205328 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes; Constructional details of the reactor; Gas supply means Gas control, e.g. control of the gas flow
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#2ETCHING METHOD AND PLASMA PROCESSING SYSTEM
#3COMBINATORIAL PRECURSOR CHEMISTRY FOR LOW TEMPERATURE
#4SUBSTRATE PROCESSING APPARATUS, ELECTRODE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#5SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING PROCESS MODULES AND GAS DELIVERY ASSEMBLIES CONFIGURED FOR PERFORMING CONCURRENT EPITAXIAL DEPOSITION OF MATERIAL LAYERS
#6SILICON ON INSULATOR SUBSTRATE AND METHOD OF FORMING THE SAME
#7SUBSTRATE PROCESSING METHOD
#8DRY ETCHING DEVICE AND METHOD
#9PLASMA PROCESSING METHOD
#10GAS, GAS COMBINATION, ETCHING METHOD AND EQUIPMENT FOR PLASMA ETCHING
#11ETCHING METHOD AND ETCHING DEVICE
#12ETCHING A PHASE CHANGE MATERIAL
#13System and Method for Atomic Layer Etching Process for High-Aspect-Ratio Structures with Accelerated In Situ Liner Deposition
#14LOW TEMPERATURE SI-CONTAINING FILMS DEPOSITED FROM CHLOROSILANE AND AMINOSILANE REACTIONS
#15METHOD OF PLASMA ETCHING
#16DEPOSITING OF MATERIAL BY SPRAYING PRECURSOR USING SUPERCRITICAL FLUID
#17SUBSTRATE PROCESSING METHOD
#18METHOD AND APPARATUS FOR DEPOSITING A CARBON-CONTAINING MATERIAL
#19SUBSTRATE PROCESSING APPARATUS
#20DC BIAS IN PLASMA PROCESS
#21PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATERIAL SURFACE PROPERTIES
#22METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIALS
#23PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#24CLEANING METHOD FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS
#25PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#26PLASMA PROCESSING SYSTEM
#27DEPOSITION SYSTEM WITH MIXER AND PLASMA BYPASS ORIFICE
#28METHOD FOR PLASMA ETCHING VERTICAL FEATURES IN A SILICON-BASED SEMICONDUCTOR LAYER OF A SUBSTRATE
#29Rapid Process Chamber Pressure Modulation Using Chamber Pressure Control Ring with Micro Shutters
#30PLASMA ETCHING METHOD
#31PLASMA GENERATOR AND INJECTOR ASSEMBLY FOR LAYER INSERTION, AND RELATED METHODS, PROCESSING CHAMBERS, AND SYSTEMS
#32PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM
#33REMOVING METAL OXIDE FROM METALLIC CONTACTS ON SUBSTRATES, DIES AND WAFERS WITH ATMOSPHERIC PRESSURE PLASMA
#34SUBSTRATE PROCESSING APPARATUS
#35Simplified Gas Delivery System for Atomic Layer Etching
#36CO-JET NOZZLE ASSEMBLY AND ANOMALY DETECTION
#37FILM FORMING METHOD
#38CYCLICAL DEPOSITION METHOD INCLUDING TREATMENT STEP AND APPARATUS FOR SAME
#39SEMICONDUCTOR STACKS AND PROCESSES THEREOF
#40EDGE EXCLUSION CONTROL
#41GAS INJECTOR ASSEMBLY WITH IMPROVED GAS MIXING
#42FLOW ADAPTORS FOR GAS FLOWS, AND RELATED PROCESSING CHAMBERS, PROCESSING SYSTEMS, APPARATUS, AND METHODS
#43GAS-PHASE CHEMICAL REACTOR AND METHOD OF USING SAME
#44DEPOSITION-ETCH SPECIES IADF AND IEDF CONTROL FOR CARBON GAPFILL PROCESSES
#45DIRECTIONAL SIDEWALL DEPOSITION USING DIRECTIONAL BEAM
#46METHOD OF FILLING GAP WITH FLOWABLE CARBON LAYER
#47SYSTEM AND METHOD FOR ADAPTIVE CLEANING OF A HIGH-VACUUM CHAMBER
#48PLASMA PROCESSING SYSTEM AND EXHAUST SYSTEM
#49SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#50APPARATUS FOR PROCEEDING SURFACE HEAT TREATMENT BY PLASMA AND METHOD USING THE SAME
