205357 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes; Constructional details of the reactor Workpiece holder
Sub-classes:WAFER PLACEMENT TABLE
#2ELECTROSTATIC CHUCK, SUBSTRATE FIXING DEVICE, AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK
#3PLASMA PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#4SUBSTRATE PROCESSING APPARATUS
#5ETCHING METHOD AND PLASMA PROCESSING SYSTEM
#6PASSIVE LIFT PIN ASSEMBLY
#7SUBSTRATE TREATING APPARATUS
#8FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
#9DRY ETCHING DEVICE AND METHOD
#10PLASMA PROCESSING APPARATUS
#11STAGE
#12PLASMA VACUUM CHAMBER
#13METHOD AND APPARATUS TO REDUCE FEATURE CHARGING IN PLASMA PROCESSING CHAMBER
#14BATCH PROCESSING CHAMBERS FOR PLASMA-ENHANCED DEPOSITION
#15SUBSTRATE SUPPORT ASSEMBLY WITH MULTIPLE DISCS
#16WAFER BOAT DEVICE AND PLASMA DISSOCIATION FURNACE TUBE SYSTEM
#17METHOD OF PLASMA ETCHING
#18PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#19SEMICONDUCTOR MANUFACTURING EQUIPMENT
#20SYSTEM AND METHOD FOR SEMICONDUCTOR STRUCTURE
#21SEMICONDUCTOR PROCESSING EQUIPMENT
#22SUBSTRATE PROCESSING APPARATUS
#23DC BIAS IN PLASMA PROCESS
#24MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
#25SUBSTRATE SUPPORT, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR SUPPLYING ELECTRIC POWER
#26MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
#27SELF-COMPLIANT SEAL ASSEMBLY
#28PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#29SUBSTRATE PROCESSING APPARATUS, PLASMA GENERATING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#30PLASMA PROCESSING APPARATUS AND POTENTIAL CONTROL METHOD
#31PLASMA PROCESSING DEVICE INCLUDING BAFFLE FOR PLASMA CONFINING
#32EDGE RINGS WITH INSTEPS AND OVERSIZED HOLES FOR PREVENTING LIFT PIN CONTACT THEREWITH IN SUBSTRATE PROCESSING SYSTEMS
#33EDGE EXCLUSION CONTROL
#34CHUCKING STATUS DETECTION WITH CHUCKING SENSOR NORMALIZED FIGURE OF MERIT AND ACTIVE CHUCKING VOLTAGE CONTROL
#35POWER SUPPLY ASSEMBLY FOR GENERATING A PLASMA, AND PLASMA PROCESS SYSTEM
#36METHOD OF MOUNTING WIRES TO SUBSTRATE SUPPORT CERAMIC
#37CHUCKING OF HIGH-WARP SUBSTRATES USING MULTIZONAL CHUCKS
#38PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT
#39PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#40UNIFORM PIXELATED MICROWAVE PLASMA SOURCE WITH SUBSTRATE ROTATION
#41WAFER MANUFACTURING APPARATUS
#42ELECTROSTATIC PLATEN CLEANING DETECTION SYSTEM AND METHOD
#43EFFICIENT DECHUCKING AND PARTICLE MANAGEMENT IN PROCESS CHAMBERS
#44VERTICALLY MOUNTED PROCESSING SYSTEM
#45PLASMA PROCESSING SYSTEM WITH CONTINUOUS BIAS POWER AND SOURCE POWER
#46SEMICONDUCTOR WAFER PROCESSING APPARATUS
#47SYSTEMS AND METHODS FOR BEVEL DEPOSITION
#48ELECTROSTATIC CHUCK AND METHOD OF OPERATION FOR PLASMA PROCESSING
#49SYSTEMS AND METHODS FOR CONTROLLING A VOLTAGE WAVEFORM AT A SUBSTRATE DURING PLASMA PROCESSING
#50BALANCING PROCESS KIT AREA TO WAFER AREA WITHIN A PROCESSING CHAMBER
#51SUBSTRATE PROCESSING EQUIPMENT
#52ELECTROSTATIC CHUCK MEMBER, ELECTROSTATIC CHUCK DEVICE, AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK MEMBER
#53PLASMA PROCESSING APPARATUS
#54Processing Apparatus and Shower Structure
#55SUBSTRATE PROCESSING APPARATUS AND MAINTENANCE METHOD FOR SUBSTRATE PROCESSING APPARATUS
#56HOLDING DEVICE
#57SUBSTRATE SUPPORT STAGE AND SUBSTRATE PROCESSING APPARATUS
#58SUBSTRATE PROCESSING APPARATUS
#59Atmospheric Plasma Activation for Hybrid Bonding
#60SUBSTRATE PROCESSING APPARATUS
#61PROCESS TO DEPOSIT QUANTIZED NANO LAYERS BY MAGNETRON SPUTTERING
#62SELECTIVE DEPOSITION ON AN EXISTING PATTERNED MASK
