ClassID:

205328

H01J37/32449 - CPC Classification

Classification description:

Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes; Constructional details of the reactor; Gas supply means Gas control, e.g. control of the gas flow

Recent Application in this class:
#1
20260155338
2026-06-04

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

#2
20260153796
2026-06-04

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

#3
20260150594
2026-05-28

COMBINATORIAL PRECURSOR CHEMISTRY FOR LOW TEMPERATURE

#4
20260148941
2026-05-28

SUBSTRATE PROCESSING APPARATUS, ELECTRODE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#5
20260148940
2026-05-28

SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING PROCESS MODULES AND GAS DELIVERY ASSEMBLIES CONFIGURED FOR PERFORMING CONCURRENT EPITAXIAL DEPOSITION OF MATERIAL LAYERS

#6
20260144023
2026-05-21

SILICON ON INSULATOR SUBSTRATE AND METHOD OF FORMING THE SAME

#7
20260143979
2026-05-21

SUBSTRATE PROCESSING METHOD

#8
20260142133
2026-05-21

DRY ETCHING DEVICE AND METHOD

#9
20260142130
2026-05-21

PLASMA PROCESSING METHOD

#10
20260142129
2026-05-21

GAS, GAS COMBINATION, ETCHING METHOD AND EQUIPMENT FOR PLASMA ETCHING

#11
20260136859
2026-05-14

ETCHING METHOD AND ETCHING DEVICE

#12
20260136843
2026-05-14

ETCHING A PHASE CHANGE MATERIAL

#13
20260135068
2026-05-14

System and Method for Atomic Layer Etching Process for High-Aspect-Ratio Structures with Accelerated In Situ Liner Deposition

#14
20260130139
2026-05-07

LOW TEMPERATURE SI-CONTAINING FILMS DEPOSITED FROM CHLOROSILANE AND AMINOSILANE REACTIONS

#15
20260128262
2026-05-07

METHOD OF PLASMA ETCHING

#16
20260124639
2026-05-07

DEPOSITING OF MATERIAL BY SPRAYING PRECURSOR USING SUPERCRITICAL FLUID

#17
20260123328
2026-04-30

SUBSTRATE PROCESSING METHOD

#18
20260123302
2026-04-30

METHOD AND APPARATUS FOR DEPOSITING A CARBON-CONTAINING MATERIAL

#19
20260121001
2026-04-30

SUBSTRATE PROCESSING APPARATUS

#20
20260120995
2026-04-30

DC BIAS IN PLASMA PROCESS

#21
20260114197
2026-04-23

PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATERIAL SURFACE PROPERTIES

#22
20260113964
2026-04-23

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIALS

#23
20260112588
2026-04-23

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

#24
20260112587
2026-04-23

CLEANING METHOD FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS

#25
20260112580
2026-04-23

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

#26
20260107715
2026-04-16

PLASMA PROCESSING SYSTEM

#27
20260106117
2026-04-16

DEPOSITION SYSTEM WITH MIXER AND PLASMA BYPASS ORIFICE

#28
20260101689
2026-04-09

METHOD FOR PLASMA ETCHING VERTICAL FEATURES IN A SILICON-BASED SEMICONDUCTOR LAYER OF A SUBSTRATE

#29
20260100342
2026-04-09

Rapid Process Chamber Pressure Modulation Using Chamber Pressure Control Ring with Micro Shutters

