220673 ⎘
Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators; Details; Holders; Supports; Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD THEREOF AND FILTER
#25.5 GHz Wi-Fi 5G COEXISTENCE ACOUSTIC WAVE RESONATOR RF FILTER CIRCUIT
#3BULK ACOUSTIC WAVE (BAW) PACKAGE AND METHOD OF MANUFACTURING BAW PACKAGE
#4ACOUSTIC WAVE FILTER AND RADIO FREQUENCY MODULE
#5INDUCTOR INTEGRATED ACOUSTIC WAVE DEVICE
#6LOAD SENSOR AND METHOD FOR MANUFACTURING LOAD SENSOR
#7BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD THEREOF AND FILTER
#8STACKED DEVICE STRUCTURE WITH A BULK ACOUSTIC WAVE RESONATOR SUPPORTED BY A SURFACE ACOUSTIC WAVE DEVICE
#9ACOUSTIC WAVE DEVICE
#10BULK ACOUSTIC WAVE RESONATOR AND METHOD FOR MANUFACTURING THE SAME
#11RESONATOR, RESONATOR ASSEMBLY, FILTER, ELECTRONIC DEVICE, METHOD FOR FABRICATING RESONATOR AND PACKAGING STRUCTURE
#12TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
#13ACOUSTIC RESONATOR FILTER WITH HIGH THERMAL CONDUCTIVITY
#14ACOUSTIC WAVE DEVICE AND FILTER DEVICE
#15TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
#16ANTENNA FILTER AND ELECTRONIC DEVICE COMPRISING SAME IN WIRELESS COMMUNICATION SYSTEM
#17ACOUSTIC WAVE DEVICE
#18PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESONATOR
#19Resonator Device
#20ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE
#21METHODS OF PACKAGING ACOUSTIC WAVE RESONATOR DEVICES ON WAFERS AND RELATED WAFERS AND STRUCTURES
#22ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE
#23ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE
#24ACOUSTIC WAVE DEVICE
#25Bulk acoustic wave resonator and method for manufacturing the same
#26ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE
#27Bulk acoustic wave resonator and fabrication method thereof
#28BULK ACOUSTIC WAVE RESONATOR AND FABRICATION METHOD THEREOF
#29Electronic Device
#30METHODS OF FORMING GROUP III-NITRIDE SINGLE CRYSTAL PIEZOELECTRIC THIN FILMS USING ORDERED DEPOSITION AND STRESS NEUTRAL TEMPLATE LAYERS
#31MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
#32Methods of plasma dicing bulk acoustic wave components
#33Multiplexer including filter with two types of acoustic wave resonators
#34Vibrator device
#35METHOD AND STRUCTURE FOR HIGH PERFORMANCE RESONANCE CIRCUIT WITH SINGLE CRYSTAL PIEZOELECTRIC CAPACITOR DIELECTRIC MATERIAL
#36SUSPENDED COMPONENTS AND FUNCTIONAL FRAMES
#375.5 GHz Wi-Fi 5G COEXISTENCE ACOUSTIC WAVE RESONATOR RF FILTER CIRCUIT
#38PIEZOELECTRIC ACOUSTIC RESONATOR WITH DIELECTRIC PROTECTIVE LAYER MANUFACTURED WITH PIEZOELECTRIC THIN FILM TRANSFER PROCESS
#39Packaging structure and method of acoustic device
#40Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
#41PIEZOELECTRIC ACOUSTIC RESONATOR MANUFACTURED WITH PIEZOELECTRIC THIN FILM TRANSFER PROCESS
#42ACOUSTIC WAVE RESONATOR PACKAGE
#43Transversely-excited film bulk acoustic resonator package and method
#44RF acoustic wave resonators integrated with high electron mobility transistors including a shared piezoelectric/buffer layer
#45FBAR Filter with Trap Rich Layer
#46WIRELESS COMMUNICATION INFRASTRUCTURE SYSTEM CONFIGURED WITH A SINGLE CRYSTAL PIEZO RESONATOR AND FILTER STRUCTURE USING THIN FILM TRANSFER PROCESS
#47Resonator shapes for bulk acoustic wave (BAW) devices
#48Antenna filter and electronic device comprising same in wireless communication system
#49MULTI-LEVEL STACKED ACOUSTIC WAVE (AW) FILTER PACKAGES AND RELATED FABRICATION METHODS
#50ACOUSTIC RESONATOR PACKAGE
#51Bulk acoustic wave component with conductor extending laterally from via
#52RF BAW RESONATOR FILTER ARCHITECTURE FOR 6.5GHZ WI-FI 6E COEXISTENCE AND OTHER ULTRA-WIDEBAND APPLICATIONS
#53BULK ACOUSTIC RESONATOR PACKAGE
#54ACOUSTIC RESONATOR PACKAGE
#55Printing components to adhesive substrate posts
#56Bulk acoustic wave filter and manufacturing method thereof, communication device
#57RF BAW RESONATOR FILTER ARCHITECTURE FOR 6.5GHZ WI-FI 6E COEXISTENCE AND OTHER ULTRA-WIDEBAND APPLICATIONS
#58Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
#595.5 GHz Wi-Fi 5G coexistence acoustic wave resonator RF filter circuit
#60CAP SUBSTRATE FOR ACOUSTIC WAVE DEVICE
#61Method of manufacturing a cap substrate for acoustic wave device
#62PIEZOELECTRIC ACOUSTIC RESONATOR WITH IMPROVED TCF MANUFACTURED WITH PIEZOELECTRIC THIN FILM TRANSFER PROCESS
#635 and 6 GHz Wi-Fi coexistence acoustic wave resonator RF diplexer circuit
