Printed circuits; Details; Thermal arrangements, e.g. for cooling, heating or preventing overheating Cooling of mounted components
Sub-classes:PICTURE GENERATING UNIT FOR A HEAD-UP DISPLAY
#2HALF-BRIDGE SWITCH ARRANGEMENT
#3Multicomponent Connector
#4POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FILM DIELECTRIC LAYERS
#5LIGHT LIQUID COOLED POWER ELECTRONIC UNIT
#6ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
#7FLEXIBLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
#8ELECTRIC RANGE
#9STACKED POWER DESIGN IN A CARD-BASED COMPUTING DEVICE
#10CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
#11CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS
#12ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE
#13Thermal-Control System Of A Mesh Network Device and Associated Mesh Network Devices
#14CIRCUIT BOARD MOUNTING SUPPORT
#15CIRCUIT CONNECTION DEVICE, ROTATING ELECTRIC MACHINE DEVICE, AND METHOD FOR MANUFACTURING CIRCUIT CONNECTION DEVICE
#16SYSTEM AND METHOD FOR MAINTAINING EFFICIENCY OF A HEAT SINK
#17CIRCUITRY PACKAGE FOR POWER APPLICATIONS
#18Cooling Module With Integrated Pump for Immersion Cooling in Electronics
#19ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE
#20CIRCUIT MODULE
#21ELECTRONIC DEVICE
#22CIRCUIT MODULE
#23HEAT DISSIPATION DESIGN FOR OPTICAL TRANSCEIVER
#24OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD
#25HEAT DISSIPATION ASSEMBLY AND ELECTRIC DEVICE THEREOF
#26CORROSION PREVENTIVE HEATSINK FOR NETWORK DEVICE
#27ELECTRICAL EQUIPMENT
#28PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY
#29EMBEDDED BUSBARS FOR LOAD SWITCHING
#30BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
#31WAVEGUIDE ANTENNA AND MOTOR VEHICLE
#32HEAT SINK FOR LIQUID COOLING
#33ELECTRONIC DEVICE
#34Substrate Structure and Terminal Device
#35CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
#36POWER MODULE AND APPARATUS
#37ELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING
#38CAPACITOR BOARD UNIT AND POWER CONVERSION DEVICE
#39INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY
#40SLOTTED ABSORBER
#41Lighting for underwater use
#42OPTICAL MODULE WITH INTEGRATED HEATSINKS
#43POWER ELECTRONIC SYSTEMS PACKAGED USING COMMON HEAT SINK AND ENCLOSURE
#44ELECTRONIC ASSEMBLY, METHOD FOR MANUFACTURING ELECTRONIC ASSEMBLY AND COMPOSITE THERMALLY CONDUCTIVE SHEET
#45Thermal Mitigation for An Electronic Speaker Device and Associated Apparatuses and Methods
#46ELECTRONIC CONTROL MODULE COOLING SYSTEM
#47Thermal Interface for Electronic Control Unit
#48METHODS FOR THE ACYLATION OF MAYTANSINOL
#49COMPUTER HOUSING
#50Cooling Module With Integrated Pump for Immersion Cooling in Electronics
#51ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE
#52CIRCUIT MODULE
#53CIRCUIT MODULE
#54POINT OF LOAD MODULE AND HEATSINK THEREFOR
#55HEAT DISSIPATION DESIGN FOR OPTICAL TRANSCEIVER
#56OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD
#57HEATSINK BASED POWER DELIVERY FOR CPUS
#58Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies
#59Thermal management system including an overmolded layer and a conductive layer over a circuit board
#60HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
#61Circuit board assembly and electronic device
#62OPTICAL TRANSCEIVER INCLUDING HEAT DISSIPATION COMPONENTS THERMALLY COUPLED TO OPPOSITE SIDES OF HOUSING
#63PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
#64DRIVE AND CONTROL INTEGRATED BOARD, CONTROL SYSTEM, AND ROBOT
#65ELECTRONIC ASSEMBLY HAVING BOTH CHASSIS AND MODULE DUAL-FLOW CONNECTORS AND ASSOCIATED METHODS
#66APPARATUS AND POWER MODULE
#67HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE
#68Hardened optical platform including high-power electro-optics and heat dissipating circuitry and associated thermal solution
#69Circuit mounting assemblies
#70ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS
#71INLET HEAT SINK FOR A COOLING SYSTEM OF A SUPERCOMPUTER ELECTRONIC BOARD
#72ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS
#73IMMERSION COOLING ELECTRONIC DEVICES
#74VEHICLE-MOUNTABLE DEVICE AND VEHICLE
#75Computer housing
#76SEMICONDUCTOR STORAGE DEVICE
#77ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING
