Electronic component and manufacturing method thereof

Electrical component and production thereof

Wafer level packaging of materials with different coefficients of thermal expansion

Surface acoustic wave device package

Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device

Stack type surface acoustic wave package, and method for manufacturing the same

Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method

Method for manufacturing surface acoustic wave device

Surface acoustic wave filter and method of producing the same

Radio frequency module and fabrication method thereof

Piezoelectric device

Electronic device and method for fabricating the same

Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same

Integrated and monolithic package structure of acoustic wave device

Encapsulated electronic component and production method

Boundary acoustic wave device

Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device

Surface acoustic wave element

Electronic component device

Surface acoustic wave device package

Chip package mechanism

Method for making a surface acoustic wave device package

Sealed surface acoustic wave element package

Surface acoustic wave device and method for manufacturing the same

Surface acoustic wave device, surface acoustic wave apparatus, and communications equipment

Encapsulated component and method for the production thereof

Structure and method of forming capped chips

Surface acoustic wave device, surface acoustic wave apparatus, and communications equipment

Method for manufacturing surface acoustic wave device

Surface acoustic wave device, manufacturing method therefor, and communications equipment

Frequency adjustment method of surface acoustic wave device, surface acoustic wave device, and electronic device

Elastic wave apparatus

Method of manufacturing semiconductor device and method of manufacturing electronic device

Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same

Balanced output filter having specified package input and output ground metal patterns

Downsized package for electric wave device

Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same

Surface acoustic wave device

Module for radio-frequency applications

Mounting substrate and electronic component using the same

Surface acoustic wave device and electronic circuit device

Acoustic wave device and method of fabricating the same

Structure and method of making capped chips having vertical interconnects

Surface acoustic wave apparatus

Back-face and edge interconnects for lidded package

Structure and method of making capped chips using sacrificial layer

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Package assembly for electronic device

Surface acoustic wave device and method for manufacturing the same

Encapsulated component which is small in terms of height and method for producing the same

Surface acoustic wave element, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave element

Manufacture of mountable capped chips

Surface acoustic wave element, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave element

Compensation of second order temperature dependence of mechanical resonator frequency

Field effect control of a microelectromechanical (MEMS) resonator