#30
20260100337
2026-04-09

PLASMA ETCHING METHOD

#31
20260098357
2026-04-09

PLASMA GENERATOR AND INJECTOR ASSEMBLY FOR LAYER INSERTION, AND RELATED METHODS, PROCESSING CHAMBERS, AND SYSTEMS

#32
20260096366
2026-04-02

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM

#33
20260094791
2026-04-02

REMOVING METAL OXIDE FROM METALLIC CONTACTS ON SUBSTRATES, DIES AND WAFERS WITH ATMOSPHERIC PRESSURE PLASMA

#34
20260094790
2026-04-02

SUBSTRATE PROCESSING APPARATUS

#35
20260094789
2026-04-02

Simplified Gas Delivery System for Atomic Layer Etching

#36
20260092372
2026-04-02

CO-JET NOZZLE ASSEMBLY AND ANOMALY DETECTION

#37
20260092367
2026-04-02

FILM FORMING METHOD

#38
20260092360
2026-04-02

CYCLICAL DEPOSITION METHOD INCLUDING TREATMENT STEP AND APPARATUS FOR SAME

#39
20260090293
2026-03-26

SEMICONDUCTOR STACKS AND PROCESSES THEREOF

#40
20260088258
2026-03-26

EDGE EXCLUSION CONTROL

#41
20260088257
2026-03-26

GAS INJECTOR ASSEMBLY WITH IMPROVED GAS MIXING

#42
20260088256
2026-03-26

FLOW ADAPTORS FOR GAS FLOWS, AND RELATED PROCESSING CHAMBERS, PROCESSING SYSTEMS, APPARATUS, AND METHODS

#43
20260085417
2026-03-26

GAS-PHASE CHEMICAL REACTOR AND METHOD OF USING SAME

#44
20260085403
2026-03-26

DEPOSITION-ETCH SPECIES IADF AND IEDF CONTROL FOR CARBON GAPFILL PROCESSES

#45
20260082879
2026-03-19

DIRECTIONAL SIDEWALL DEPOSITION USING DIRECTIONAL BEAM

#46
20260082832
2026-03-19

METHOD OF FILLING GAP WITH FLOWABLE CARBON LAYER

#47
20260081122
2026-03-19

SYSTEM AND METHOD FOR ADAPTIVE CLEANING OF A HIGH-VACUUM CHAMBER

#48
20260081121
2026-03-19

PLASMA PROCESSING SYSTEM AND EXHAUST SYSTEM

#49
20260081115
2026-03-19

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#50
20260081114
2026-03-19

APPARATUS FOR PROCEEDING SURFACE HEAT TREATMENT BY PLASMA AND METHOD USING THE SAME

#51
20260076119
2026-03-12

METHOD FOR ETCHING FEATURES USING HF GAS

#52
20260074157
2026-03-12

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

#53
20260074155
2026-03-12

PLASMA PROCESSING APPARATUS

#54
20260074153
2026-03-12

System and Method for Atomic Layer Etching and Radical-Based Highly Selective Etching in a Single Process Chamber

#55
20260068619
2026-03-05

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

#56
20260068563
2026-03-05

PLASMA ASSISTED DEPOSITION AND ETCHING METHODS, AND RELATED PROCESSING CHAMBERS, SYSTEMS, AND APPARATUS

#57
20260068527
2026-03-05

METHOD OF PLASMA ETCHING

#58
20260066237
2026-03-05

PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD

#59
20260066236
2026-03-05

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA

#60
20260066235
2026-03-05

DEVICE FOR PROVIDING A PLASMA

#61
20260066223
2026-03-05

PLASMA GENERATION APPARATUS, SYSTEM, AND METHOD

#62
20260062803
2026-03-05

SEMICONDUCTOR PROCESSING SYSTEMS AND ASSOCIATED METHODS FOR FORMING SUPER-LATTICE STRUCTURES USING SEMICONDUCTOR PROCESSING SYSTEMS

#63
20260060019
2026-02-26

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM

#64
20260060016
2026-02-26

SUBSTRATE PROCESSING INCLUDING INITIAL ETCHING AND FAST ETCHING, AND RELATED METHODS, APPARATUS, SYSTEMS, AND CHAMBERS

#65
20260059825
2026-02-26

METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

#66
20260058104
2026-02-26

SEMICONDUCTOR PROCESSING TOOL WITH HOT GAS PURGE

#67
20260051461
2026-02-19

SYSTEMS AND METHODS FOR BEVEL DEPOSITION

#68
20260051456
2026-02-19

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

#69
20260047378
2026-02-12

RADIATION SHIELD

#70
20260045459
2026-02-12

IN SITU SIDEWALL CLEANING DURING PLASMA ETCH WITH METAL-CONTAINING MASK

#71
20260045453
2026-02-12

SUBSTRATE PROCESSING APPARATUS

#72
20260043140
2026-02-12

DECORATIVELY COATED POLYMER SUBSTRATES AND PROCESS FOR OBTAINING THE SAME

#73
20260040863
2026-02-05

Enhanced Atomic Layer Etching Process with Optimized Gas Flow Control for Semiconductor Manufacturing