#51METHOD FOR ETCHING FEATURES USING HF GAS
#52PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#53PLASMA PROCESSING APPARATUS
#54System and Method for Atomic Layer Etching and Radical-Based Highly Selective Etching in a Single Process Chamber
#55SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#56PLASMA ASSISTED DEPOSITION AND ETCHING METHODS, AND RELATED PROCESSING CHAMBERS, SYSTEMS, AND APPARATUS
#57METHOD OF PLASMA ETCHING
#58PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD
#59APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA
#60DEVICE FOR PROVIDING A PLASMA
#61PLASMA GENERATION APPARATUS, SYSTEM, AND METHOD
#62SEMICONDUCTOR PROCESSING SYSTEMS AND ASSOCIATED METHODS FOR FORMING SUPER-LATTICE STRUCTURES USING SEMICONDUCTOR PROCESSING SYSTEMS
#63PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM
#64SUBSTRATE PROCESSING INCLUDING INITIAL ETCHING AND FAST ETCHING, AND RELATED METHODS, APPARATUS, SYSTEMS, AND CHAMBERS
#65METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE
#66SEMICONDUCTOR PROCESSING TOOL WITH HOT GAS PURGE
#67SYSTEMS AND METHODS FOR BEVEL DEPOSITION
#68PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#69RADIATION SHIELD
#70IN SITU SIDEWALL CLEANING DURING PLASMA ETCH WITH METAL-CONTAINING MASK
#71SUBSTRATE PROCESSING APPARATUS
#72DECORATIVELY COATED POLYMER SUBSTRATES AND PROCESS FOR OBTAINING THE SAME
#73Enhanced Atomic Layer Etching Process with Optimized Gas Flow Control for Semiconductor Manufacturing
#74INERT RADICAL ASSISTED CVD LOW K FILM DEPOSITION
#75INFORMATION PROCESSING APPARATUS, COMPUTER-READABLE MEDIUM, AND INFORMATION PROCESSING METHOD
#76SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#77Hybrid Plasma-Enhanced Atomic Layer Etching (PEALE) And Plasma-Enhanced Atomic Layer Deposition (PEALD) In A Single Reactor/Chamber
#78SUBSTRATE PROCESSING APPARATUS
#79ETCHING METHOD AND ETCHING APPARATUS
#80PLASMA MONITORING AND PLASMA DENSITY MEASUREMENT IN PLASMA PROCESSING SYSTEMS
#81PROCESSING APPARATUS AND PROCESSING METHOD
#82SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#83METHODS OF FILLING GAP ON SUBSTRATE SURFACE
#84GAS DISTRIBUTION MODULE, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS
#85ETCHING APPARATUS AND ETCHING METHOD
#86THROTTLE VALVE POSITION ENDPOINT CONTROL WITHIN A DEPOSITION PROCESS
#87PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#88SEMICONDUCTOR PROCESSING TOOL WITH ADJUSTABLE GAS FLOW DISTRIBUTION
#89FILM FORMING METHOD AND FILM FORMING APPARATUS
#90System and Method for Improving Atomic Layer Etching Performance
#91GAPFILL METHOD, SYSTEM AND APPARATUS
#92PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS FOR USING A FIRST PLASMA GENERATED FROM A FIRST PROCESSING GAS THAT INCLUDES A CARBON CONTAINING GAS IN A CHAMBER TO FORM A FIRST FILM ON AN INNNER WALL OF THE CHAMBER AND A SUBSTRATE SUPPORT SURFACE
#93SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#94UNIFORM IN SITU CLEANING AND DEPOSITION
#95REACTION CHAMBER WITH MULTI PHASE PRECURSOR DELIVERY
#96METHODS OF REPAIRING LOW-K MATERIALS AFTER INTEGRATION OPERATIONS