#78PRINTED CIRCUIT BOARD ASSEMBLY
#79COOLING MODULE FOR A CIRCUIT MODULE HAVING A PLURALITY OF CHIPSETS
#80HYBRID HEAT SPREADING AND HEATING OF A COMPUTING SYSTEM IN AN AUTONOMOUS VEHICLE
#81CIRCUIT BOARD ASSEMBLY WITH INTEGRATED AIRFLOW PATH
#82Dynamic control of heat sink pressure
#83External Charger for an Implantable Medical Device Having a Thermal Diffuser
#84Modular power electronics converters with enhanced connectivity reliability and simplified method of fabrication
#85COOLING SYSTEM AND METHODS
#86COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
#87CIRCUIT BOARD STRUCTURES FOR COMPONENT PROTECTION
#88HEAT SINK AND ELECTRONIC DEVICE HAVING THE HEAT SINK
#89STRUCTURE OF MEMORY MODULE AND MODIFICATION METHOD OF MEMORY MODULE
#90NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION
#91ELECTRONIC ASSEMBLY AND METHOD FOR THERMAL BALANCING OF SURFACEMOUNT DEVICES
#92Thermal module for a circuit board
#93Cryostat suspended sample board
#94AUTONOMOUS VEHICLE COMPUTING DEVICE WITH BARRIER LAYER
#95Mass Spectrometer
#96Wearable Electronic Device with Thermal Energy Dissipation System and Corresponding Methods
#97POWER MODULE
#98COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTRONIC COMPONENTS
#99AIR DIRECTING SCOOP FOR HEAT SINK AND UV-C APPARATUS
#100CONTROL BOARD, ELECTRONIC EQUIPMENT, AND IMAGE FORMING APPARATUS
#101Wireless charging assembly
#102PRINTED CIRCUIT BOARD AND METHOD FOR DESIGNING THE SAME
#103Lighting module
#104ANTENNA MODULE
#105VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE
#106BATTERY MODULE AND VEHICLE INCLUDING THE SAME
#107BACK-TO-BACK SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS
#108PRINTED CIRCUIT BOARD ASSEMBLY WITH INTEGRATED VAPOR CHAMBER
#109SYSTEM AND METHOD FOR FAN-LESS THERMAL MITIGATION FOR INDUSTRIAL-GRADE APPLIANCES
#110PCB for heatsink based power delivery
#111SWITCHING POWER SUPPLY INCLUDING HEAT SINK
#112Heatsink based power delivery for CPUs
#113Three Dimensional Circuit Mounting Structures
#114System and method for maintaining efficiency of a heat sink
#115Flexible display module and manufacturing method thereof
#116Substrate for mounting electronic element, electronic device, and electronic module
#117Access Point Device
#118DETACHABLE HEAT SINK
#119Electronic Device Having Floating Support Structure
#120AEROSOL GENERATING DEVICE HAVING HEATER
#121PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE COMPRISING SAME
#122CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
#123AIRFLOW IN A CARD-BASED COMPUTING DEVICE
#124HEAT MANAGEMENT IN WIRELESS ELECTRONIC DEVICES
#125Structural and thermal management of an integrated circuit
#126Aerosol generating device and heater assembly for aerosol generating device
#127COOLING APPARATUS AND ELECTRONIC DEVICE
#128Induced air convection cooling for computing or networking devices
#129MULTI-FUNCTION COVER FOR PRINTED CIRCUIT BOARD ASSEMBLY
#130Desktop electronic device
#131ELECTRONIC CONTROL MODULE
#132Sensor Node Thermal Management and Illumination
#133COOLING SYSTEMS FOR A CIRCUIT BOARD
#134Heating or cooling apparatus-integrated heat sink for a computing device
#135LIQUID SUBMERSION COOLED ELECTRONIC DEVICE WITH CLAMSHELL ENCLOSURE
#136Power system
#137Power module and power device
#138NODE AND ELECTRONIC DEVICE
#139LIGHT BOARD, METHOD FOR MANUFACTURING THE SAME, AND LED BACKLIGHT MODULE AND LED BACKLIGHT DEVICE
#140LOCALIZED IMMERSION COOLING ENCLOSURE WITH THERMAL EFFICIENCY FEATURES
#141Techniques to control system updates and configuration changes via the cloud
#142Lithium-Ion Battery Management System (BMS) Having Compact Heat Sinking Arrangement, Lithium-Ion Battery Having BMS With Compact Heat Sinking Arrangement, and Method of Making BMS With Compact Heat Sinking Arrangement
#143Heat dissipation structure, manufacturing method for heat dissipation structure, and electronic apparatus
#144DISPLAY DEVICE WITH SLIM CONTROL ASSEMBLY
#145Thermal bridge for an electrical component
#146ELECTRONIC DEVICE
#147Point of load module and heatsink therefor
#148Heat dissipation device and graphics card assembly
#149Cooling module and a method of assembling the cooling module to an electronic circuit module