#74
20260040847
2026-02-05

INERT RADICAL ASSISTED CVD LOW K FILM DEPOSITION

#75
20260038777
2026-02-05

INFORMATION PROCESSING APPARATUS, COMPUTER-READABLE MEDIUM, AND INFORMATION PROCESSING METHOD

#76
20260038775
2026-02-05

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#77
20260038773
2026-02-05

Hybrid Plasma-Enhanced Atomic Layer Etching (PEALE) And Plasma-Enhanced Atomic Layer Deposition (PEALD) In A Single Reactor/Chamber

#78
20260038772
2026-02-05

SUBSTRATE PROCESSING APPARATUS

#79
20260033261
2026-01-29

ETCHING METHOD AND ETCHING APPARATUS

#80
20260031311
2026-01-29

PLASMA MONITORING AND PLASMA DENSITY MEASUREMENT IN PLASMA PROCESSING SYSTEMS

#81
20260024728
2026-01-22

PROCESSING APPARATUS AND PROCESSING METHOD

#82
20260024727
2026-01-22

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#83
20260018402
2026-01-15

METHODS OF FILLING GAP ON SUBSTRATE SURFACE

#84
20260018385
2026-01-15

GAS DISTRIBUTION MODULE, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS

#85
20260018381
2026-01-15

ETCHING APPARATUS AND ETCHING METHOD

#86
20260015727
2026-01-15

THROTTLE VALVE POSITION ENDPOINT CONTROL WITHIN A DEPOSITION PROCESS

#87
20260011556
2026-01-08

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

#88
20260009131
2026-01-08

SEMICONDUCTOR PROCESSING TOOL WITH ADJUSTABLE GAS FLOW DISTRIBUTION

#89
20260009124
2026-01-08

FILM FORMING METHOD AND FILM FORMING APPARATUS

#90
20260005031
2026-01-01

System and Method for Improving Atomic Layer Etching Performance

#91
20260005018
2026-01-01

GAPFILL METHOD, SYSTEM AND APPARATUS

#92
20260004999
2026-01-01

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS FOR USING A FIRST PLASMA GENERATED FROM A FIRST PROCESSING GAS THAT INCLUDES A CARBON CONTAINING GAS IN A CHAMBER TO FORM A FIRST FILM ON AN INNNER WALL OF THE CHAMBER AND A SUBSTRATE SUPPORT SURFACE

#93
20260004997
2026-01-01

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

#94
20260004996
2026-01-01

UNIFORM IN SITU CLEANING AND DEPOSITION

#95
20250391671
2025-12-25

REACTION CHAMBER WITH MULTI PHASE PRECURSOR DELIVERY

#96
20250391653
2025-12-25

METHODS OF REPAIRING LOW-K MATERIALS AFTER INTEGRATION OPERATIONS

#97
20250391645
2025-12-25

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

#98
20250385108
2025-12-18

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#99
20250385078
2025-12-18

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

#100
20250385077
2025-12-18

INTEGRATED SHOWERHEAD

#101
20250385076
2025-12-18

System and Method for Rapid Gas Delivery for Atomic Layer Etching

#102
20250385074
2025-12-18

RADIO FREQUENCY MATCHING NETWORK

#103
20250382432
2025-12-18

Substrate Processing Method and Substrate Processing Apparatus

#104
20250379041
2025-12-11

System and Method for Rapidly Establishing Steady State Vacuum Chamber Pressures

#105
20250379040
2025-12-11

GAS DISTRIBUTION ASSEMBLY AND METHOD OF USING SAME

#106
20250372412
2025-12-04

Fast Gas Delivery System for Enhanced Semiconductor Process Efficiency

#107
20250372385
2025-12-04

METHODS FOR GAP FILLING VERTICAL AND LATERAL FEATURES WITH PLASMA INHIBITION

#108
20250372367
2025-12-04

DEPOSITION AND ETCH OF SILICON-CONTAINING LAYER

#109
20250372350
2025-12-04

Substrate Processing Method and Substrate Processing Apparatus

#110
20250364233
2025-11-27

Methods and Systems for Managing Byproduct Material Accumulation During Plasma-Based Semiconductor Wafer Fabrication Process