#97PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#98METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#99SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#100INTEGRATED SHOWERHEAD
#101System and Method for Rapid Gas Delivery for Atomic Layer Etching
#102RADIO FREQUENCY MATCHING NETWORK
#103Substrate Processing Method and Substrate Processing Apparatus
#104System and Method for Rapidly Establishing Steady State Vacuum Chamber Pressures
#105GAS DISTRIBUTION ASSEMBLY AND METHOD OF USING SAME
#106Fast Gas Delivery System for Enhanced Semiconductor Process Efficiency
#107METHODS FOR GAP FILLING VERTICAL AND LATERAL FEATURES WITH PLASMA INHIBITION
#108DEPOSITION AND ETCH OF SILICON-CONTAINING LAYER
#109Substrate Processing Method and Substrate Processing Apparatus
#110Methods and Systems for Managing Byproduct Material Accumulation During Plasma-Based Semiconductor Wafer Fabrication Process
#111METHODS FOR RETROFITTING AN ETCHING APPARATUS
#112SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
#113PLASMA PROCESSING METHOD, PRECOAT FORMING METHOD, AND PLASMA PROCESSING APPARATUS
#114BILAYER PLASMA OXIDATION PROCESSES
#115PECVD TRENCH BOTTOM PROFILE CONTROL WITH PULSED DUAL RF PLASMA
#116ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#117ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#118SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#119PLASMA PROCESSING DEVICE
#120Device for Performing Plasma Treatment, and Method for Performing Plasma Treatment
#121METHOD FOR FABRICATING NANOPATTERNED SUBSTRATES
#122ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#123SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
#124SUBSTRATE PROCESSING APPARATUS WITH TEMPERATURE CONTROLLER
#125DEVICES AND METHODS FOR CONTROLLING WAFER UNIFORMITY IN PLASMA-BASED PROCESS
#126PROCESSING CHAMBER AND METHOD FOR INTEGRATED ETCHING AND DEPOSITION
#127ETCHING METHOD AND ETCHING DEVICE
#128IN SITU DEPOSITION OF FILMSTACKS FOR EUV PATTERNING
#129PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM
#130METHODS OF FILLING RECESSES ON SUBSTRATE SURFACES AND FORMING VOIDS THEREIN
#131GAS SUPPLY APPARATUS AND PLASMA PROCESSING APPARATUS
#132FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
#133VOLUMETRIC EXPANSION DEPOSITION OF SILICON BASED DIELECTRIC FILM
#134WAFER PROCESSING METHOD
#135ETCHING METHOD
#136HIGH TEMPERATURE COATINGS FOR A PRECLEAN AND ETCH APPARATUS AND RELATED METHODS
#137ETCHING METHOD
#138TEMPERATURE-CONTROLLED PLASMA GENERATION SYSTEM
#139FLUORINATION CLEANING DEVICE FOR CLEANING LINER-TYPE PART SEMICONDUCTOR DRY ETCHING SYSTEM AND FLUORINATION CLEANING APPARATUS INCLUDING THE SAME
#140FLUORINATION CLEANING DEVICE FOR CLEANING SHOWERHEAD-TYPE PART FOR SEMICONDUCTOR DRY ETCHING SYSTEM AND FLUORINATION CLEANING APPARATUS INCLUDING THE SAME
#141ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR
#142REMOTE PLASMA SOURCES
#143HETEROGEOUS NEGATIVE ION SOURCE BASED UPON HYDROGEN PLASMA
#144SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#145SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#146METHOD AND APPARATUS FOR PLASMA ETCHING A SUBSTRATE
#147SELECTIVE IN-SITU CARBON-BASED MASK PROTECTION
#148HARDMASK FOR HIGH ASPECT RATIO DIELECTRIC ETCH AT CRYO AND ELEVATED TEMPERATURES
#149HYDROGEN REDUCTION IN AMORPHOUS CARBON FILMS
