205389 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Sub-classes:PHYSICAL VAPOR DEPOSITION APPARATUS
#2Multiple Plasma Ion Source for Inline Secondary Ion Mass Spectrometry
#3METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS
#4ELECTRON-BEAM-ASSISTED SPUTTERING DEVICE AND METHOD THEREFOR
#5SPUTTERING APPARATUS
#6MULTIPLE PLASMA ION SOURCE FOR INLINE SECONDARY ION MASS SPECTROMETRY
#7Methods and apparatus for controlling ion fraction in physical vapor deposition processes
#8PLASMA DISCHARGE UNIFORMITY CONTROL USING MAGNETIC FIELDS
#9PHYSICAL VAPOR DEPOSITION APPARATUS
#10Cathode arc source, filters thereof and method of filtering macroparticles
#11Physical vapor deposition process apparatus and method of optimizing thickness of a target material film deposited using the same
#12METHOD AND APPARATUS FOR SPUTTER DEPOSITION
#13MAGNETRON PLASMA APPARATUS
#14Methods and apparatus for controlling ion fraction in physical vapor deposition processes
#15Cathodic arc evaporation with predetermined cathode material removal
#16Sputtering system and method
#17FILM FORMING METHOD AND FILM FORMING APPARATUS
#18Film forming apparatus and film forming method
#19METHODS AND APPARATUS FOR PHYSICAL VAPOR DEPOSITION
#20Arc evaporation source
#21SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING
#22Reactors for plasma-assisted processes and associated methods
#23Sputtering apparatus and sputtering method
#24MAGNETRON PLASMA APPARATUS
#25Ionized physical vapor deposition (IPVD) apparatus and method for an inductively coupled plasma sweeping source
#26Surrounding field sputtering source
#27Physical vapor deposition system and physical vapor depositing method using the same
#28Apparatus for direct-write sputter deposition and method therefor
#29Production method for transparent conductive film
#30FACING TARGET SPUTTERING APPARATUS
#31Electronic component manufacturing method and electrode structure
#32Self-ionized and inductively-coupled plasma for sputtering and resputtering
#33Magnetron plasma apparatus
#34Sputter source for semiconductor process chambers
#35Physical vapor deposition RF plasma shield deposit control
#36Sputter gun having variable magnetic strength
#37High metal ionization sputter gun
#38Method and Apparatus for Enhanced Film Uniformity
#39Arc evaporation source having fast film-forming speed, coating film manufacturing method and film formation apparatus using the arc evaporation source
#40Method for producing plasma flow, method for plasma processing, apparatus for producing plasma, and apparatus for plasma processing
#41Vacuum deposition apparatus
#42DUAL PLASMA SOURCE SYSTEMS AND METHODS FOR REACTIVE PLASMA DEPOSITION
#43SEPARATED TARGET APPARATUS FOR SPUTTERING AND SPUTTERING METHOD USING THE SAME
#44CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLASMA DEPOSITION AND RESPUTTERING UNIFORMITY
#45MAGNET ARRAY FOR A PHYSICAL VAPOR DEPOSITION SYSTEM
#46PHYSICAL VAPOR DEPOSITION SYSTEM
#47INTEGRATED DEPOSITION OF THIN FILM LAYERS IN CADMIUM TELLURIDE BASED PHOTOVOLTAIC MODULE MANUFACTURE
#48High density plasma etchback process for advanced metallization applications
#49FILM FORMING METHOD AND FILM FORMING APPARATUS
#50ROTARY MAGNETRON
#51CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLASMA DEPOSITION AND RESPUTTERING UNIFORMITY
#52Apparatus for Forming Electronic Material Layer
#53Substrate processing apparatus and apparatus and method of manufacturing magnetic device
#54Plasma processing apparatus, magnetoresistive device manufacturing apparatus, magnetic thin film forming method, and film formation control program
#55Arc plasma source
#56DEPOSITION SYSTEMS AND METHODS
#57Vacuum Treatment Apparatus, A Bias Power Supply And A Method Of Operating A Vacuum Treatment Apparatus
#58Drive end-block for a rotatable magnetron
#59LOW DAMAGE SPUTTERING SYSTEM AND METHOD
#60SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING
#61Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement
#62MULTI-CATHODE IONIZED PHYSICAL VAPOR DEPOSITION SYSTEM
#63MULTI-CATHODE IONIZED PHYSICAL VAPOR DEPOSITION SYSTEM
#64MULTI-CATHODE IONIZED PHYSICAL VAPOR DEPOSITION SYSTEM
#65METHOD OF SPUTTERING A HIGH-K DIELECTRIC MATERIAL
#66VERTICALLY MOUNTED ROTARY CATHODES IN SPUTTERING SYSTEM ON ELEVATED RAILS
#67Self-ionized and inductively-coupled plasma for sputtering and resputtering
#68Process for forming thin film and system for forming thin film
#69Coating Apparatus for the Coating of a Substrate and also Method for Coating
#70Sputter apparatus with a pipe cathode and method for operating this sputter apparatus
#71Back-biased face target sputtering based memory data sensing technique
#72Magnetic mirror plasma source and method using same
#73Back-biased face target sputtering based memory with low oxygen flow rate
#74Back-biased face target sputtering based liquid crystal display device
#75Back-biased face target sputtering
#76Back-biased face target sputtering based programmable logic device
#77Self-ionized and inductively-coupled plasma for sputtering and resputtering
#78Sputtering device for manufacturing thin films
#79Shields usable with an inductively coupled plasma reactor
#80Back-biased face target sputtering based memory
#81Magnet assemblies
#82Multi-cathode ionized physical vapor deposition system
#83Ion gauge condition detector and switching circuit
#84Cathode structure for vacuum sputtering machine
#85Back-biased face target sputtering
#86Sputtering apparatus
#87Self-ionized and inductively-coupled plasma for sputtering and resputtering