#111
20250364230
2025-11-27

METHODS FOR RETROFITTING AN ETCHING APPARATUS

#112
20250364222
2025-11-27

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

#113
20250364221
2025-11-27

PLASMA PROCESSING METHOD, PRECOAT FORMING METHOD, AND PLASMA PROCESSING APPARATUS

#114
20250364220
2025-11-27

BILAYER PLASMA OXIDATION PROCESSES

#115
20250364210
2025-11-27

PECVD TRENCH BOTTOM PROFILE CONTROL WITH PULSED DUAL RF PLASMA

#116
20250357136
2025-11-20

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

#117
20250357133
2025-11-20

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

#118
20250357113
2025-11-20

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

#119
20250357086
2025-11-20

PLASMA PROCESSING DEVICE

#120
20250357085
2025-11-20

Device for Performing Plasma Treatment, and Method for Performing Plasma Treatment

#121
20250357081
2025-11-20

METHOD FOR FABRICATING NANOPATTERNED SUBSTRATES

#122
20250349552
2025-11-13

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

#123
20250349519
2025-11-13

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

#124
20250343032
2025-11-06

SUBSTRATE PROCESSING APPARATUS WITH TEMPERATURE CONTROLLER

#125
20250343031
2025-11-06

DEVICES AND METHODS FOR CONTROLLING WAFER UNIFORMITY IN PLASMA-BASED PROCESS

#126
20250343030
2025-11-06

PROCESSING CHAMBER AND METHOD FOR INTEGRATED ETCHING AND DEPOSITION

#127
20250336681
2025-10-30

ETCHING METHOD AND ETCHING DEVICE

#128
20250336674
2025-10-30

IN SITU DEPOSITION OF FILMSTACKS FOR EUV PATTERNING

#129
20250336670
2025-10-30

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM

#130
20250336668
2025-10-30

METHODS OF FILLING RECESSES ON SUBSTRATE SURFACES AND FORMING VOIDS THEREIN

#131
20250336648
2025-10-30

GAS SUPPLY APPARATUS AND PLASMA PROCESSING APPARATUS

#132
20250336647
2025-10-30

FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD

#133
20250329529
2025-10-23

VOLUMETRIC EXPANSION DEPOSITION OF SILICON BASED DIELECTRIC FILM

#134
20250329517
2025-10-23

WAFER PROCESSING METHOD

#135
20250329516
2025-10-23

ETCHING METHOD

#136
20250327180
2025-10-23

HIGH TEMPERATURE COATINGS FOR A PRECLEAN AND ETCH APPARATUS AND RELATED METHODS

#137
20250323055
2025-10-16

ETCHING METHOD

#138
20250323024
2025-10-16

TEMPERATURE-CONTROLLED PLASMA GENERATION SYSTEM

#139
20250316465
2025-10-09

FLUORINATION CLEANING DEVICE FOR CLEANING LINER-TYPE PART SEMICONDUCTOR DRY ETCHING SYSTEM AND FLUORINATION CLEANING APPARATUS INCLUDING THE SAME

#140
20250316464
2025-10-09

FLUORINATION CLEANING DEVICE FOR CLEANING SHOWERHEAD-TYPE PART FOR SEMICONDUCTOR DRY ETCHING SYSTEM AND FLUORINATION CLEANING APPARATUS INCLUDING THE SAME

