205386 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes; Plasma diagnostics; Monitoring and controlling tubes by information coming from the object and/or discharge Gas analysis
RF IMPEDANCE MATCHING WITH CONTINUOUS WAVE AND PULSING SOURCES
#2VI SENSOR AND METHOD FOR MONITORING OF PLASMA STATUS
#3CO-JET NOZZLE ASSEMBLY AND ANOMALY DETECTION
#4SYSTEM AND METHOD FOR ADAPTIVE CLEANING OF A HIGH-VACUUM CHAMBER
#5APPARATUS TO DETECT AND QUANTIFY RADICAL CONCENTRATION IN SEMICONDUCTOR PROCESSING SYSTEMS
#6MEASUREMENT SENSOR AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#7System and Method for Rapidly Establishing Steady State Vacuum Chamber Pressures
#8SYSTEM AND METHOD FOR PLASMA TREATMENT WITH INDEPENDENT CONTROL OF NEUTRAL PARTICLE AND ION FLUXES
#9RECIRCULATION CONTROL FOR A PLASMA PROCESS USING A BYPRODUCT CONCENTRATION
#10SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
#11HIGH-PERFORMANCE ADAPTABLE SAMPLING SYSTEM
#12SENSING SENSOR MODULE AND SENSOR MODULE HEAT DISSIPATION STRUCTURE
#13SYSTEM AND METHOD FOR SEMICONDUCTOR PROCESSING
#14APPARATUS FOR FABRICATING DISPLAY PANEL
#15PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD
#16Plasma Treatment Device and Plasma Treatment Method
#17SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#18CORROSION-RESISTANT ACOUSTIC RESONANCE SENSOR DEVICES FOR RADICAL SPECIES DETECTION
#19SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
#20IN-SITU PARTICLE DETECTION
#21PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
#22GAS ANALYSIS DEVICE AND CONTROL METHOD
#23SUBSTRATE PROCESSING METHOD
#24LOW OPEN AREA AND COUPON ENDPOINT DETECTION
#25LOW OPEN AREA AND COUPON ENDPOINT DETECTION
#26SENSOR DEVICE AND SEMICONDUCTOR PROCESSING APPARATUS USING THE SAME
#27PLASMA PROCESSING APPARATUS, CONTROL METHOD, AND STORING MEDIUM
#28SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD
#29Non-Intrusive Method for 2D/3D Mapping Plasma Parameters
#30PLASMA MONITORING DEVICE
#31GAS ANALYZER APPARATUS
#32PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
#33IMAGE ANALYSIS OF PLASMA CONDITIONS
#34METHOD AND APPARATUS FOR UNIFORM HIGH THROUGHPUT MULTIPLE LAYER FILMS
#35DEVICE AND METHOD FOR PLASMA GENERATION IN A WIDE PRESSURE RANGE AND SYSTEM AND METHOD FOR OPTICAL GAS ANALYSIS/DETECTION BY MEANS OF SUCH A DEVICE
#36PASSIVATION EQUIPMENT AND PASSIVATION METHOD FOR SEMICONDUCTOR DEVICE
#37DYNAMIC PRESSURE CONTROL FOR PROCESSING CHAMBERS IMPLEMENTING REAL-TIME LEARNING
#38RF IMPEDANCE MATCHING WITH CONTINUOUS WAVE AND PULSING SOURCES
#39SURFACE MODIFYING METHOD AND SURFACE MODIFYING APPARATUS
#40Measurement Apparatus for Alternating Currents and Voltages of Physical Plasmas, Particularly of Cold Plasmas at Atmospheric Pressure, and Plasma Generator Comprising Such a Measurement Apparatus
#41ANALYSIS DEVICE, ANALYSIS METHOD, AND ANALYSIS PROGRAM
#42CHARGED-PARTICLE INSPECTION APPARATUS
#43CO-DOPING TO CONTROL WET ETCH RATE OF FCVD OXIDE LAYERS
#44METHOD AND SYSTEM FOR ADJUSTING LOCATION OF A WAFER AND A TOP PLATE IN A THIN-FILM DEPOSITION PROCESS
#45SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
#46System and method for residual gas analysis
#47SENSOR FOR MEASUREMENT OF RADICALS
#48NON-INVASIVE MEASUREMENT OF PLASMA SYSTEMS
#49Method of detecting radicals using mass spectrometry
#50Gas analyzer apparatus
#51Method and system for adjusting location of a wafer and a top plate in a thin-film deposition process
#52Plasma processing method and plasma processing apparatus
#53DISCHARGE DETECTION APPARATUS AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS
#54APPARATUS TO DETECT AND QUANTIFY RADICAL CONCENTRATION IN SEMICONDUCTOR PROCESSING SYSTEMS
#55IN-SITU DRY CLEAN OF TUBE FURNACE
#56Methods and apparatus for passivating a target
#57Plasma processing apparatus and monitoring device
#58Quantification of processing chamber species by electron energy sweep
#59Gas analyzer apparatus
#60System and method for residual gas analysis
#61Device and method for plasma treatment of containers
#62Low open area and coupon endpoint detection
#63Methods and apparatus for passivating a target
#64Glow plasma gas measurement signal processing
#65SUBSTRATE PROCESSING METHOD, GAS FLOW EVALUATION SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
#66Inline measurement of process gas dissociation using infrared absorption
#67Substrate processing apparatus, substrate processing module, and semiconductor device fabrication method
