27

Sample observing device and sample observing method

#12
20110049382
2011-03-03

Pattern modification schemes for improved FIB patterning

#13
20110012617
2011-01-20

Methods and systems for testing digital-to-analog converter/amplifier circuits

#14
20100248166
2010-09-30

Deflector array, exposure apparatus, and device manufacturing method

#15
20090032725
2009-02-05

APPARATUS AND METHODS FOR TREATING A WORKPIECE USING A GAS CLUSTER ION BEAM

#16
20090008568
2009-01-08

Charged particle beam writing apparatus and method thereof

#17
20080017807
2008-01-24

Deflector array, exposure apparatus, and device manufacturing method

#18
20070075262
2007-04-05

Electrostatic deflection system with low aberrations and vertical beam incidence

#19
20060131698
2006-06-22

Wafer-scale microcolumn array using low temperature co-fired ceramic substrate

#20
17106016
2022-01-04

System, apparatus and method for bunched ribbon ion beam