#63PLASMA PROCESSING SYSTEM AND METHOD FOR ESTIMATING HEIGHT OF ANNULAR MEMBER
#64MULTI-STAGE DYNAMIC VACUUM FEEDTHROUGH
#65SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#66WAFER CARRYING APPARATUS AND SEMICONDUCTOR PROCESS DEVICE
#67SUBSTRATE SUPPORT
#68ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME
#69ELECTROSTATIC CHUCK
#70APPARATUS FOR PROCESSING SUBSTRATE
#71PLASMA PROCESSING APPARATUS, SUBSTRATE SUPPORT, AND METHOD FOR CORRECTING WEAR OF EDGE RING
#72GAS FLOW ACCELERATOR TO PREVENT BUILDUP OF PROCESSING BYPRODUCT IN A MAIN PUMPING LINE OF A SEMICONDUCTOR PROCESSING TOOL
#73PLASMA ETCH SYSTEM INCLUDING TUNABLE PLASMA SHEATH
#74WALL MEMBER AND PLASMA PROCESSING APPARATUS
#75GROUND RETURN PATH FOR WAFER PROCESS CHAMBER
#76ELECTROSTATIC CHUCK
#77CHUCKING SYSTEM WITH SILANE COUPLING AGENT
#78SUBSTRATE PROCESSING DEVICE INCLUDING VARIABLE IMPEDANCE ELEMENT
#79PLASMA PROCESSING APPARATUS AND METHOD
#80PLASMA PROCESSING APPARATUS
#81PLASMA PROCESSING DEVICE
#82Device for Performing Plasma Treatment, and Method for Performing Plasma Treatment
#83PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#84SEMICONDUCTOR PROCESS DEVICE AND PROCESS CHAMBER THEREOF
#85SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#86IMPEDANCE CONTROL OF LOCAL AREAS OF A SUBSTRATE DURING PLASMA DEPOSITION THEREON IN A LARGE PECVD CHAMBER
#87BATCH PROCESSING CHAMBER WITH WAFER BACKSIDE DEPOSITION PREVENTION
#88PLASMA PROCESSING METHODS USING LOW FREQUENCY BIAS PULSES
#89SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING SYSTEM
#90PROCESSING CHAMBER AND METHOD FOR INTEGRATED ETCHING AND DEPOSITION
#91SUBSTRATE PROCESSING APPARATUS, GAS SUPPLY STRUCTURE, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
#92ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
#93SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK
#94APPARATUS FOR PLASMA SURFACE TREATMENT
#95ELECTROSTATIC CHUCK MEMBER, ELECTROSTATIC CHUCK DEVICE, AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK MEMBER
#96MOUNTING BASE, SUBSTRATE PROCESSING DEVICE, EDGE RING, AND EDGE RING TRANSFER METHOD
#97ELECTRICAL FEEDTHROUGH CONNECTOR FOR A SUBSTRATE SUPPORT ASSEMBLY
#98SUPPORT MEMBER, SUBSTRATE SUPPORT, AND PLASMA PROCESSING APPARATUS
#99SUBSTRATE FIXING DEVICE
#100ELECTROSTATIC CHUCK WITH PERFORATED OR SCREENED CHUCKING ELECTRODE
#101BIPOLAR ESC TO PREVENT SUBSTRATE BACKSIDE DISCHARGING
#102PLASMA PROCESSING APPARATUS AND SUBSTRATE ATTRACTION METHOD
#103PLASMA PROCESSING APPARATUS AND CONTROL METHOD
#104SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
#105ELECTROSTATIC EDGE RING MOUNTING SYSTEM FOR SUBSTRATE PROCESSING
#106APPARATUS FOR PROCESSING A SUBSTRATE
#107ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR
#108MULTI-MODAL ELECTROSTATIC CHUCKING
#109ARC REDUCTION USING UNREFERENCED FLOATING POWER SUPPLIES
#110SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#111PLASMA ETCHING APPARATUS, PLASMA ETCHING METHOD USING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
#112LEVELING SYSTEMS AND METHODS
#113GROUNDING PLATE FOR STRESS TUNING HIGH DENSITY AND MODULUS FILMS
#114PLASMA PROCESSING SYSTEM CONFIGURED TO DELIVER A PULSED VOLTAGE WAVEFORM
#115PLASMA PROCESSING SYSTEM CONFIGURED TO DELIVER A PULSED VOLTAGE WAVFORM
#116REMOTE PLASMA ULTRAVIOLET ENHANCED DEPOSITION
#117SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#118ELECTROSTATIC CHUCK
#119Low Cost Electrostatic Chuck for Chucking Insulator Substrates
#120External Cooling Assembly for Substrate Support
#121PLASMA PROCESSING APPARATUS