#68APPARATUS WITH OPTICAL CAVITY FOR DETERMINING PROCESS RATE
#69Atmospheric-pressure ionization and fragmentation of molecules for structural elucidation
#70Dynamic pressure control for processing chambers implementing real-time learning
#71Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy
#72Plasma parameters and skew characterization by high speed imaging
#73GLOW PLASMA STABILIZATION
#74Thermal repeatability and in-situ showerhead temperature monitoring
#75Substrate processing apparatus, substrate processing module, and semiconductor device fabrication method
#76In-situ real-time plasma chamber condition monitoring
#77Image based plasma sheath profile detection on plasma processing tools
#78Active showerhead
#79Apparatus with optical cavity for determining process rate
#80Method for etching organic region
#81Contaminant cleaning systems and related methods using one or more reactive substances, reaction byproduct measurements, and differential pressure or vacuum transfer of the reactive substances and reaction byproducts
#82IN-SITU DRY CLEAN OF TUBE FURNACE
#83Measuring device, measurement method, and plasma processing device
#84Processing apparatus for target object and inspection method for processing apparatus
#85Plasma parameters and skew characterization by high speed imaging
#86Substrate processing method and substrate processing apparatus
#87Virtual sensor for chamber cleaning endpoint
#88Methods and systems for chamber matching and monitoring
#89Methods and systems for chamber matching and monitoring
#90Thermal repeatability and in-situ showerhead temperature monitoring
#91METHOD FOR CONTROLLING A GAS SUPPLY TO A PROCESS CHAMBER, CONTROLLER FOR CONTROLLING A GAS SUPPLY TO A PROCESS CHAMBER, AND APPARATUS
#92Active showerhead
#93SMART IN SITU CHAMBER CLEAN
#94Method and apparatus for determining process rate
#95CONTROLLING DRY ETCH PROCESS CHARACTERISTICS USING WAFERLESS DRY CLEAN OPTICAL EMISSION SPECTROSCOPY
#96Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy
#97Impedance-based adjustment of power and frequency
#98PARTICLE CONCENTRATION MECHANISM, PARTICLE MEASURING DEVICE, AND SUBSTRATE PROCESSING APPARATUS INCLUDING PARTICLE MEASURING DEVICE
#99Plasma etching systems and methods using empirical mode decomposition
#100Contaminant cleaning systems and related methods using one or more reactive substances, reaction byproduct measurements, and differential pressure or vacuum transfer of the reactive substances and reaction byproducts
#101Plasma etching systems and methods using empirical mode decomposition
#102Method for producing micro plasma with biocompatibility
#103Method for controlling a gas supply to a process chamber, controller for controlling a gas supply to a process chamber, and apparatus
#104PLASMA PROCESSING APPARATUS
#105Method and device for producing nanotips
#106Impedance-based adjustment of power and frequency
#107Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and cleaning completion determining method
#108Method for producing micro plasma with biocompatibility
#109Apparatus for monitoring gas and plasma process equipment including the same
#110DEPOSITION SYSTEM
#111Plasma processing method and apparatus
#112Self-cleaning radio frequency plasma source
#113Soft pulsing
#114System and method of monitoring and controlling atomic layer deposition of tungsten
#115Impedance-based adjustment of power and frequency
#116PRESSURE CONTROL IN CONTINUOUS PLASMA DEPOSITION PROCESSES
#117SYSTEM, METHOD AND APPARATUS FOR REAL TIME CONTROL OF RAPID ALTERNATING PROCESSES (RAP)
#118Equipment for manufacturing semiconductor device and seasoning process method of the same
#119PLASMA PROCESSING APPARATUS AND FOREIGN PARTICLE DETECTING METHOD THEREFOR
#120Plasma processing method and apparatus
#121Apparatus for chemically etching a workpiece
#122Apparatus and process for sensing fluoro species in semiconductor processing systems
#123Plasma processing method and apparatus
#124System and method for anisotropically etching a recess in a silicon substrate
#125Apparatus and process for sensing fluoro species in semiconductor processing systems
#126Apparatus and process for sensing fluoro species in semiconductor processing systems
#127Apparatus and process for sensing fluoro species in semiconductor processing systems
#128Detecting partial unclamping of a substrate from an ESC of a substrate processing system