Patents-Review.com
ClassID:

220672 ⎘

H03H9/1042 - CPC Classification

Classification description:

Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators; Details; Holders; Supports; Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a housing formed by a cavity in a resin

Recent Application in this class:
#1
20250300623
2025-09-25

PACKAGED MODULES HAVING FILTER FAN OUT SUBSTRATE

 #2
20240421796
2024-12-19

CRYSTAL RESONATOR DEVICE WITH THERMISTOR

 #3
20240322786
2024-09-26

Bulk Acoustic Wave (BAW) Microresonator Package

 #4
20240266240
2024-08-08

MODULE

 #5
20230344400
2023-10-26

Electronic device and formation method therefor

 #6
20230275561
2023-08-31

Chip packaging method and particle chips

 #7
20230246619
2023-08-03

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE

 #8
20230134299
2023-05-04

ACOUSTIC WAVE DEVICE

 #9
20230121885
2023-04-20

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

 #10
20220239276
2022-07-28

Chip packaging method and particle chips

 #11
20220131519
2022-04-28

Piezoelectric vibrating device

 #12
20220077232
2022-03-10

INTEGRATED STRUCTURE OF AND INTEGRATED METHOD FOR CRYSTAL RESONATOR AND CONTROL CIRCUIT

 #13
20220077231
2022-03-10

INTEGRATION STRUCTURE OF CRYSTAL OSCILIATOR AND CONTROL CIRCUIT AND INTEGRATION METHOD THEREFOR

 #14
20220069008
2022-03-03

INTEGRATING STRUCTURE FOR CRYSTAL RESONATOR AND CONTROL CIRCUIT, AND INTEGRATING METHOD THEREFOR

 #15
20210376816
2021-12-02

Package comprising stacked filters

 #16
20210028751
2021-01-28

Method for packaging an electronic component in a package with an organic back end

 #17
20200313648
2020-10-01

Single-Crystal Bulk Acoustic Wave Resonator and Method of Making Thereof

 #18
20200228090
2020-07-16

Acoustic wave device

 #19
20200127637
2020-04-23

3D-printed protective shell structures with support columns for stress sensitive circuits

 #20
20190379344
2019-12-12

FILM BULK ACOUSTIC WAVE RESONATORS AND FABRICATION METHODS THEREOF

 #21
20190333965
2019-10-31

GaN stack acoustic reflector and method for producing the same

 #22
20190246500
2019-08-08

Electronic package including cavity defined by resin and method of forming same

 #23
20190214964
2019-07-11

Acoustic device package and method of making

 #24
20190207582
2019-07-04

3D-printed protective shell structures for stress sensitive circuits

 #25
20190036510
2019-01-31

Elastic wave device and manufacturing method therefor

 #26
20180374641
2018-12-27

Ceramic electronic component and mount structure therefor

 #27
20180198436
2018-07-12

RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE

 #28
20180159499
2018-06-07

Electronic component with two substrates enclosing functional element and insulating film therein

 #29
20180062618
2018-03-01

Embedded RF filter package structure and method of manufacturing thereof

 #30
20170290160
2017-10-05

Electronic package including cavity defined by resin and method of forming same

 #31
20160322557
2016-11-03

Acoustic device package and method of making

 #32
20160156328
2016-06-02

High-frequency module

 #33
20160149557
2016-05-26

Elastic wave device with first and second support layers providing a hollow path

 #34
20160079957
2016-03-17

Surface acoustic wave device

 #35
20130106530
2013-05-02

Acoustic wave device

 #36
20120181898
2012-07-19

Acoustic wave device

 #37
20100289600
2010-11-18

Elastic wave device and method for manufacturing the same

 #38
20100019867
2010-01-28

Method of manufacturing a piezoelectric component