205334 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes; Constructional details of the reactor; Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings Means for preventing sputtering of the vessel
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2COATINGS ON INNER SURFACES OF PARTICLE CONTAINMENT CHAMBERS
#3Apparatus for preventing contamination of self-plasma chamber
#4METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER
#5Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
#6SEMICONDUCTOR MANUFACTURING APPARATUS AND COMPONENT FOR SEMICONDUCTOR MANUFACTURING APPARATUS
#7Gas injection process kit to eliminate arcing and improve uniform gas distribution for a PVD process
#8Treatment for high-temperature cleans
#9Methods of reducing particles in a physical vapor deposition (PVD) chamber
#10Substrate processing method
#11Gas injection process kit to eliminate arcing and improve uniform gas distribution for a PVD process
#12EROSION RESISTANT METAL FLUORIDE COATINGS, METHODS OF PREPARATION AND METHODS OF USE THEREOF
#13Film formation apparatus
#14REACTOR, SYSTEM INCLUDING THE REACTOR, AND METHODS OF MANUFACTURING AND USING SAME
#15Composite structure and semiconductor manufacturing apparatus including composite structure
#16Methods and apparatus for reducing defects in preclean chambers
#17Vacuum processing apparatus
#18Plasma processing apparatus
#19Cleaning method
#20Components and Processes for Managing Plasma Process Byproduct Materials
#21Dual RF for controllable film deposition
#22Texturizing a surface without bead blasting
#23Coating for chamber particle reduction
#24Substrate processing system including coil with RF powered faraday shield
#25Substrate processing apparatus and method of manufacturing semiconductor device
#26System and method for extending a lifetime of an ion source for molecular carbon implants
#27Methods and apparatus for reducing sputtering of a grounded shield in a process chamber
#28Apparatus for preventing contamination of self-plasma chamber
#29FILM FORMING DEVICE AND METHOD OF FORMING PIEZOELECTRIC FILM
#30Texturizing a surface without bead blasting
#31Reactor, system including the reactor, and methods of manufacturing and using same
#32FOCUS RING, PLASMA APPARATUS AND VOLTAGE-ADJUSTING METHOD USING THE SAME
#33Method and apparatus for surface preparation prior to epitaxial deposition
#34MINIMIZATION OF RING EROSION DURING PLASMA PROCESSES
#35Texturizing a surface without bead blasting
#36TEXTURIZING A SURFACE WITHOUT BEAD BLAST
#37METHOD TO DEPOSIT ALUMINUM OXY-FLUORIDE LAYER FOR FAST RECOVERY OF ETCH AMOUNT IN ETCH CHAMBER
#38Minimization of ring erosion during plasma processes
#39Plasma processing method
#40One-piece process kit shield
#41Apparatus for high compressive stress film deposition to improve kit life
#42Plasma processing apparatus
#43Internal split Faraday shield for a plasma source
#44Electron beam plasma source with remote radical source
#45Methods and apparatus for reducing sputtering of a grounded shield in a process chamber
#46Plasma source pumping and gas injection baffle
#47Semiconductor processing apparatus comprising a solid solution ceramic formed from yttrium oxide, zirconium oxide, and aluminum oxide
#48Variable capacitance chamber component incorporating ferroelectric materials and methods of manufacturing and using thereof
#49Internal Split Faraday Shield for an Inductively Coupled Plasma Source
#50Sputtering apparatus and method of manufacturing electronic device
#51Plasma processing apparatus and plasma processing method
#52Semiconductor processing apparatus comprising a coating formed from a solid solution of yttrium oxide and zirconium oxide
#53Substantially Non-Oxidizing Plasma Treatment Devices and Processes
#54Substrate support having fluid channel
#55Semiconductor processing apparatus which is formed from yttrium oxide and zirconium oxide to produce a solid solution ceramic apparatus
#56Plasma Processing Apparatus And Plasma Processing Method
#57PROCESS KIT SHIELDS AND METHODS OF USE THEREOF
#58Plasma Processing Apparatus And Plasma Processing Method
#59PLASMA PROCESSING APPARATUS
#60Method of reducing the erosion rate of semiconductor processing apparatus exposed to halogen-containing plasmas
#61MOVING INTERLEAVED SPUTTER CHAMBER SHIELDS
#62Plasma etching apparatus and method for forming inner wall of plasma processing chamber
#63Plasma processing apparatus
#64Plasma processing apparatus and plasma processing method
#65Erosion resistant textured chamber surface
#66Plasma etching apparatus and plasma etching method
#67Plasma processing apparatus
#68Plasma processing method