220674 ⎘
Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators; Details; Holders; Supports; Mounting in enclosures for microelectro-mechanical devices
MEMS Resonator
#2Microelectromechanical resonator
#3MEMS RESONATOR
#4Micro-Mechanical Resonator Having Out-of-Phase and Out-of-Plane Flexural Mode Resonator Portions
#5RESONANCE DEVICE
#6ELECTRONIC PACKAGE STRUCTURE
#7METAL RIBS IN ELECTROMECHANICAL DEVICES
#8RESONATOR AND RESONATOR DRIVE METHOD
#9Microelectromechanical resonator
#10MEMS RESONATOR AND MEMS RESONATOR PROCESSING METHOD
#11RESONANCE DEVICE AND METHOD FOR MANUFACTURING SAME
#12FUSED QUARTZ DUAL SHELL RESONATOR AND METHOD OF FABRICATION
#13Non-Lid-Bonded MEMS Resonator With Phosphorus Dopant
#14Micro-mechanical resonator having out-of-phase and out-of-plane flexural mode resonator portions
#15MEMS resonator
#16Metal ribs in electromechanical devices
#17MICROMECHANICAL RESONATOR WAFER ASSEMBLY AND METHOD OF FABRICATION THEREOF
#18Resonance device and manufacturing method
#19Methods and devices for microelectromechanical resonators
#20Resonator and resonance device
#21Electronic package structure
#22MEMS resonator
#23RESONANCE DEVICE, COLLECTIVE SUBSTRATE, AND RESONANCE DEVICE MANUFACTURING METHOD
#24Methods and devices for microelectromechanical resonators
#25Resonator and resonance device
#26Resonator and resonance device
#27METHOD OF MANUFACTURING COLLECTIVE SUBSTRATE AND COLLECTIVE SUBSTRATE
#28Microelectromechanical resonator
#29Resonator and resonance device including the same
#30RESONANCE DEVICE AND METHOD FOR MANUFACTURING SAME
#31Microelectromechanical resonator
#32RESONATOR AND RESONANCE DEVICE
#33Metal ribs in electromechanical devices
#34Resonance device
#35Semiconductor package structure and method of manufacturing the same
#36Resonator and resonance device including same
#37Resonator and resonance device including same
#38Resonance device
#39Resonance device and manufacturing method of resonance device
#40MEMS device having a connection portion formed of a eutectic alloy
#41Resonator and resonance device
#42Methods and devices for microelectromechanical resonators
#43Fused quartz dual shell resonator and method of fabrication
#44Resonance device and method for producing resonance device
#45Resonance device
#46Device packaging using a recyclable carrier substrate
#47Resonator and resonance device
#48Resonator and resonance device
#49Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer
#50Resonator and resonant device
#51Resonator and resonance device
#52RESONATOR AND RESONANT DEVICE
#53Resonator and device including the same
#54Microelectromechanical resonator
#55Method of forming an integrated resonator with a mass bias
#56Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer
#57Inferring ambient atmospheric temperature
#58Micromechanical resonator having reduced size
#59COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION
#60Component with a thin-layer covering and method for its production
#61Methods and devices for microelectromechanical resonators
#62Acoustic management in integrated circuit using phononic bandgap structure
#63Resonator and resonance device
#64Resonance device manufacturing method
#65Resonator and resonance device
#66Resonator and resonance device
#67Multi-function frequency control device
#68Inferring ambient atmospheric temperature
#69Resonance device and manufacturing method therefor
#70Resonator and resonator device
#71Resonator and resonance device
#72Resonator and resonance device
#73Resonator and resonance device
#74Resonator and resonation device
#75Electronic component and method of manufacturing the same
#76Sensing device including a MEMS sensor and an adjustable amplifier
#77Vibration transducer
#78MEMS device and method for producing same
#79Resonator
#80Resonator and resonance device
#81Resonator and resonance device
#82Resonator device
#83Resonator
#84Resonator and resonance device
#85Electronic component
#86Ceramic substrate, electronic component, and method of manufacturing ceramic substrate
#87Device packaging using a recyclable carrier substrate
#88Resonator
#89Piezoelectric vibrator and piezoelectric vibration device
#90Resonance device
#91Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer
#92Method for manufacturing electronic component module
#93Method of forming capacitive MEMS sensor devices
#94Method of forming an integrated resonator with a mass bias
#95Resonation element, resonator, oscillator, electronic device and moving object
