Multi-tap transmission line system and methods thereof

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

ULTRAHIGH ISOLATION STRIPLINE CIRCUIT

Impedance controlled electrical interconnection employing meta-materials

Waveguide structure comprising first and second waveguide sections connected to each other through a fixed connector

High-Frequency Line Structure, Subassembly, Line Card, and Method for Manufacturing Line Structure

High-frequency line structure with lead pin-connected substrates

Flux line filter

Low profile phased array

Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad

Signal processing device comprising a target apparatus coupled to a feeding apparatus by connection members providing capacitive and inductive impedances

Method and/or apparatus for frictionless wideband high-power radio-frequency power transmission across a freely moving interface

Interlocking modular beamformer

Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other

Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other

Impedance controlled electrical interconnection employing meta-materials

Additive manufacturing technology (AMT) low profile radiator

Low profile phased array

RF transition assembly comprising an open coaxial structure with a cavity for receiving a conductor that is coupled orthogonal to an RF transmission layer

Deployable radio frequency transmission line

Radio frequency interconnect systems and methods

Method of manufacturing a signal transition component having a C-shaped conducting frame

Transmission line cable

Fixing structure of cable to wiring substrate, and cable, and manufacturing method of cable

Waveguide device, communication module, method of producing waveguide device, and electronic device

3-D integrated package

Window antenna connector with impedance matching

Impedance controlled electrical interconnection employing meta-materials

Anti-lightning combined-stripline-circuit system

Hyperfrequency interconnection device

Fixing structure of cable to wiring substrate, and cable, and manufacturing method of cable

Flexible substrate having a microstrip line connected to a connection portion with a specified conductor pattern

Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system

Printed circuit board having DC blocking dielectric waveguide vias

Hybrid single aperture inclined antenna

Coaxial-to-stripline and stripline-to-stripline transitions including a shorted center via

3-D integrated package

Structural body and interconnect substrate

Coplaner waveguide transition

ELECTROMAGNETIC FIELD COUPLING STRUCTURE, MULTI-LAYER TRANSMISSION-LINE PLATE, METHOD OF MANUFACTURING ELECTROMAGNETIC FIELD COUPLING STRUCTURE, AND METHOD OF MANUFACTURING MULTI-LAYER TRANSMISSION-LINE PLATE

Misalignment tolerant contactless RF coupling device

Impedance controlled electrical interconnection employing meta-materials

Transmission device and method for manufacturing same, and wireless transmission device and wireless transmission method

High frequency wiring board comprised of interconnected first and second coplanar lines on different layers and having a ground pattern physically separated therefrom

Vertical transmission line structure that includes bump elements for flip-chip mounting

Multilayer microstripline transmission line transition

Connection device and optical device

Hybrid single aperture inclined antenna

High-frequency coupler and communication device

Interconnection device for electronic circuits, notably microwave electronic circuits

FLEXIBLE JOINT

High-Frequency Wiring Board and High-Frequency Module That Uses the High-Frequency Wiring Board

SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM

Vertical coupling structure for non-adjacent resonators

Compact filtering structure

Radio frequency multilayer substrate and manufacturing method of radio frequency multilayer substrate

Multilayer microstripline transmission line transition

Magnetic interconnection device

Dual-polarized antenna array

Vertical transmission line structure that includes bump elements for flip-chip mounting

Electromagnetic morphing apparatus for hot pluggable architected systems

Relay substrate and substrate assembly

Vertical coupling structure for non-adjacent resonators

Method of forming vertical coupling structure for non-adjacent resonators

High-frequency module including connection terminals arranged at a small pitch

Microstrip to Coplanar Waveguide Transition

Across-trench circuitry for high-speed signal transmission

High frequency module

Electrical transition for an RF component

Integrated circuit interconnects with coaxial conductors

Electrical interconnection for coaxial line to slab line structure including a bead ring

Slabline structure with rotationally offset ground

OPTIMIZATION OF THROUGH PLANE TRANSITIONS

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias

Multilayer interconnection board

Electrical system, especially a microelectronic or microelectromechanical high frequency system

Circuit board and method for producing a circuit board

Impedence matching along verticle path of microwave vias in multilayer packages

High frequency via with stripped semi-rigid cable

High-frequency circuit

Microwave circuit

Methods and apparatus for coupling first and second microwave modules

RF package

Transmission line having a transforming impedance

Low profile active electronically scanned antenna (AESA) for Ka-band radar systems

Signal path design for modulating impedance

Signal transmission structure

Method and apparatus for microwave interconnection

High-frequency signal transmitting device

Electrical interconnection for high-frequency devices

Multichip module

Distributed interconnect

Monolithically integrated microwave guide component for radio frequency overcoupling

High frequency circuit module

Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure

High frequency laminated component and its manufacturing method

Wide-band high speed communications channel for cryogenic applications