#64Method and structure for high performance resonance circuit with single crystal piezoelectric capacitor dielectric material
#65BULK-ACOUSTIC WAVE RESONATOR PACKAGE
#66DOPED CRYSTALLINE PIEZOELECTRIC RESONATOR FILMS AND METHODS OF FORMING DOPED SINGLE CRYSTALLINE PIEZOELECTRIC RESONATOR LAYERS ON SUBSTRATES VIA EPITAXY
#67Piezoelectric vibrator element, piezoelectric vibrator, oscillator, and method of manufacturing piezoelectric vibrator element
#68Acoustic resonator filter
#69RF BAW resonator filter architecture for 6.5GHz Wi-Fi 6E coexistence and other ultra-wideband applications
#70Film bulk acoustic resonator package with thin film sealing structure and manufacturing method therefor
#71Transversely-excited film bulk acoustic resonator package and method
#72Transversely-excited film bulk acoustic resonator package
#73Transversely-excited film bulk acoustic resonator package and method
#74Method of fabricating transversely-excited film bulk acoustic resonator
#75Filter assembly with two types of acoustic wave resonators
#76Acoustic wave device and fabrication method thereof
#77Packaged bulk acoustic wave resonator on acoustic wave device
#78Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process
#79Bulk acoustic wave resonator on surface acoustic wave device
#80Packaging method and packaging structure of FBAR
#81PACKAGING MODULE AND PACKAGING METHOD OF BAW RESONATOR
#82PIEZOELECTRIC ACOUSTIC RESONATOR MANUFACTURED WITH PIEZOELECTRIC THIN FILM TRANSFER PROCESS
#83Bulk acoustic wave resonator on multi-layer piezoelectric substrate acoustic wave device
#84Vibrator device
#85Bulk acoustic wave filter co-package
#86Method for forming multiple bulk acoustic wave filters on shared die
#87Bulk acoustic resonator and filter device
#88RF acoustic wave resonators integrated with high electron mobility transistors including a shared piezoelectric/buffer layer and methods of forming the same
#89Transversely-excited film bulk acoustic resonator package
#90Bulk acoustic wave filters on shared die
#91Transversely-excited film bulk acoustic resonator package
#92Transversely-excited film bulk acoustic resonator package
#93Transversely-excited film bulk acoustic resonator package
#94Transversely-excited film bulk acoustic resonator package and method
#95TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR
#96Resonator shapes for bulk acoustic wave (BAW) devices
#97Transversely-excited film bulk acoustic resonator package and method
#98Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
#99Piezoelectric acoustic resonator with improved TCF manufactured with piezoelectric thin film transfer process
#100Thin-film bulk acoustic resonator and semiconductor apparatus comprising the same
#101Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies
#1025.5 GHz Wi-Fi 5G coexistence acoustic wave resonator RF filter circuit
#103Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
#104WIRELESS COMMUNICATION INFRASTRUCTURE SYSTEM CONFIGURED WITH A SINGLE CRYSTAL PIEZO RESONATOR AND FILTER STRUCTURE USING THIN FILM TRANSFER PROCESS
#105FRONT END MODULE
#106CAVITY STRUCTURES
#107Thin-film type package
#108Bulk acoustic wave components
#109Methods of plasma dicing bulk acoustic wave components
#110WLP BAW device with oxide adhesion layer
#111WLP BAW device with through-WLP vias
#112Acoustic resonator package and method of fabricating the same
#113Multiplexer including filter with two types of acoustic wave resonators
#114Filter including two types of acoustic wave resonators
#115Acoustic wave filter including two types of resonators
#116Method and structure for high performance resonance circuit with single crystal piezoelectric capacitor dielectric material
#117Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
#118PIEZOELECTRIC VIBRATING PIECE AND PIEZOELECTRIC DEVICE
#119Front end module for 5.6 GHz Wi-Fi acoustic wave resonator RF filter circuit
#1205.2 GHz Wi-Fi coexistence acoustic wave resonator RF filter circuit
#121Fan-out electronic component package
#122Acoustic wave resonator and method for manufacturing the same
#123Filter including bulk acoustic wave resonator
#124Wafer-level-packaged BAW devices with surface mount connection structures
#125Bulk acoustic filter device and method of manufacturing the same
#126Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
#127Composite substrate, elastic wave device, and method for producing elastic wave device