#96Miniaturized multi-part component and method for producing same
#97Methods and devices for microelectromechanical resonators
#98Methods and devices for microelectromechanical pressure sensors
#99Multi-function frequency control device
#100Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer
#101Capacitive MEMS sensor devices
#102Electronic device and method for manufacturing electronic device
#103Method for manufacturing an electronic device
#104Electronic device and manufacturing method thereof
#105Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object
#106Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
#107Methods and apparatus for temperature control of devices and mechanical resonating structures
#108Electronic component module
#109Integrated resonator with a mass bias
#110Integration of piezoelectric materials with substrates
#111MEMS oscillator and manufacturing method thereof
#112Module and production method
#113Oscillator device and manufacturing process of the same
#114HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD
#115MEMS sensors with closed nodal anchors for operation in an in-plane contour mode
#116MEMS in-plane resonators
#117MEMS element, and manufacturing method of MEMS element
#118Method for packaging electronic devices and integrated circuits
#119Microelectromechanical resonator and a method for producing the same
#120MEMS device and oscillator
#121Resonator including a microelectromechanical system structure with first and second structures of silicon layers
#122Encapsulation, MEMS and method of selective encapsulation
#123Hybrid system having a non-MEMS device and a MEMS device
#124Hybrid system having a non-MEMS device and a MEMS device
#125MEMS package and method for the production thereof
#126Methods and apparatus for temperature control of devices and mechanical resonating structures
#127MEMS device and manufacturing method thereof
#128Silicon-based RF system and method of manufacturing the same
#129MEMS resonator and manufacturing method of the same
#130Method for packaging electronic devices and integrated circuits
#131FRAME AND METHOD OF MANUFACTURING ASSEMBLY
#132Vibrator, resonator using the same and electromechanical filter using the same
#133Micromechanical device and method of manufacturing micromechanical device
#134Wafer level device package with sealing line having electroconductive pattern and method of packaging the same
#135Vacuum packaged single crystal silicon device
#136Vacuum packaged single crystal silicon device
#137Electro mechanical device and manufacturing method thereof, and resonator and manufacturing method thereof
#138Functional device
#139MEMS resonator and manufacturing method of the same
#140Method for making an electromechanical component on a plane substrate
#141Wafer-level encapsulation and sealing of electrostatic transducers
#142Functional device-mounted module and a method for mounting functional device-mounted module
#143Structure and method of making sealed capped chips
#144Encapsulated electrical component and production method
#145Method and apparatus for frequency tuning of a micro-mechanical resonator
#146Structure and self-locating method of making capped chips
#147Structure and method of making capped chips having vertical interconnects
#148Manufacture of mountable capped chips
#149Back-face and edge interconnects for lidded package
#150Chip packages with covers
#151Vacuum packaged single crystal silicon device
#152Silicon-based RF system and method of manufacturing the same
#153Chip package mechanism
#154Structure and method of forming capped chips
#155Method for frequency tuning of a micro-mechanical resonator
#156Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device
#157Method and apparatus for frequency tuning of a micro-mechanical resonator
#158Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
#159Micromechanical electrostatic resonator
#160Method of manufacturing an electronic device
#161Structure and method of making capped chips having vertical interconnects
#162Back-face and edge interconnects for lidded package
#163Structure and method of making capped chips using sacrificial layer
#164Structure and self-locating method of making capped chips
#165Structure and method of making sealed capped chips
#166Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
#167Vacuum-cavity MEMS resonator
#168Manufacture of mountable capped chips
#169MEMS resonator with co-located temperature sensor
#170MEMS resonator
#171MEMS resonator with colocated temperature sensor