#150SILICON ETCH BYPRODUCT REMOVAL
#151FLUORINATION CLEANING METHOD AND APPARATUS FOR FORMING YTTRIUM OXYFLUORIDE ON YTTRIA-COATED PART FOR SEMICONDUCTOR DRY ETCHING SYSTEM
#152SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK
#153METHOD OF MANUFACTURING POWER SEMICONDUCTOR ELEMENT
#154SAMPLE PREPARATION WITH NON-UNIFORM DOSE
#155METHOD AND APPARATUS FOR FORMING PROTECTIVE FLUORIDE LAYER ON PART HAVING GAS FLOW PASSAGE FOR SEMICONDUCTOR DEPOSITION APPARATUS
#156REMOTE PLASMA ULTRAVIOLET ENHANCED DEPOSITION
#157SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#158PLASMA PROCESSING METHOD
#159PLASMA ETCH-DEPOSITION PROCESSES AND SYSTEMS
#160GAS SUPPLY LINE ARRANGEMENTS
#161SUBSTRATE PROCESSING METHOD
#162METHOD OF ETCHING INDIUM-BASED SEMICONDUCTOR MATERIALS
#163METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
#164FILM FORMING METHOD AND FILM FORMING APPARATUS
#165SYSTEM AND METHOD FOR SEMICONDUCTOR PROCESSING
#166ADVANCED THERMAL MANAGEMENT SYSTEM (ATM) FOR PEDESTAL TEMPERATURE CONTROL IN HIGH POWER PECVD CHAMBER
#167Workpiece Processing Apparatus with Outer Gas Channel Insert
#168MAGNETRON SPUTTERING DEVICE AND METHOD FOR AMORPHOUS CARBON FILM AND AMORPHOUS CARBON FILM FOR PHOTORESIST DEPOSITED USING THE SAME
#169MICROWAVE UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#170IN SITU ETCH RATE DIFFERENTIATION THROUGH OXIDATION
#171PLASMA PRECLEAN SYSTEM FOR CLUSTER TOOL
#172SYSTEMS, METHODS, AND APPARATUSES FOR ATMOSPHERIC PRESSURE PLASMA JET NOZZLES
#173Plasma Etching Method
#174SELECTIVE ETCHING OF ALTERNATING LAYERS OF SILICON OXIDE AND SILICON NITRIDE FOR HIGH ASPECT RATIO CONTACTS
#175ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#176METHOD AND DEVICE FOR THIN FILM PROCESS INCLUDING ACTIVATED PROTON ASSIST PLASMA ETCHING
#177QUASI-ATOMIC LAYER ETCHING OF SILICON NITRIDE ENHANCED BY REDUCED WAFER TEMPERATURE
#178VERTICAL FEATURE GROWTH USING FLUORINE-CONTAINING GAS
#179SUBSTRATE PROCESSING APPARATUS
#180PLASMA PROCESSING APPARATUS
#181METHOD OF UNIFORMITY CONTROL
#182PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#183APPARATUS FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#184PLASMA ETCHING DEVICES AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES USING THE SAME
#185METHODS FOR DEPOSITING GAP FILLING FLUIDS AND RELATED SYSTEMS AND DEVICES
#186IN-SITU METAL DEPOSITION FOR REDUCED CHARGING DURING DIELECTRIC ETCH
#187GAS SUPPLY DEVICE AND PLASMA PROCESSING APPARATUS
#188THROUGHPUT IMPROVEMENT WITH INTERVAL CONDITIONING PURGING
#189CONTROL OF SILICON NITRIDE TOPOLOGY AT TRENCH BOTTOM
#190DEPOSITION AND ETCHING FOR SELECTIVE REMOVAL OF DEPOSITED DIELECTRIC FILM FROM TOPS OF FINS
#191SUBSTRATE PROCESSING METHOD
#192Plasma Processing Apparatus and Plasma Processing Method
#193SUBSTRATE PROCESSING APPARATUS INCLUDING SHOWER HEAD AND EDGE RING AND RELATED METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#194METHOD FOR MANUFACTURING FINE SURFACE ROUGHNESS ON QUARTZ GLASS SUBSTRATE
#195STATION-TO-STATION CONTROL OF BACKSIDE BOW COMPENSATION DEPOSITION
#196SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#197ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS
#198METHOD AND DEVICE FOR PROTECTING OXYGEN-SENSITIVE TARGET MATERIALS IN A COATING SOURCE
