220588 ⎘
Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators; Details of surface acoustic wave devices; Characteristics of substrate, e.g. cutting angles of semiconductor substrates
Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
#2INTEGRATED DEVICE BASED ON THIRD-GENERATION SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF
#3ACOUSTIC WAVE DEVICE
#4ACOUSTIC WAVE DEVICE
#5ACOUSTIC WAVE DEVICE
#6Surface acoustic wave device and method for fabricating the same
#7Elastic wave device, high-frequency front-end circuit, and communication device
#8Resonator device
#9RESONANT DEVICE AND ACOUSTIC FILTER
#10ACOUSTIC WAVE DEVICE
#11Surface acoustic wave device and manufacturing method thereof
#12COUPLING SURFACE ACOUSTIC WAVE RESONATORS TO A JOSEPHSON RING MODULATOR
#13Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
#14ELECTRIC DEVICE WAFER
#15Guided acoustic wave device
#16High quality factor embedded resonator wafers
#17Guided SAW device
#18Generation and enhancement of surface acoustic waves on a highly doped p-type III-V semiconductor substrate
#19HYBRID STRUCTURE FOR A SURFACE ACOUSTIC WAVE DEVICE
#20Electronic component
#21Multiplexer, high frequency front-end circuit, and communication apparatus
#22Acoustic wave device, high-frequency front-end circuit, and communication apparatus
#23Isolation cavities in semiconductor devices
#24Radio-frequency isolation using backside cavities
#25Acoustic wave device, front-end circuit, and communication apparatus
#26Coupling surface acoustic wave resonators to a Josephson ring modulator
#27Elastic wave device, high-frequency front-end circuit, and communication device
#28Acoustic wave device and radio-frequency front-end circuit
#29Hybrid structure for a surface acoustic wave device
#30Elastic wave device, high-frequency front-end circuit, and communication apparatus
#31FORMING A MODIFIED LAYER WITHIN A RADIO FREQUENCY (RF) SUBSTRATE FOR FORMING A LAYER TRANSFERRED RF FILTER-ON-INSULATOR WAFER
#32Radio-frequency isolation cavities and cavity formation
#33Topside radio-frequency isolation cavity configuration
#34Thermal management in integrated circuit using phononic bandgap structure
#35Guided SAW device
#36Elastic wave device, high-frequency front-end circuit, and communication device
#37Guided acoustic wave device
#38Cavity formation in backside interface layer for radio-frequency isolation
#39Radio-frequency isolation using cavity formed in interface layer
#40Cavity formation using sacrificial material
#41Longitudinally coupled resonator-type surface acoustic wave filter
#42Bonded wafers and surface acoustic wave devices using same
#43Radio frequency isolation cavity formation using sacrificial material
#44Supporting substrate for composite substrate and composite substrate
#45Acoustic semiconductor device
#46Method of forming a surface acoustic wave (SAW) filter device
#47Surface acoustic wave element and manufacturing method thereof
#48Reconfigurable metasurfaces and x-band RF devices employing the acoustoelectric effect
#49Hybrid semiconductor-piezoacoustic radiofrequency device