#150Micro device with adaptable thermal management device
#151Millimeter wave antenna array
#152Vapor Chamber and Manufacturing Method Thereof, Middle Frame Assembly and Manufacturing Method Thereof, and Electronic Device
#153Image pickup apparatus
#154RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
#155ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE
#156Method Of Manufacturing An Augmented LED Array Assembly
#157ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL
#158VEHICLE, A MAIN FRAME, A MODULE POCKET, AN ELECTRONIC MODULE, AND A PRINTED CIRCUIT BOARD
#159Processor heat dissipation in a stacked PCB configuration
#160Stacked image sensor
#161Carrier device for a thermal pad of an information handling system
#162Thermal-control system of a mesh network device and associated mesh network devices
#163STACKED SSD SEMICONDUCTOR DEVICE
#164CELL BALANCING MODULE
#165Mechanical device for cooling an electronic component
#166MULTILAYER CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED MULTILAYER BOARD
#167Circuit board with heat dissipation structure and method for manufacturing same
#168Heatsinks comprising a phase change material
#169Technologies for switching network traffic in a data center
#170DRIVING PART OF WARM AIR HEATER AND WARM AIR HEATER
#171Pressurizing Device and Electronic Device Including Pressurizing Device
#172Computer housing
#173ELECTRONIC DEVICE
#174SURFACE-MOUNTED HEAT SINK AND POWER MODULE USING SAME
#175Heat-rejecting media for use in dual-printed circuit board device
#176SOCKET CONNECTOR ASSEMBLY HAVING A HEAT SINK AND A RETENTION MEMBER ENGAGING THE HEAT SINK
#177Electronically Insulating Thermal Connector having a Low Thermal Resistivity
#178HEATSINKS FOR MULTIPLE COMPONENTS
#179Cooling plate with coaxial fluid port
#180Electronic module, method for producing an electronic module, and industrial plant
#181Electronic Device
#182High Frequency And High Power Thin Film Component
#183DAMPER SYSTEM FOR A LIDLESS INTEGRATED CIRCUIT
#184Connecting Electrical Circuitry in a Quantum Computing System
#185Board structure, electronic apparatus, and method of manufacturing board structure
#186OPTICAL ENGINE MODULE
#187Antenna Assembly For A Vehicle
#188Thermal interface material detection through compression
#189HEAT MITIGATION FOR REARVIEW ASSEMBLY
#190Memory cooler
#191Stable Power Modules By Thermoelectric Cooling
#192CIRCUIT BOARD AND PREPARATION METHOD THEREFOR
#193Device Component Assembly And Manufacturing Method Thereof
#194Metal ceramic substrate and method for manufacturing such metal ceramic substrate
#195Heatsink installation
#196Memory system
#197HEAT DISSIPATION DEVICE FOR ELECTRONIC ELEMENT
#198Processor module retention
#199CIRCUIT BOARD MODULE
#200Stacking system
#201Liquid cooling device and electronic device
#202TOP SIDE FRAME STIFFENER STRUCTURE FOR A PRINTED CIRCUIT BOARD (PCB) STACK
#203Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the Same
#204ACTIVE COOLING STORAGE DEVICE
#205Heat sink for liquid cooling
#206Heat dissipation structure with stacked thermal interface materials
#207Shielding housing structure of electric connector with features for heat ventilation and electromagnetic shielding
#208ELECTRONIC MODULE COMPRISING A PULSATING HEAT PIPE
#209Thermal management of circuit boards
#210Method for Forming Silicon Carbide Module Integrated Structure
#211Heat spreader with integrated fins
#212OPTICAL TRANSCEIVER WITH HOUSING PRESSING THERMAL INTERFACE MATERIAL BY UNEVEN SURFACE
#213Circuit structure
#214HOME APPLIANCE AND HEAT SINK INSTALLED THEREIN
#215Control and power module for brushless motor
#216Using a thermoelectric component to improve memory sub-system performance
#217ELECTRIC RANGE
#218ELECTRIC RANGE
#219VEHICLE BATTERY CHARGING APPARATUS
#220Electronic device
#221Autonomous vehicle computing device with barrier layer
#222Chip-on-chip power devices embedded in PCB and cooling systems incorporating the same
#223Power allocation to heat a processing chip of a network device
#224INTERPOSER ASSEMBLY AND ELECTRONIC COMPONENT
#225COOLING ASSEMBLY AND AN ELECTRONIC CIRCUIT MODULE HAVING THE SAME
#226HOOK AND LOOP ATTACHMENT FOR RADIATION SHIELD AND HEAT SINK