#141
20250316457
2025-10-09

ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR

#142
20250316454
2025-10-09

REMOTE PLASMA SOURCES

#143
20250316448
2025-10-09

HETEROGEOUS NEGATIVE ION SOURCE BASED UPON HYDROGEN PLASMA

#144
20250308926
2025-10-02

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

#145
20250308923
2025-10-02

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

#146
20250308912
2025-10-02

METHOD AND APPARATUS FOR PLASMA ETCHING A SUBSTRATE

#147
20250308895
2025-10-02

SELECTIVE IN-SITU CARBON-BASED MASK PROTECTION

#148
20250308894
2025-10-02

HARDMASK FOR HIGH ASPECT RATIO DIELECTRIC ETCH AT CRYO AND ELEVATED TEMPERATURES

#149
20250308885
2025-10-02

HYDROGEN REDUCTION IN AMORPHOUS CARBON FILMS

#150
20250308881
2025-10-02

SILICON ETCH BYPRODUCT REMOVAL

#151
20250308866
2025-10-02

FLUORINATION CLEANING METHOD AND APPARATUS FOR FORMING YTTRIUM OXYFLUORIDE ON YTTRIA-COATED PART FOR SEMICONDUCTOR DRY ETCHING SYSTEM

#152
20250308865
2025-10-02

SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK

#153
20250308853
2025-10-02

METHOD OF MANUFACTURING POWER SEMICONDUCTOR ELEMENT

#154
20250308840
2025-10-02

SAMPLE PREPARATION WITH NON-UNIFORM DOSE

#155
20250305123
2025-10-02

METHOD AND APPARATUS FOR FORMING PROTECTIVE FLUORIDE LAYER ON PART HAVING GAS FLOW PASSAGE FOR SEMICONDUCTOR DEPOSITION APPARATUS

#156
20250299936
2025-09-25

REMOTE PLASMA ULTRAVIOLET ENHANCED DEPOSITION

#157
20250299933
2025-09-25

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

#158
20250299928
2025-09-25

PLASMA PROCESSING METHOD

#159
20250299927
2025-09-25

PLASMA ETCH-DEPOSITION PROCESSES AND SYSTEMS

#160
20250297362
2025-09-25

GAS SUPPLY LINE ARRANGEMENTS

#161
20250293036
2025-09-18

SUBSTRATE PROCESSING METHOD

#162
20250293035
2025-09-18

METHOD OF ETCHING INDIUM-BASED SEMICONDUCTOR MATERIALS

#163
20250293022
2025-09-18

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM

#164
20250293021
2025-09-18

FILM FORMING METHOD AND FILM FORMING APPARATUS

#165
20250293012
2025-09-18

SYSTEM AND METHOD FOR SEMICONDUCTOR PROCESSING

#166
20250293009
2025-09-18

ADVANCED THERMAL MANAGEMENT SYSTEM (ATM) FOR PEDESTAL TEMPERATURE CONTROL IN HIGH POWER PECVD CHAMBER

#167
20250293002
2025-09-18

Workpiece Processing Apparatus with Outer Gas Channel Insert

#168
20250290195
2025-09-18

MAGNETRON SPUTTERING DEVICE AND METHOD FOR AMORPHOUS CARBON FILM AND AMORPHOUS CARBON FILM FOR PHOTORESIST DEPOSITED USING THE SAME