#122PLASMA PROCESSING APPARATUS
#123ARC CURRENT REDUCTION FROM AN ELECTROSTATIC CHUCK
#124SUSCEPTOR
#125PLASMA PROCESSING APPARATUS
#126APPARATUS FOR ACCOMMODATING AN ARTICLE IN A VACUUM-COATING INSTALLATION
#127SUBSTRATE FIXING DEVICE
#128ELECRO-STATIC CHUCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#129BATCH-TYPE APPARATUS FOR ATOMIC LAYER ETCHING (ALE), AND ALE METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD BASED ON THE SAME APPARATUS
#130EMBEDDED ELECTROSTATIC CHUCK (ESC)
#131PLASMA PROCESSING APPARATUS
#132SUBSTRATE PROCESSING APPARATUS INCLUDING EDGE BIAS SUPPLY PORTION
#133PLASMA PROCESSING DEVICE
#134SUBSTRATE EDGE PROFILE TREATMENT
#135ELECTROSTATIC WAFER CLAMPING AND SENSING SYSTEM
#136DISTORTION OF PULSES FOR WAFER BIASING
#137PLASMA PROCESSING APPARATUS
#138PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD USING SAME
#139SUBSTRATE PROCESSING APPARATUS INCLUDING SHOWER HEAD AND EDGE RING AND RELATED METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#140PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#141ELECTROSTATIC CHUCK
#142PLASMA PROCESSING APPARATUS
#143ION BEAM PROCESSING SYSTEM
#144RF FILTER TOPOLOGY FOR SUBSTRATE SUPPORT ASSEMBLY
#145PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF
#146ELECTROSTATIC CHUCK
#147SUBSTRATE PROCESSING SYSTEM
#148FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
#149DEPOSITION TOOL WITH DIELECTRIC COATED CHAMBER SIDEWALLS TO IMPROVE ELECTROMANGNETIC FIELD UNIFORMITY
#150SUBSTRATE PROCESSING APPARATUS
#151ELECTROSTATIC CHUCK
#152EFFICIENT DECHUCKING AND PARTICLE MANAGEMENT IN PROCESS CHAMBERS
#153PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR DEVICE USING THE SAME
#154SUBSTRATE PROCESSING APPARATUS FOR ETCHING A SUBSTRATE BY USING PLASMA
#155SAMPLE HOLDER
#156SAMPLE HOLDER
#157AIR-CORE COIL IN ANALOG CIRCUIT FILTERS FOR PLASMA PROCESSING
#158APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
#159SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND MANUFACTURING APPARATUS
#160GAS SPRAYING APPARATUS AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
#161DEVICE AND METHOD OF CONTROLLING PLASMA CHARACTERISTIC, AND SYSTEM FOR TREATING SUBSTRATE
#162MEMBER FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
#163PLASMA PROCESSING APPARATUS
#164PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
#165ELECTROSTATIC CHUCK AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK
#166WAFER PLACEMENT TABLE
#167CERAMIC SUSCEPTOR
#168SUBSTRATE PROCESSING APPARATUS
#169PLASMA INJECTION CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATED APPARATUS, CHAMBER KITS, AND METHODS
#170PLASMA PROCESSING APPARATUS AND CONTROL METHOD
#171SUBSTRATE SUPPORTING PLATE, THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME, AND THIN FILM DEPOSITION METHOD
#172SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#173COMPONENT TO BE USED FOR PLASMA PROCESSING DEVICE, METHOD FOR MANUFACTURING COMPONENT TO BE USED FOR PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING DEVICE
#174PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#175HEATING DEVICE AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
#176SUBSTRATE SUPPORT ASSEMBLY, PLASMA CONTROL METHOD, AND PLASMA PROCESSING APPARATUS
#177IMPEDANCE MEASUREMENT METHOD OF SUBSTRATE PROCESSING APPARATUS
#178SUBSTRATE PROCESSING APPARATUS
#179INSTALLATION, METHOD, AND CARRIER FOR COATING EYEGLASS LENSES
#180SUBSTRATE TREATING APPARATUS AND MANUFACTURING METHOD THEREOF
#181SENSOR DEVICE FOR SEMICONDUCTOR EQUIPMENT, METHOD OF OPERATING A SENSOR DEVICE, AND SYSTEM INCLUDING A SENSOR DEVICE