#227IGNITION COIL DEVICE FOR INTERNAL COMBUSTION ENGINE
#228DEVICE FOR DRIVING A COMPRESSOR AND PROCESSES FOR MOUNTING THE DEVICE
#229Electronic device including heat dissipation structure
#230Technologies for dynamically managing resources in disaggregated accelerators
#231Cavity Resonance Suppression Using Discrete Thermal Pedestals in Active Electronically Scanned Array
#232Cavity resonance suppression using thermal pedestal arrangements in active electronically scanned array
#233Lidar
#234Cooling system for an electronic circuit module
#235ELECTRICAL DEVICE AND METHOD FOR PRODUCING A FIRST AND SECOND ELECTRICAL DEVICE FROM A KIT
#236Optical transceiver with reduced lane utilization
#237METHOD FOR FABRICATING ASSEMBLE SUBSTRATE
#238ELECTRONIC ELEMENT, CIRCUIT BOARD WITH ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
#239Semiconductor storage device and heat dissipator
#240ELECTRONIC DEVICE INCLUDING BATTERY
#241THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS
#242Heatsink with perpendicular vapor chamber
#243System and method for maintaining efficiency of a heat sink
#244Active cooling devices for cooling an electronic assembly downstream of a computing system
#245Circuit board
#246ELECTRONIC COMPONENT WITH ENCLOSURE FRAME, CIRCUIT BOARD WITH ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
#247Control cabinet and associated insertable control device
#248FLOW GUIDING DEVICE
#249CIRCUIT BOARD ASSEMBLY
#250Cooling packages for heterogenous chips
#251Biometric sensor and device including the same
#252Solid state drive apparatus and data storage apparatus including the same
#253Thermally conductive microtubes for evenly distributing heat flux on a cooling system
#254Flexible display module and manufacturing method thereof
#255Circuit structure
#256HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY
#257ACTIVE THERMAL DISSIPATING SYSTEM
#258Localized immersion cooling enclosure with thermal efficiency features
#259EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
#260Distributing heatsink load across a processor module with separable input/output (I/O) connectors
#261FAN ON PRINTED CIRCUIT BOARD
#262Cooling device and method of manufacturing the same
#263Stable PCB for solid state light source application
#264LOCKING TENSIONER COOLING ASSEMBLY FOR PLUGGABLE ELECTRONIC COMPONENT
#265ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
#266THERMAL CONTROL OF MEMS MIRRORS TO LIMIT RESONANT FREQUENCY SHIFT
#267Automobile electronic system
#268Printed circuit board
#269Circuit board and a driving power supply with the circuit board thereof
#270Multisided heat spreader
#271Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an Antenna
#272Electronic device
#273Liquid cooling enclosure for circuit components
#274Electrical device having heat dissipation structure using filler and manufacturing method of the same
#275Circuit board having a cooling area above and below a semiconductor chip
#276Circuit board, method for manufacturing circuit board, and electronic device
#277Heating System Component for Sensing a First and Second Temperature
#278Solid state drive device and computer server system including the same
#279Method for manufacturing circuit board
#280Power substrate and high-voltage module equipped with same
#281Power module
#282Illumination assembly including thermal energy management
#283INSULATING CIRCUIT BOARD
#284ELECTRONIC DEVICE
#285Desktop electronic device
#286Computer housing
#287HEAT EXCHANGE METHOD USING FLUORINATED COMPOUNDS HAVING A LOW GWP
#288Aerosol generating device having heater
#289Temperature equalizing vehicle-mountable device
#290Separating temperature domains in cooled systems
#291Three-dimensional molded circuit component
#292Parallel printed circuit board assembly
#293NOVEL HEAT PIPE CONFIGURATIONS
#294Circuit board and method for manufacturing circuit board
#295Controller with fan monitoring and control
#296Optical transceiver
#297COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE
#298Heat management in wireless electronic devices
#299Liquid cooling heat exchange apparatus for memory modules
#300Laser light source co-packaged with photonic integrated circuit and substrate