#199PLASMA PROCESSING METHOD
#200PLASMA MULTI-WAFER ASHING SYSTEM
#201SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
#202METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS
#203SUBSTRATE TREATMENT SYSTEM
#204SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#205SUBSTRATE PROCESSING APPARATUS
#206SUBSTRATE TREATING APPARATUS AND METHOD
#207SHOWERHEAD ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#208SUBSTRATE PROCESSING APPARATUS
#209SUBSTRATE TREATING APPARATUS AND METHOD
#210SHOWERHEAD AND SUBSTRATE TREATMENT APPARATUS INCLUDING SHOWERHEAD
#211DEVICE AND METHOD OF CONTROLLING PLASMA CHARACTERISTIC, AND SYSTEM FOR TREATING SUBSTRATE
#212MASS FLOW CONTROLLER, FLOW CONTROL METHOD USING THE SAME, AND SUBSTRATE PROCESSING METHOD INCLUDING THE SAME
#213ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#214ETCH SELECTIVITY CONTROL IN ATOMIC LAYER ETCHING
#215SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#216ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE
#217FAST ATOMIC LAYER ETCH
#218PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#219PLASMA INJECTION CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATED APPARATUS, CHAMBER KITS, AND METHODS
#220METHODS FOR REDUCING PHOTORESIST AND CARBON ETCH RATES IN AN ICP PROCESS CHAMBER USING A SILICON-BASED CHAMBER PRE-COAT
#221SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#222SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#223PLASMA ABATEMENT TECHNOLOGY UTILIZING WATER VAPOR AND OXYGEN REAGENT
#224METHODS AND SYSTEMS FOR DEPOSITING A LAYER
#225SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#226PROCESS GAS PROVIDING APPARATUS AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
#227SHOWERHEAD UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
#228UNIFORM GAPFILL DEPOSITION ON SEMICONDUCTOR SUBSTRATES WITH VARYING GEOMETRIES
#229BORON NITRIDE FILM FORMING METHOD AND FILM FORMING APPARATUS
#230METAL OXIDE DIRECTIONAL REMOVAL
#231ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME
#232POWER-EFFICIENT MICROWAVE PLASMA JET BASED ON EVANESCENT-MODE CAVITY TECHNOLOGY
#233SHOWERHEAD FOR SUBSTRATE PROCESSING SYSTEMS
#234CONDITIONING OF A PROCESSING CHAMBER
#235METHOD OF FORMING SILICON NITRIDE FILM AND FILM FORMING APPARATUS
#236SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
#237UNIFORMITY CONTROL FOR PLASMA PROCESSING
#238GAS CURTAIN FOR SEMICONDUCTOR MANUFACUTRING SYSTEM
#239PLASMA ABATEMENT TECHNOLOGY UTILIZING WATER VAPOR AND OXYGEN REAGENT
#240DRY-DEVELOPING RESIST FILM FORMED OF METAL-CONTAINING RESIST
#241SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#242SULFUR-CONTAINING MOLECULES FOR HIGH ASPECT RATIO PLASMA ETCHING PROCESSES
#243DUAL PLENUM SHOWERHEAD WITH CENTER TO EDGE TUNABILITY
#244Oxidation-Reduction Adjustable Plasma
#245SILICON NITRIDE FILM FORMATION METHOD AND PLASMA PROCESSING APPARATUS
#246HIGH PRESSURE INERT OXIDATION AND IN-SITU ANNEALING PROCESS TO IMPROVE FILM SEAM QUALITY AND WER
#247SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#248ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#249SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#250METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTIVE PASSIVATION