#169
20250287480
2025-09-11

MICROWAVE UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

#170
20250285911
2025-09-11

IN SITU ETCH RATE DIFFERENTIATION THROUGH OXIDATION

#171
20250285846
2025-09-11

PLASMA PRECLEAN SYSTEM FOR CLUSTER TOOL

#172
20250285841
2025-09-11

SYSTEMS, METHODS, AND APPARATUSES FOR ATMOSPHERIC PRESSURE PLASMA JET NOZZLES

#173
20250279285
2025-09-04

Plasma Etching Method

#174
20250279283
2025-09-04

SELECTIVE ETCHING OF ALTERNATING LAYERS OF SILICON OXIDE AND SILICON NITRIDE FOR HIGH ASPECT RATIO CONTACTS

#175
20250279263
2025-09-04

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

#176
20250279261
2025-09-04

METHOD AND DEVICE FOR THIN FILM PROCESS INCLUDING ACTIVATED PROTON ASSIST PLASMA ETCHING

#177
20250273475
2025-08-28

QUASI-ATOMIC LAYER ETCHING OF SILICON NITRIDE ENHANCED BY REDUCED WAFER TEMPERATURE

#178
20250273466
2025-08-28

VERTICAL FEATURE GROWTH USING FLUORINE-CONTAINING GAS

#179
20250273445
2025-08-28

SUBSTRATE PROCESSING APPARATUS

#180
20250273444
2025-08-28

PLASMA PROCESSING APPARATUS

#181
20250273439
2025-08-28

METHOD OF UNIFORMITY CONTROL

#182
20250273438
2025-08-28

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

#183
20250266245
2025-08-21

APPARATUS FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#184
20250266242
2025-08-21

PLASMA ETCHING DEVICES AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES USING THE SAME

#185
20250259888
2025-08-14

METHODS FOR DEPOSITING GAP FILLING FLUIDS AND RELATED SYSTEMS AND DEVICES

#186
20250259855
2025-08-14

IN-SITU METAL DEPOSITION FOR REDUCED CHARGING DURING DIELECTRIC ETCH

#187
20250259826
2025-08-14

GAS SUPPLY DEVICE AND PLASMA PROCESSING APPARATUS

#188
20250257453
2025-08-14

THROUGHPUT IMPROVEMENT WITH INTERVAL CONDITIONING PURGING

#189
20250254969
2025-08-07

CONTROL OF SILICON NITRIDE TOPOLOGY AT TRENCH BOTTOM

#190
20250253156
2025-08-07

DEPOSITION AND ETCHING FOR SELECTIVE REMOVAL OF DEPOSITED DIELECTRIC FILM FROM TOPS OF FINS

#191
20250253145
2025-08-07

SUBSTRATE PROCESSING METHOD

#192
20250253138
2025-08-07

Plasma Processing Apparatus and Plasma Processing Method

#193
20250253137
2025-08-07

SUBSTRATE PROCESSING APPARATUS INCLUDING SHOWER HEAD AND EDGE RING AND RELATED METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

#194
20250250194
2025-08-07

METHOD FOR MANUFACTURING FINE SURFACE ROUGHNESS ON QUARTZ GLASS SUBSTRATE

#195
20250246486
2025-07-31

STATION-TO-STATION CONTROL OF BACKSIDE BOW COMPENSATION DEPOSITION

#196
20250246412
2025-07-31

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

#197
20250239476
2025-07-24

ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS

#198
20250239442
2025-07-24

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SUBSTRATE PROCESSING APPARATUS

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FAST ATOMIC LAYER ETCH

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METAL OXIDE DIRECTIONAL REMOVAL

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SHOWERHEAD FOR SUBSTRATE PROCESSING SYSTEMS

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CONDITIONING OF A PROCESSING CHAMBER

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METHOD OF FORMING SILICON NITRIDE FILM AND FILM FORMING APPARATUS

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GAS CURTAIN FOR SEMICONDUCTOR MANUFACUTRING SYSTEM

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DUAL PLENUM SHOWERHEAD WITH CENTER TO EDGE TUNABILITY

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Oxidation-Reduction Adjustable Plasma

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METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTIVE PASSIVATION

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SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF CONTROLLING PHYSICAL QUANTITY OF SEMICONDUCTOR MANUFACTURING APPARATUS

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PLASMA PROCESSING SYSTEM, ASSISTANCE DEVICE, ASSISTANCE METHOD, AND ASSISTANCE PROGRAM

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CHAMBER AND METHODS FOR DOWNSTREAM RESIDUE MANAGEMENT

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SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE SUPPORT UNIT

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IN-SITU BACK SIDE PLASMA TREATMENT FOR RESIDUE REMOVAL FROM SUBSTRATES

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Plasma Etched Compound Semiconductor

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DIELECTRIC PLASMA ETCHING USING C2H2F2

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