#128Bulk acoustic wave filter
#129Elastic wave device, communication module apparatus, and method for manufacturing elastic wave device
#130Fluidic sensor device having UV-blocking cover
#131Covering for a component and method for producing a covering for a component
#132Manufacturing of thin-film bulk acoustic resonator and semiconductor apparatus comprising the same
#133Acoustic wave device and electronic component
#134CAP STRUCTURE FOR WAFER LEVEL PACKAGE
#135Acoustic wave device and method of manufacturing the same
#136Microacoustic component and method for the production thereof
#137Quartz vibrator having a dome-shaped cap
#138Acoustic wave device and method of fabricating the same
#139Protected resonator
#140Multi-band filter module and electronic device comprising the same
#141Method for manufacturing an electronic device
#142Electronic component and method for producing the electronic component
#143Method for housing an electronic component in a device package and an electronic component housed in the device package
#144Method of manufacturing a film bulk acoustic resonator with a loading element
#145PIEZOELECTRIC VIBRATING DEVICE AND METHOD FOR MANUFACTURING SAME
#146Crystal device
#147Protected resonator
#148Acoustic wave device
#149Method for manufacturing piezoelectric vibration device
#150Protected resonator
#151Surface mounted oven controlled type crystal oscillator
#152Electronic component device and method for manufacturing the same
#153Piezoelectric component and manufacturing method thereof
#154Elastic wave device and method for manufacturing the same
#155Acoustic wave device comprising an inter-digital transducer electrode
#156Protected resonator
#157Piezoelectric Resonator and Piezoelectric Filter Device
#158Bulk acoustic wave resonator, filter and duplexer and methods of making same
#159ELECTRONIC DEVICE
#160MULTI-BAND FILTER MODULE AND METHOD OF FABRICATING THE SAME
#161Method for housing an electronic component in a device package and an electronic component housed in the device package
#162Electrical component and production method
#163Film bulk acoustic resonator package and method for manufacturing the same
#164Wafer level package fabrication method
#165Functional device
#166Piezoelectric electronic component, process for producing the same, and communication apparatus
#167HBAR oscillator and method of manufacture
#168FILM BULK ACOUSTIC RESONATOR AND METHOD FOR MANUFACTURING
#169Multi-band filter module and method of fabricating the same
#170THIN FILM PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREOF
#171THIN FILM PIEZOELECTRIC RESONATOR AND METHOD OF MANUFACTURING SAME
#172Electronic device, method for producing the same, and communication apparatus including the same
#173Multi-band filter module and method of fabricating the same
#174Inductor integrated chip
#175Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device
#176Piezoelectric filter
#177Piezoelectric device
#178Film bulk acoustic resonator and method for manufacturing the same
#179Chip packages with covers
#180Film bulk acoustic resonator, filter circuit and method for manufacturing a film bulk acoustic resonator
#181Piezoelectric electronic component, and production method therefor, and communication equipment
#182Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
#183Electronic component having micro-electrical mechanical system
#184Midair semiconductor device and manufacturing method of the same
#185Piezoelectric device and manufacturing method thereof
#186Film bulk acoustic resonator package and method of fabricating same
#187Piezoelectric resonator and method for fabricating the same
#188Bulk acoustic wave resonator, filter and duplexer and methods of making same
#189Electronic component having micro-electrical mechanical system
#190Method for producing a protective cover for a device
#191Film bulk acoustic wave resonator device and manufacturing method thereof
#192Air-gap type FBAR, method for fabricating the same, and filter and duplexer using the same
#193Wafer-level package and its manufacturing method
#194Design of an insulated cavity
#195Method for producing a cover, method for producing a packaged device
#196Wafer level package for micro device
#197FBAR, FBAR based duplexer device and manufacturing method thereof
#198Method of manufacturing wafer level package type FBAR device