#182HYBRID SEAL FOR SEMICONDUCTOR PROCESSING CHAMBERS
#183ELECTROSTATIC CHUCK AND SUBSTRATE PROCESSING APPARATUS
#184PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK
#185METHOD OF ADDITIVELY MANUFACTURING HIGH-PURITY SILICON, METHOD OF ADDITIVELY MANUFACTURING SEMICONDUCTOR MANUFACTURING EQUIPMENT COMPONENT, SEMICONDUCTOR MANUFACTURING EQUIPMENT COMPONENT, AND METHOD OF FORMING SEMICONDUCTOR MANUFACTURING EQUIPMENT COMPONENT
#186METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
#187LIFT PIN INTERFACE IN A SUBSTRATE SUPPORT
#188SUBSTRATE TREATING APPARATUS AND SUBSTRATE SUPPORT UNIT
#189SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#190SURFACE CHARGE AND POWER FEEDBACK AND CONTROL USING A SWITCH MODE BIAS SYSTEM
#191ELECTROSTATIC CHUCK AND SUBSTRATE PROCESSING APPARATUS
#192CERAMIC SUBSTRATE, ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
#193ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
#194ELECTROSTATIC CHUCK, METHOD OF MANUFACTURING ELECTROSTATIC CHUCK, AND PLASMA PROCESSING APPARATUS
#195SYSTEMS AND METHODS FOR REDUCING IRREGULARITIES WITHIN A PLASMA-BASED PROCESSING CHAMBER
#196RATING SUBSTRATE SUPPORT ASSEMBLIES BASED ON IMPEDANCE CIRCUIT ELECTRON FLOW
#197Bowed Substrate Clamping Method, Apparatus, and System
#198PLASMA PROCESSING APPARATUS INCLUDING GAS DISTRIBUTION PLATE
#199PLASMA PROCESSING APPARATUS
#200PLASMA PROCESSING APPARATUS
#201SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE SUPPORT UNIT
#202IN-SITU BACK SIDE PLASMA TREATMENT FOR RESIDUE REMOVAL FROM SUBSTRATES
#203PLASMA PROCESSING APPARATUS
#204SUBSTRATE SUPPORT DESIGNS FOR A DEPOSITION CHAMBER
#205MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
#206SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
#207GAS SUPPLY ASSEMBLY AND SEMICONDUCTOR WAFER PROCESSING APPARATUS USING THE SAME
#208SUBSTRATE PROCESSING APPARATUS INCLUDING LIGHT RECEIVING DEVICE AND CALIBRATION METHOD OF LIGHT RECEIVING DEVICE
#209PROCESSING CHAMBER DEPOSITION CONFINEMENT
#210CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE
#211HOLDING DEVICE
#212MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
#213TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM
#214APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT
#215PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
#216METHOD TO IMPROVE WAFER EDGE UNIFORMITY
#217ARC REDUCTION AND RF CONTROL FOR ELECTROSTATIC CHUCKS IN SEMICONDUCTOR PROCESSING
#218COMPACT DYNAMIC LEVELING LIFT MECHANISM
#219JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES
#220PLASMA PROCESSING APPARATUS
#221APPARATUS FOR TESTING RING ASSEMBLY OF SUBSTRATE PROCESSING APPARATUS
#222SUBSTRATE PROCESSING SYSTEM
#223SUBSTRATE PROCESSING APPARATUS AND A SUBSTRATE PROCESSING METHOD USING THE SAME
#224Microwave Capillary Nanodiamond Reactor
#225SUBSTRATE SUPPORT ASSEMBLY WITH MULTIPLE DISCS
#226SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
#227PLASMA SOURCE WITH MULTIPLE EXTRACTION APERTURES
#228DEPOSITION SYSTEM AND METHOD
#229LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELECTROSTATIC CHUCK WITH MULTIPLEXED HEATERS ARRAY
#230SIMULTANEOUS ETCHING OF MULTI-FACETED SUBSTRATES
#231SHALLOW ETCHING PROCESS CHAMBER
#232PROCESSING APPARATUS AND PROCESSING METHOD
#233Substrate processing system and method for installing edge ring
#234PASSIVE LIFT PIN ASSEMBLY
#235PLASMA PROCESSING METHOD
#236PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS
#237SURFACE TREATMENT APPARATUS