#251SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF CONTROLLING PHYSICAL QUANTITY OF SEMICONDUCTOR MANUFACTURING APPARATUS
#252SCRUBBER, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
#253PLASMA PROCESSING SYSTEM, ASSISTANCE DEVICE, ASSISTANCE METHOD, AND ASSISTANCE PROGRAM
#254PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#255PLASMA GENERATION CIRCUIT AND SUBSTRATE PROCESSING DEVICE INCLUDING THE SAME
#256FILM FORMATION APPARATUS AND FILM FORMATION METHOD OF GALLIUM NITRIDE FILM
#257CHAMBER AND METHODS FOR DOWNSTREAM RESIDUE MANAGEMENT
#258SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#259SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE SUPPORT UNIT
#260IN-SITU BACK SIDE PLASMA TREATMENT FOR RESIDUE REMOVAL FROM SUBSTRATES
#261PLASMA PROCESSING APPARATUS AND COMMUNICATION SYSTEM FOR CONTROL OF PLASMA PROCESSING APPARATUS
#262PLASMA PROCESS CONTROL USING FLUORINE RADICAL CONCENTRATIONS
#263ELECTRODE-DIELECTRIC NOZZLE FOR PLASMA PROCESSING
#264Method and System for Plasma Process
#265SPUTTERING OF HIGH-QUALITY SUPERCONDUCTING THIN FILMS
#266FINFET Device and Method of Forming Same
#267ETCH TOOL WITH SPINEL-BASED COMPOSITE MATERIAL COMPONENTS
#268METHODS TO IMPROVE OXIDE SIDEWALL QUALITY
#269PLASMA SOURCE AND APPARATUS FOR ATOMIC LAYER DEPOSITION
#270PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM
#271PLASMA ETCHING METHOD AND METHOD OF MANUFACTURING DISPLAY APPARATUS
#272HARD MASK LAYER AND FORMATION METHOD THEREOF
#273PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
#274MICROWAVE HIGH-DENSITY PLASMA FOR SELECTIVE ETCH
#275ETCHING PROCESSING METHOD AND ETCHING PROCESSING APPARATUS
#276METHOD OF FORMING CARBON-CONTAINING FILM
#277PLASMA PROCESSING METHOD
#278UNDERCOATING COVERAGE AND RESISTANCE CONTROL FOR ESCS OF SUBSTRATE PROCESSING SYSTEMS
#279Die Bonding Apparatus, Mounting Method, and Method for Manufacturing Semiconductor Device
#280ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#281ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#282MULTI-STAGE PUMPING LINER
#283SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK
#284RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#285HIGH SELECTIVITY AND UNIFORM DIELECTRIC ETCH
#286SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
#287METHOD FOR SURFACE COATING ACCORDING TO THE SPUTTERING PRINCIPLE
#288SYSTEM OF DETERMINING LEAKAGE OF SEMICONDUCTOR MANUFACTURING TOOL AND USAGE METHOD THEREOF
#289REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL
#290Plasma Etched Compound Semiconductor
#291SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#292PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS
#293DIELECTRIC PLASMA ETCHING USING C2H2F2
#294PLASMA GENERATOR AND METHOD OF USING SAME
#295SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#296MULTIPLE-CHAMBER REACTOR FOR SELECTIVE DEPOSITION OF SILICON NITRIDE AND METHOD OF USING SAME
#297SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL
#298Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid Thermal Activation Process
#299REMOTE PLASMA CLEAN (RPC) DELIVERY INLET ADAPTER
#300SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING METAL OXIDE SEMICONDUCTOR