#238SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
#239MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
#240PLASMA PROCESSING APPARATUS
#241SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS
#242PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#243ELECTROSTATIC CHUCK WITH SEAL SURFACE
#244SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMPROVING SUBSTRATE STICKINESS PHENOMENON
#245HOLDING APPARATUS
#246SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
#247A WAFER CHUCK ASSEMBLY WITH THERMAL INSULATION FOR RF CONNECTIONS
#248SHOWERHEAD FACEPLATE CONFIGURATIONS
#249GAS MIXING METHOD TO ENHANCE PLASMA
#250PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#251SINTERED ALUMINA MATERIAL AND ELECTROSTATIC CHUCK
#252NEUTRAL STRESS DIAMOND-LIKE CARBON
#253SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
#254SUBSTRATE PROCESSING SYSTEM
#255A METHOD AND APPARATUS FOR ENHANCING ION ENERGY AND REDUCING ION ENERGY SPREAD IN AN INDUCTIVELY COUPLED PLASMA
#256METHOD AND APPARATUS FOR RADIO FREQUENCY GRID DESIGN IN AN ESC TO REDUCE FILM ASYMMETRY
#257SEMICONDUCTOR WAFER PROCESSING METHOD
#258APPARATUS AND METHOD FOR PLASMA PROCESSING
#259PROCESS STACK FOR CVD PLASMA TREATMENT
#260CHAMBER FOR SUBSTRATE BACKSIDE AND BEVEL DEPOSITION
#261PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
#262SUBSTRATE PROCESSING APPARATUS
#263ELECTROSTATIC CHUCK DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#264WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESSING SYSTEMS
#265BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE
#266ELECTROSTATIC CHUCK DEVICE
#267GASBOX FOR SEMICONDUCTOR PROCESSING CHAMBER
#268ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS
#269CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER
#270SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA
#271ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER
#272LAMINATE MANUFACTURING APPARATUS AND SELF-ASSEMBLED MONOLAYER FORMATION METHOD
#273DIAMOND FORMATION DEVICE AND DIAMOND-COATED SUBSTRATE
#274PLASMA DIAGNOSTIC APPARATUS, AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICES USING THE SAME
#275SURFACE PROCESSING EQUIPMENT
#276PLASMA PROCESSING APPARATUS
#277TREATMENT APPARATUS
#278WAFER EDGE RING LIFTING SOLUTION
#279SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE
#280ALUMINA CERAMIC MEMBER, METHOD FOR MANUFACTURING ALUMINA CERAMIC MEMBER, COMPONENT FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND SUBSTRATE PROCESSING APPARATUS
#281PLASMA TREATMENT APPARATUS
#282ACTIVE GAS GENERATION APPARATUS
#283ELECTROSTATIC SUBSTRATE SUPPORT
#284SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#285ROTATING SUBSTRATE SUPPORT
#286SUBSTRATE PROCESSING APPARATUS
#287COATING METHOD
#288APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
#289SUSCEPTOR MANUFACTURING METHOD AND SUSCEPTOR MANUFACTURED BY THE SAME
#290CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, ELECTROSTATIC CHUCK, SUBSTRATE FIXING DEVICE, AND SEMICONDUCTOR DEVICE PACKAGE
#291PLASMA PROCESSING APPARATUS AND METHOD
#292HOLDING DEVICE
#293SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
#294RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELECTROSTATIC CHUCK, AND PLASMA PROCESSING EQUIPMENT
#295WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
#296PLASMA PROCESSING APPARATUS AND METHOD
#297METHOD OF SURFACE TREATMENT
#298Wafer Bonding Apparatus and Method
#299METHOD OF SIMULTANEOUS SILICIDATION ON SOURCE AND DRAIN OF NMOS AND PMOS TRANSISTORS
#300ELECTROSTATIC DEVICE AND OPERATION METHOD THEREFOR